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    • 1. 发明申请
    • Magnetic Tunnel Junction for MRAM applications
    • MRAM应用的磁隧道结
    • US20120181537A1
    • 2012-07-19
    • US12930877
    • 2011-01-19
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • H01L29/82H01L21/36H01L29/04
    • H01L43/10G11C11/161H01L27/222H01L43/00H01L43/02H01L43/08
    • A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FeB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic %. NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiment, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
    • 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FeB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%的Mg,Hf,Zr,Nb或Ta。 NiFeX厚度优选在20至40埃之间,以显着减少位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。
    • 2. 发明授权
    • Magnetic tunnel junction for MRAM applications
    • 用于MRAM应用的磁隧道结
    • US08786036B2
    • 2014-07-22
    • US12930877
    • 2011-01-19
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • H01L43/10H01L27/22
    • H01L43/10G11C11/161H01L27/222H01L43/00H01L43/02H01L43/08
    • A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FEB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic % NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiments, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
    • 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FEB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%NiFeX厚度的Mg,Hf,Zr,Nb或Ta优选为20〜40埃,以显着降低位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。
    • 3. 发明授权
    • High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same
    • 用于常规MRAM和STT-RAM的高性能MTJ元件及其制造方法
    • US08372661B2
    • 2013-02-12
    • US11981127
    • 2007-10-31
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngWitold Kula
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngWitold Kula
    • H01L21/00
    • H01L43/10B82Y10/00H01L27/228H01L43/08H01L43/12
    • A STT-RAM MTJ that minimizes spin-transfer magnetization switching current (Jc) is disclosed. The MTJ has a MgO tunnel barrier layer formed with a natural oxidation process to achieve a low RA (10 ohm-um2) and a Fe or Fe/CoFeB/Fe free layer which provides a lower intrinsic damping constant than a CoFeB free layer. A Fe, FeB, or Fe/CoFeB/Fe free layer when formed with a MgO tunnel barrier (radical oxidation process) and a CoFeB AP1 pinned layer in a MRAM MTJ stack annealed at 360° C. provides a high dR/R (TMR)>100% and a substantial improvement in read margin with a TMR/Rp_cov=20. High speed measurement of 100 nm×200 nm oval STT-RAM MTJs has shown a Jc0 for switching a Fe free layer is one half that for switching an amorphous CO40Fe40B20 free layer. A Fe/CoFeB/Fe free layer configuration allows the Hc value to be increased for STT-RAM applications.
    • 公开了使自旋转移磁化开关电流(Jc)最小化的STT-RAM MTJ。 MTJ具有形成有自然氧化工艺的MgO隧道阻挡层,以实现低的RA(10欧姆 - um2)和不含CoFeB自由层的较低的固有阻尼常数的Fe或Fe / CoFeB / Fe自由层。 当在360℃退火的MRAM MTJ堆叠中形成具有MgO隧道势垒(自由基氧化法)和CoFeB AP1钉扎层的Fe,FeB或Fe / CoFeB / Fe自由层时,提供高dR / R(TMR )> 100%,TMR / Rp_cov = 20时读取余量大幅度提高。 100 nm×200 nm椭圆STT-RAM MTJ的高速测量显示,用于切换无Fe层的Jc0是用于切换无定形CO40Fe40B20自由层的一半。 Fe / CoFeB / Fe自由层配置允许为STT-RAM应用增加Hc值。