专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08841781B2 Chip having a driving integrated circuit 有权
标题翻译：具有驱动集成电路的芯片
公开(公告)号：US08841781B2
公开(公告)日：2014-09-23
申请号：US13253076
申请日：2011-10-05
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： H01L29/40 , H01L23/52 , H01L23/48 , G02F1/1345
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

2. 发明授权

US08063497B2 Liquid crystal display 有权
标题翻译：液晶显示器
公开(公告)号：US08063497B2
公开(公告)日：2011-11-22
申请号：US12194546
申请日：2008-08-20
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

3. 发明申请

US20090268147A1 CHIP HAVING A DRIVING INTEGRATED CIRCUIT AND LIQUID CRYSTAL DISPLAY HAVING THE SAME 有权
标题翻译：具有驱动集成电路的芯片和具有该电路的液晶显示器
公开(公告)号：US20090268147A1
公开(公告)日：2009-10-29
申请号：US12194546
申请日：2008-08-20
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： G02F1/1345 , H01L23/488
CPC分类号： H01L21/027 , G02F1/13452 , H01L24/17 , H01L2224/13099 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.
摘要翻译：具有适用于玻璃技术芯片的凸块布局的芯片和驱动IC包括多个第一凸块和用于电连接到显示器的玻璃基板的多个第二凸块。第一和第二凸起分别设置在芯片的表面和芯片的两个相对的长边附近。第一凸块的总接触面积与第二凸块的总接触面积的比率在0.8和1.2之间。因此，可以在整个芯片上均匀地施加施加在用于连接的显示器的芯片和玻璃基板上的压力，从而提高连接的稳定性。

4. 发明申请

US20090045528A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20090045528A1
公开(公告)日：2009-02-19
申请号：US11986707
申请日：2007-11-26
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , G02F1/13452 , H01L21/563 , H01L23/3114 , H01L23/3171 , H01L23/3192 , H01L24/16 , H01L24/32 , H01L24/83 , H01L2224/13016 , H01L2224/13019 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13166 , H01L2224/13184 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/2919 , H01L2224/73203 , H01L2224/81191 , H01L2224/81903 , H01L2224/83851 , H01L2924/00013 , H01L2924/01013 , H01L2924/01022 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： An electronic structural member or a semiconductor device having conductive bumps is provided. The conductive bump includes an organic buffer layer with an undercut structure, and the conductive bump is deformable during the bonding process so as to compensate the height difference between the conductive bumps. In addition, an adhesive is further disposed between the IC chip and the substrate, and partial adhesive fills in the undercut structure, such that not only the adhesive area can be increased to enhance the bonding force between the IC chip and the substrate, but the return force of the adhesive can be reduced.
摘要翻译：提供具有导电凸块的电子结构件或半导体器件。导电凸块包括具有底切结构的有机缓冲层，并且导电凸块在接合过程期间可变形，以补偿导电凸块之间的高度差。此外，在IC芯片和基板之间进一步设置粘合剂，部分粘合剂填充底切结构，使得不仅可以增加粘合面积以增强IC芯片和基板之间的结合力，而且可以减少粘合剂的返回力。

5. 发明授权

US08491986B2 Panel module and manufacturing method thereof 有权
标题翻译：面板组件及其制造方法
公开(公告)号：US08491986B2
公开(公告)日：2013-07-23
申请号：US13115316
申请日：2011-05-25
申请人： Pao-Yun Tang , Wei-Hao Sun
发明人： Pao-Yun Tang , Wei-Hao Sun
IPC分类号： B32B3/00 , B32B27/14 , B32B7/14
CPC分类号： G06F3/044 , G06F2203/04103 , H03K2217/96076 , Y10T156/10 , Y10T428/24562 , Y10T428/24802 , Y10T428/24826 , Y10T428/24851 , Y10T428/24942 , Y10T428/31504
摘要： A panel module is provided, including a first substrate, a second substrate, a first optical glue, and a second optical glue. The first and second optical glues are disposed between the first and second substrates, wherein the first optical glue protrudes from the first substrate, and the second optical glue adheres the first substrate to the second substrate. Specifically, the viscosity of the second optical glue is smaller than the first optical glue before solidification.
摘要翻译：提供一种面板模块，包括第一基板，第二基板，第一光学胶和第二光学胶。第一和第二光学胶水设置在第一和第二基底之间，其中第一光学胶从第一基底突出，第二光学胶将第一基底粘附到第二基底。具体地说，第二光学胶的粘度比固化前的第一光学胶小。

6. 发明申请

US20100052160A1 BUMP STRUCTURE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译： BUMP结构及其制作方法
公开(公告)号：US20100052160A1
公开(公告)日：2010-03-04
申请号：US12255416
申请日：2008-10-21
申请人： Wei-Hao SUN , Pao-Yun Tang
发明人： Wei-Hao SUN , Pao-Yun Tang
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： G06Q30/00 , G06Q30/0601 , H01L24/11 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： The present invention discloses a bump structure and a method for fabricating the same. The bump structure of the present invention comprises a semiconductor substrate having a plurality of connection pads; a passivation layer covering the substrate and having openings each corresponding to one connection pad, wherein the openings reveal a portion of each connection pad to form a plurality of electrical-connection areas; an elastic layer formed on the passivation layer; and a plurality of bumps each formed corresponding to one electric-connection area and extending to the elastic layer, whereby the elasticity and deformability of the bumps is enhanced. The present invention uses a larger-texture (≧20 μm) patterning process to fabricate an appropriate patterned elastic layer (having parallel lines, strips, or saw teeth) to enhance the elasticity and deformability of the bumps, whereby the bump structure of the present invention can apply to a fine-pitch IC.
摘要翻译：本发明公开了一种凸块结构及其制造方法。本发明的凸点结构包括具有多个连接焊盘的半导体衬底; 覆盖所述基板并具有各自对应于一个连接焊盘的开口的钝化层，其中所述开口露出每个连接焊盘的一部分以形成多个电连接区域; 形成在钝化层上的弹性层; 以及多个凸起，每个凸起对应于一个电连接区域形成并延伸到弹性层，从而提高了凸块的弹性和变形能力。本发明使用较大纹理（≥20μm）的图案化工艺来制造适当的图案化弹性层（具有平行的线条，条带或锯齿）以增强凸块的弹性和变形能力，由此本发明的凸起结构本发明可应用于精细间距IC。

7. 发明授权

US07456475B2 Display panel 有权
标题翻译：显示面板
公开(公告)号：US07456475B2
公开(公告)日：2008-11-25
申请号：US11553543
申请日：2006-10-27
申请人： Pao-Yun Tang , Po-Yang Chen
发明人： Pao-Yun Tang , Po-Yang Chen
IPC分类号： H01L27/12
CPC分类号： G02F1/133351 , G02F1/13452 , G02F2001/136254
摘要： The invention discloses a display panel. A substrate comprising a chip bonding region and a cut cross-section is provided. A first conductive layer is disposed on the chip bonding region. An insulating layer is disposed on the substrate between the first conductive layer and the cut cross-section, covering a sidewall of the first conductive layer. A second conductive layer is disposed on the insulating layer extending until the cut cross-section and electrically connected to the first conductive layer.
摘要翻译：本发明公开了一种显示面板。提供了包括芯片接合区域和切割横截面的基板。第一导电层设置在芯片接合区域上。绝缘层设置在第一导电层和切割横截面之间的衬底上，覆盖第一导电层的侧壁。第二导电层设置在绝缘层上，延伸直到切割的横截面并电连接到第一导电层。

8. 发明申请

US20060022340A1 ELECTRICAL CONDUCTING STRUCTURE AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING THE SAME 有权
标题翻译：导电结构和液晶显示装置，包括它们
公开(公告)号：US20060022340A1
公开(公告)日：2006-02-02
申请号：US10711412
申请日：2004-09-17
申请人： Shu-Lin Ho , Pao-Yun Tang
发明人： Shu-Lin Ho , Pao-Yun Tang
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/12 , H01L24/29 , H01L24/83 , H01L2224/05001 , H01L2224/05144 , H01L2224/05155 , H01L2224/05568 , H01L2224/13076 , H01L2224/13078 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/73204 , H01L2224/83101 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0781 , H01L2924/14 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2224/05599 , H01L2924/013
摘要： An electrical conducting structure including an integrated circuit, a substrate, and a plurality of bumps, wherein at least one bump comprises a first conductive part connected to the integrated circuit at one end; a second conductive part connected to the integrated circuit at one end; a conductive connection part connecting the first conductive part and the second conductive part; a first insulation part surrounding the first conductive part and the second conductive part; and a second insulation part located between the first conductive part and the second conductive part.
摘要翻译：包括集成电路，基板和多个凸块的导电结构，其中至少一个凸块包括在一端连接到集成电路的第一导电部件; 在一端连接到集成电路的第二导电部件; 连接所述第一导电部和所述第二导电部的导电性连接部; 围绕所述第一导电部和所述第二导电部的第一绝缘部; 以及位于所述第一导电部和所述第二导电部之间的第二绝缘部。

9. 发明申请

US20050270466A1 LIQUID CRYSTAL DISPLAY MODULE 审中-公开
标题翻译：液晶显示模块
公开(公告)号：US20050270466A1
公开(公告)日：2005-12-08
申请号：US10711617
申请日：2004-09-29
申请人： Pao-Yun Tang , Shu-Lin Ho , Kei-Hsiung Yang
发明人： Pao-Yun Tang , Shu-Lin Ho , Kei-Hsiung Yang
IPC分类号： G02F1/1345
CPC分类号： G02F1/1345
摘要： A liquid crystal display module manufactured by a chip-on-glass technology includes at least one glass substrate having a display area and a peripheral area. A plurality of scan and data lines is separately formed on the display area along horizontal and vertical directions. The liquid crystal display module also includes at least one gate driver chip and at least one source driver chip mounted on the peripheral area. The gate and source driver chips transmit signals to the scan and data lines via a plurality of output terminals, and thicknesses of the gate and source driver chips are less than 0.3 mm.
摘要翻译：通过玻璃技术制造的液晶显示模块包括至少一个具有显示区域和周边区域的玻璃基板。多个扫描和数据线在水平和垂直方向上分别形成在显示区域上。液晶显示模块还包括安装在周边区域上的至少一个栅极驱动器芯片和至少一个源极驱动器芯片。栅极和源极驱动器芯片通过多个输出端子将信号传输到扫描和数据线，并且栅极和源极驱动器芯片的厚度小于0.3mm。

10. 发明申请

US20090058774A1 DISPLAY APPARATUS 失效
标题翻译：显示设备
公开(公告)号：US20090058774A1
公开(公告)日：2009-03-05
申请号：US11930124
申请日：2007-10-31
申请人： Pao-Yun Tang
发明人： Pao-Yun Tang
IPC分类号： G09G3/36
CPC分类号： G02F1/1345 , G02F2201/121 , G09G3/3648 , G09G2300/0426 , G09G2320/0233 , G09G2330/08
摘要： A display apparatus includes a substrate, a daisy chain, a driving circuit, and a conductive portion. The substrate has an electrode line. The daisy chain includes a first conducting wire separated from the electrode line. The first conducting wire has a first terminal and a second terminal. The conductive portion is disposed on the substrate. The first terminal is electrically connected to the electrode line and the second terminal is separated from the driving circuit.
摘要翻译：显示装置包括基板，菊花链，驱动电路和导电部分。基板具有电极线。菊链包括与电极线分离的第一导线。第一导线具有第一端子和第二端子。导电部分设置在基板上。第一端子电连接到电极线，并且第二端子与驱动电路分离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式