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    • 2. 发明授权
    • Method for determining the thickness of a multi-thin-layer structure
    • 确定多层结构厚度的方法
    • US06744521B1
    • 2004-06-01
    • US09831842
    • 2001-08-21
    • Rolf HertlingWolfgang SchaudigWilbert Windeln
    • Rolf HertlingWolfgang SchaudigWilbert Windeln
    • G01B902
    • G01B11/0625
    • According to the inventive method for determining the thickness of at least one layer provided on a substrate, the measurement can be constructed simply and reliably and a reliable measuring result can be obtained by measuring reflection—and/or transmission light intensity values of zero order in dependence on the wavelength and calculating said reflection—and/or transmission light intensity values using an iteration model which is dependent on the individual layer parameters. The layer parameters are altered in order to introduce a consistency between the measured values and the calculated values and the substrates have geometrical structures whose geometrical dimensions are used as further parameters of the iteration model. The inventive method also provides a means of determining the geometry of structures in the substrate, for example the depth, width and the repetition interval of grooves in a blank for geometrical storage media, such as CDs.
    • 根据用于确定设置在基板上的至少一层的厚度的本发明的方法,可以简单且可靠地构造测量,并且可以通过测量零级的反射和/或透射光强度值来获得可靠的测量结果 依赖于波长并使用依赖于各个层参数的迭代模型来计算所述反射和/或透射光强度值。 改变层参数以便在测量值和计算值之间引入一致性,并且衬底具有几何结构,其几何尺寸用作迭代模型的进一步参数。 本发明的方法还提供了确定衬底中的结构的几何形状的方法,例如用于几何存储介质(例如CD)的坯料中的凹槽的深度,宽度和重复间隔。