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    • 7. 发明授权
    • Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore
    • 因此,具有用于交换或交换用于阻抗匹配和阻抗匹配方法的电子部件的可配置结构的探针卡
    • US08638116B2
    • 2014-01-28
    • US13044564
    • 2011-03-10
    • Chao-Ching HuangChih-Hao HoWei-Cheng Ku
    • Chao-Ching HuangChih-Hao HoWei-Cheng Ku
    • G01R31/00
    • G01R31/2887G01R1/07314G01R31/2889
    • A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
    • 提供具有用于交换/交换用于阻抗匹配的电子部件的可配置结构的探针卡和阻抗方法。 在探针卡中,施加的力施加在电子部件上,以使电子部件与支撑单元的至少一个导电接触垫电连接。 支持单元是电路板或空间变压器。 为了促进电子部件的交换或交换,可以移除施加的力。 探针卡包括能够在按压位置和非按压位置之间移动的按压板。 按压板具有在按压板处于按压位置时与电子部件的顶端接触的按压面。 因此,可以通过改变压板的定位来产生或去除施加的力。
    • 8. 发明申请
    • High-frequency probe card and transmission line for high-frequency probe card
    • 高频探针卡和高频探针卡传输线
    • US20080007278A1
    • 2008-01-10
    • US11583740
    • 2006-10-20
    • Wei-Cheng KuHsin-Hung LinChih-Hao HoTe-Chen Feng
    • Wei-Cheng KuHsin-Hung LinChih-Hao HoTe-Chen Feng
    • G01R31/02
    • G01R31/2889G01R1/06772
    • A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
    • 高频探针卡包括具有信号电路和接地电路的电路板,各传输线均具有双线结构,包括用于传输高频信号的第一引线和连接到接地电路的第二引线,以及信号 探针。 由测试机提供的信号电路的高频测试信号可以通过第一个引线传输到信号探头。 由于接地电路和第二引线分别与信号电路和第一引线相邻地设置,所以可以有效地发送高频信号,并且可以在高频信号传输期间保持特性阻抗匹配。 传输线的双线结构的直径等于或小于1毫米,从而可以安装大量的传输线,从而可以实现大量电子元件的高频测试。