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1. 发明授权

US09836098B2 Method and system for attachment of a heat sink to a circuit board 有权
公开(公告)号：US09836098B2
公开(公告)日：2017-12-05
申请号：US15205319
申请日：2016-07-08
申请人： Western Digital Technologies, Inc.
发明人： Kevin M. Takeuchi , Robert G. Fairchild
IPC分类号： G06F1/20 , F16B5/02 , F16B35/06 , H05K7/20
CPC分类号： G06F1/20 , F16B5/0233 , F16B35/06 , H05K1/021 , H05K7/20172 , H05K7/20409 , H05K2201/066 , Y10T29/49117
摘要： A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.

2. 发明授权

US09573306B2 Injection molding part with “zero draft” design and manufacturing methodologies 有权
标题翻译：注塑件具有“零吃”设计和制造方法
公开(公告)号：US09573306B2
公开(公告)日：2017-02-21
申请号：US14246750
申请日：2014-04-07
申请人： Western Digital Technologies, Inc.
发明人： Wojciech Szeremeta , Robert G. Fairchild , Brian S. Nihei
IPC分类号： B29C45/76 , B29C45/00 , B29C33/38
CPC分类号： B29C45/7693 , B29C33/3835 , B29C45/0025 , B29C2945/76103 , B29C2945/76588
摘要： A method may comprise generating a first electronic model of a workpiece to be manufactured using an injection-molding process. The first electronic model may then be analyzed and the workpiece in the first electronic model may then be selectively distorted according to the analysis. A second electronic model of the distorted workpiece may then be generated. The workpiece may then be injection-molded within a mold generated using the second electronic model. Thereafter, the workpiece may be cooled such that the injection-molded workpiece gradually assumes the shape or substantially the shape of the workpiece in the first electronic model.
摘要翻译：一种方法可以包括使用注射成型工艺生成待制造的工件的第一电子模型。然后可以分析第一电子模型，然后根据分析，第一电子模型中的工件可以被选择性地变形。然后可以产生失真工件的第二电子模型。然后可以在使用第二电子模型产生的模具内注塑模制工件。此后，可以将工件冷却，使得注射成型的工件在第一电子模型中逐渐呈现工件的形状或基本上的形状。

3. 发明授权

US09247656B2 Latch system 有权
标题翻译：锁系统
公开(公告)号：US09247656B2
公开(公告)日：2016-01-26
申请号：US14081877
申请日：2013-11-15
申请人： Western Digital Technologies, Inc.
发明人： Robert G. Fairchild
IPC分类号： H05K5/00 , H05K5/02 , G06F1/16
CPC分类号： H05K5/0013 , G06F1/1626 , H05K5/0221 , Y10T403/608
摘要： A deflection or snap fit type latch system can resist separation in at least three axes. The snap fit type latch system can include a first member and a second member that when engaged are configured to form a snap fit connection, at least one of the members comprising a deflecting arm. A tee feature on the first member can include a stem and a head. A slot on the second member can slidingly receive the stem of the tee feature as the first and second members engage such that the second member is sandwiched between the first member and the head of the tee feature. The snap fit connection can resist separation in a first axis and the combined tee feature and slot resist separation in two additional axes. The snap fit type latch system can be part of an enclosure, such as a storage device.
摘要翻译：偏转或卡扣式锁定系统可以抵抗至少三个轴线的分离。卡扣式闩锁系统可以包括第一构件和第二构件，当接合时，第一构件和第二构件构造成形成卡扣配合连接，至少一个构件包括偏转臂。第一个成员上的发球台功能可以包括杆和头。当第一和第二构件接合时，第二构件上的狭槽可以滑动地接纳三通特征的杆，使得第二构件夹在第一构件和发球台特征的头部之间。卡扣配合连接可以抵抗第一轴中的分离，并且可以在两个附加轴中抵抗组合的三通特征和槽抗蚀剂分离。卡扣式闩锁系统可以是诸如存储装置的外壳的一部分。

4. 发明授权

US10120351B1 Method and apparatus for cooling components in an electronic device 有权
公开(公告)号：US10120351B1
公开(公告)日：2018-11-06
申请号：US13957814
申请日：2013-08-02
申请人： Western Digital Technologies, Inc.
发明人： Zachary P. Hills , Jeffrey F. Boigenzahn , Robert G. Fairchild
IPC分类号： G05B15/02
摘要： An electronic device including electromechanical components, a cooling unit configured for heat removal for the electromechanical components, and a controller. The controller is configured to determine a system state of each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein the temperature data for each of the electromechanical components is sampled at a sample rate corresponding to each of the electromechanical components, determine a system state of the electronic device based on the system states of the electromechanical components, and control an operation of the cooling unit based on the system state of the electronic device.

5. 发明授权

US09411384B2 Method and system for attachment of a heat sink to a circuit board 有权
标题翻译：用于将散热器附接到电路板的方法和系统
公开(公告)号：US09411384B2
公开(公告)日：2016-08-09
申请号：US13943530
申请日：2013-07-16
申请人： Western Digital Technologies, Inc.
发明人： Kevin M. Takeuchi , Robert G. Fairchild
IPC分类号： H05K7/00 , G06F1/20 , F16B5/02 , F16B35/06
CPC分类号： G06F1/20 , F16B5/0233 , F16B35/06 , H05K1/021 , H05K7/20172 , H05K7/20409 , H05K2201/066 , Y10T29/49117
摘要： A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.
摘要翻译：一种计算机系统，包括包括周边部分和中间部分的散热器，电路板，被配置为固定到电路板的第一控制器，被配置为将散热器固定到外围电路板的一个或多个附接装置散热器的一部分，以及支座部件。支架部件包括构造成将支架部件固定到电路板的第一螺纹部分，以及配置成将支架部件固定到散热器中部处的散热器的第二螺纹部分。一个或多个附接装置和支架部件构造成将散热器固定到电路板并且允许散热器与第一控制器热接触。

6. 发明授权

US09886983B1 Storage drive with collapsible support 有权
公开(公告)号：US09886983B1
公开(公告)日：2018-02-06
申请号：US14752701
申请日：2015-06-26
申请人： Western Digital Technologies, Inc.
发明人： Robert G. Fairchild
IPC分类号： G11B33/08 , G11B33/02 , G11B25/04 , G11B33/12
CPC分类号： G11B33/08 , G11B25/043 , G11B33/025 , G11B33/124
摘要： A storage device includes a data drive and an enclosure. Shock absorber mounting holes on the enclosure can receive shock absorbers to connect to the data drive. In this way the data drive can be suspended from the enclosure. The enclosure can also have one or more protrusion. The one or more protrusion can be located such that when the data drive is placed thereon and each shock absorber is placed within a respective shock absorber mounting hole, each shock absorber is aligned with a mounting hole on the data drive. This can allow securement of the respective shock absorber to the respective data drive mounting hole to suspend the data drive. When the data drive is assembled within the enclosure, the one or more protrusion is sized such that an impact on the one or more protrusion by the data drive will destroy the one or more protrusion.

7. 发明授权

US09754615B1 Manufacturing method for assembling storage drives 有权
公开(公告)号：US09754615B1
公开(公告)日：2017-09-05
申请号：US14698647
申请日：2015-04-28
申请人： Western Digital Technologies, Inc.
发明人： Robert G. Fairchild , Steven T. Peng
IPC分类号： G11B5/127 , H04R31/00 , G11B5/48 , H05K13/00 , G11B33/14 , G11B33/12 , G11B33/02 , G11B19/20
CPC分类号： G11B5/4806 , G11B19/2036 , G11B33/022 , G11B33/121 , G11B33/126 , G11B33/1486 , H05K13/0015
摘要： Systems and manufacturing methods are disclosed herein that can beneficially reduce manufacturing cost while providing size efficient enclosures to house hard drives or other types of storage drives. An enclosure system can be used for separately housing one of two storage devices having different thicknesses. A first portion can be interchangeable with both storage devices. Second and third portions can each have a thickness to size efficiently accommodate the thickness of one storage device. Each of the second and third portions has an engagement surface to engage the first portion forming an enclosure. Either the first portion, or both second and third portions can comprise an opening or a shock mounting element. When the opening or the shock mounting element are on both the second and third portions, the opening or the shock mounting element is collectively identically spaced from the engagement surface on both the second and third portions.

8. 发明授权

US09025276B1 Space efficient enclosures for different sized drives 有权
标题翻译：适用于不同尺寸驱动器的空间高效机箱
公开(公告)号：US09025276B1
公开(公告)日：2015-05-05
申请号：US14314794
申请日：2014-06-25
申请人： Western Digital Technologies, Inc.
发明人： Robert G. Fairchild , Steven T. Peng
IPC分类号： G11B33/14 , G11B33/02 , G11B33/12
CPC分类号： G11B5/4806 , G11B19/2036 , G11B33/022 , G11B33/121 , G11B33/126 , G11B33/1486 , H05K13/0015
摘要： Systems and manufacturing methods are disclosed herein that can beneficially reduce manufacturing cost while providing size efficient enclosures to house hard drives or other types of storage drives. An enclosure system can be used for separately housing one of two storage devices having different thicknesses. A first portion can be interchangeable with both storage devices. Second and third portions can each have a thickness to size efficiently accommodate the thickness of one storage device. Each of the second and third portions has an engagement surface to engage the first portion forming an enclosure. Either the first portion, or both second and third portions can comprise an opening or a shock mounting element. When the opening or the shock mounting element are on both the second and third portions, the opening or the shock mounting element is collectively identically spaced from the engagement surface on both the second and third portions.
摘要翻译：本文公开的系统和制造方法可以有益地降低制造成本，同时提供尺寸有效的外壳以容纳硬盘驱动器或其他类型的存储驱动器。可以使用外壳系统来单独地容纳具有不同厚度的两个存储装置中的一个。第一部分可以与两个存储装置互换。第二和第三部分各自可以具有有效地容纳一个存储装置的厚度的厚度。第二和第三部分中的每一个具有接合表面以接合形成外壳的第一部分。第一部分或第二和第三部分中的任一个可以包括开口或冲击安装元件。当开口或冲击安装元件在第二和第三部分上时，开口或冲击安装元件与第二和第三部分上的接合表面相同地间隔开。

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