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1. 发明授权

US09257138B1 Slider assembly and method of manufacturing same 有权
标题翻译：滑块组装及其制造方法
公开(公告)号：US09257138B1
公开(公告)日：2016-02-09
申请号：US14526207
申请日：2014-10-28
申请人： Western Digital (Fremont), LLC
发明人： Bin Ouyang , Chee Kheng Lim
IPC分类号： G11B5/48 , G11B5/00
CPC分类号： G11B5/4826 , G11B5/6088 , G11B2005/0021 , H05K3/3452 , H05K2203/0415 , H05K2203/0465
摘要： A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and a support structure mounted to the second surface of the substrate and in contact with the carrier. A method of bonding a chip and carrier assembly to a substrate includes contacting the chip and carrier assembly with the bond material and applying heat and force on the chip and carrier assembly until the support structure is mounted on the second surface of the substrate and in contact with the carrier. A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and one of the carrier or the substrate comprising a trench having a periphery, wherein the second surface of the substrate supports the carrier along the periphery of the trench.
摘要翻译：衬底组件包括与载体耦合的芯片，具有第一表面和相对的第二表面的衬底以及安装到衬底的第二表面并与载体接触的支撑结构。将芯片和载体组件粘合到基底上的方法包括使芯片和载体组件与粘合材料接触并在芯片和载体组件上施加热量和力，直到支撑结构安装在基底的第二表面上并且接触与承运人。衬底组件包括与载体耦合的芯片，具有第一表面和相对的第二表面的衬底，并且载体或衬底中的一个包括具有周边的沟槽，其中衬底的第二表面沿着衬底支撑载体沟槽的周边。

2. 发明授权

US09685187B1 Bonding tool and method for high accuracy chip-to-chip bonding 有权
公开(公告)号：US09685187B1
公开(公告)日：2017-06-20
申请号：US14498664
申请日：2014-09-26
申请人： Western Digital (Fremont), LLC
发明人： Bin Ouyang , Chee Kheng Lim
IPC分类号： B25J15/06 , H01L23/48 , H01L23/52 , H01L29/40 , G11B5/84 , B32B37/14 , B32B38/00 , B32B38/10
CPC分类号： G11B5/84 , B32B37/14 , B32B38/0008 , B32B38/0012 , B32B38/10 , B32B38/1841 , B32B2038/0016 , B32B2038/002 , B32B2307/208 , B32B2310/0418 , B32B2310/0463 , B32B2310/14 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/29026 , H01L2224/291 , H01L2224/32104 , H01L2224/32145 , H01L2224/75251 , H01L2224/75252 , H01L2224/75704 , H01L2224/75705 , H01L2224/75744 , H01L2224/75745 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83805 , H01L2924/01322 , H01L2924/00012
摘要： A chip-to-chip eutectic bonding system includes a stage with a top surface, a bottom surface, and a plurality of vacuum apertures extending therebetween and a carrier with a top surface, the top surface including one or more smooth surface portions and one or more rough surface portions, wherein at least one smooth carrier surface portion laterally aligns to at least one vacuum aperture, and at least one of the stage's rough surface portions frictionally couples to at least one of the carrier's rough surface portions when the carrier top surface couples to and opposes the stage bottom surface.

3. 发明授权

US09099145B1 High contrast alignment marker 有权
标题翻译：高对比度对准标记
公开(公告)号：US09099145B1
公开(公告)日：2015-08-04
申请号：US14216610
申请日：2014-03-17
申请人： Western Digital (Fremont), LLC
发明人： Ouyang Bin , Chee Kheng Lim
IPC分类号： G11B11/00 , G11B13/04
CPC分类号： G11B5/314 , G11B5/3163 , G11B5/6088 , G11B2005/0021
摘要： A slider and method of making same to reduce contrast interference for visual identification of alignment marks on the slider for heat assisted magnetic recording (HAMR) includes a plurality of alignment marks arranged for alignment of a chip on submount assembly (COSA) with respect to the slider, and at least one shield arranged with the plurality of alignment marks. A hard disk drive includes a plurality of alignment marks arranged for alignment of a chip on submount assembly (COSA) with respect to the slider, and at least one shield arranged with the plurality of alignment marks.
摘要翻译：用于减少用于热辅助磁记录的滑块上的对准标记的视觉识别的对比度干扰的滑块和方法包括多个对准标记，其布置成用于将底座组件（COSA）上的芯片相对于滑块，以及布置有多个对准标记的至少一个屏蔽件。硬盘驱动器包括多个对准标记，其布置成用于对准基座组件（COSA）上的芯片相对于滑块，以及布置有多个对准标记的至少一个屏蔽件。

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