专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070046284A1 Integrated Process Condition Sensing Wafer and Data Analysis System 有权
标题翻译：集成工艺条件感知晶片和数据分析系统
公开(公告)号：US20070046284A1
公开(公告)日：2007-03-01
申请号：US11553574
申请日：2006-10-27
申请人： Wayne Renken , Earl Jensen , Roy Gordon , Brian Paquette , Mei Sun
发明人： Wayne Renken , Earl Jensen , Roy Gordon , Brian Paquette , Mei Sun
IPC分类号： G01R31/28
CPC分类号： H01L21/67253 , H01L21/6732 , H01L21/681 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
摘要翻译：处理条件测量装置和处理系统可以与生产环境高度集成，其中处理条件测量装置的尺寸接近制造基板的尺寸，并且处理系统类似于用于生产基板的基板载体。可以对生产环境几乎没有干扰地测量工艺条件。数据可以从过程状态测量设备传送到用户很少或没有人为干预。

2. 发明申请

US20050246127A1 Integrated process condition sensing wafer and data analysis system 有权
标题翻译：集成工艺条件检测晶片和数据分析系统
公开(公告)号：US20050246127A1
公开(公告)日：2005-11-03
申请号：US11158983
申请日：2005-06-21
申请人： Wayne Renken , Earl Jensen , Roy Gordon
发明人： Wayne Renken , Earl Jensen , Roy Gordon
IPC分类号： H01L21/00 , G01R27/28
CPC分类号： H01L21/67253 , H01L2224/48091 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition measuring device to a user with little or no human intervention.
摘要翻译：处理条件测量装置和处理系统可以与生产环境高度集成，其中处理条件测量装置的尺寸接近制造基板的尺寸，并且处理系统类似于用于生产基板的基板载体。可以对生产环境几乎没有干扰地测量工艺条件。数据可以从过程状态测量装置传送到用户很少或没有人为干预。

3. 发明申请

US20080087105A1 Shear Force Sensing Device 有权
标题翻译：剪切力传感装置
公开(公告)号：US20080087105A1
公开(公告)日：2008-04-17
申请号：US11861207
申请日：2007-09-25
申请人： Wayne Renken , Mei Sun , Aron Mason
发明人： Wayne Renken , Mei Sun , Aron Mason
IPC分类号： G01L1/20 , G01N27/04
CPC分类号： G01L1/148 , G01L5/0047 , G01L9/0042 , G01L9/0073
摘要： At least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译：当构件与抛光或平坦化表面接触并压靠在抛光或平坦化表面上并且在两个表面之间施加横向力时，使用至少一个剪切力传感器来测量构件上的剪切力。优选地，结构和结构的表面具有与诸如半导体晶片或平板显示面板的实际基板基本上相同的性质（例如以下的一个或多个：尺寸和摩擦系数）。

4. 发明申请

US20060174720A1 Process condition sensing wafer and data analysis system 有权
标题翻译：工艺条件检测晶圆和数据分析系统
公开(公告)号：US20060174720A1
公开(公告)日：2006-08-10
申请号：US11302763
申请日：2005-12-13
申请人： Wayne Renken , Mei Sun
发明人： Wayne Renken , Mei Sun
IPC分类号： G01D7/02
CPC分类号： G01D9/005 , H01L21/67253 , H01L22/34 , H01L2224/48091 , Y10T29/4913 , H01L2924/00014
摘要： A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
摘要翻译：一种测量装置，其包括具有测量晶片在制造期间可能经历的加工条件的传感器的基板。基板可以通过机器人头插入处理室，并且测量装置可以实时地传送条件或存储用于后续分析的条件。设备的敏感电子元件可以远离或与最有害的处理条件隔离，以提高设备的精度，操作范围和可靠性。可以通过真空或合适的材料提供隔离，并且相变材料可以位于电子设备附近以保持低温。

5. 发明申请

US20080087069A1 Pressure Sensing Device 有权
标题翻译：压力传感装置
公开(公告)号：US20080087069A1
公开(公告)日：2008-04-17
申请号：US11861119
申请日：2007-09-25
申请人： Wayne Renken , Mei Sun , Aron Mason , Lynn Wiese
发明人： Wayne Renken , Mei Sun , Aron Mason , Lynn Wiese
IPC分类号： G01L9/12 , G01L27/00
CPC分类号： G01L9/0073
摘要： At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译：使用包含在结构中的至少一对电容耦合电极来感测用于测量施加在隔膜上的压力或力的压力或力传感器中的隔膜的偏转。优选地，结构具有与诸如半导体晶片或平板显示面板的实际基板的特性（例如尺寸，硬度，面积和柔性）相同的性质（诸如以下的一个或多个）。

6. 发明申请

US20050081398A1 Sensor positioning systems and methods 失效
标题翻译：传感器定位系统和方法
公开(公告)号：US20050081398A1
公开(公告)日：2005-04-21
申请号：US10688300
申请日：2003-10-16
申请人： Mei Sun , Richard Schwaninger , Wayne Renken
发明人： Mei Sun , Richard Schwaninger , Wayne Renken
IPC分类号： G01D20060101 , G01D11/30 , G01D21/00
CPC分类号： G01D11/30
摘要： Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.
摘要翻译：可以将多个传感器连接到基底以测量不同点处的状况。使用模板可以精确定位传感器来建立传感器位置。可以容易地输送包括模板，传感器和电缆组件的预制套件，使得传感器可以附接在现场。

7. 发明申请

US20060015294A1 Data collection and analysis system 有权
标题翻译：数据收集和分析系统
公开(公告)号：US20060015294A1
公开(公告)日：2006-01-19
申请号：US11174022
申请日：2005-07-01
申请人： Forrest Yetter , Jeffrey Parker , Wayne Renken , John Pieper
发明人： Forrest Yetter , Jeffrey Parker , Wayne Renken , John Pieper
IPC分类号： G21C17/00
CPC分类号： G05B23/0254
摘要： A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for easy configuration.
摘要翻译：传感器网络从过程工具收集时间序列数据，并将数据提供给分析系统，其中使用模式分析技术来识别结构并基于分析指令或复合模型监视后续数据。来自多个过程运行的时间序列数据用于形成包括变化的数据结构的复合模型。与复合模型的比较给出了工具健康的指示。传感器网络可能具有分布式存储器，便于配置。

8. 发明授权

US06616332B1 Optical techniques for measuring parameters such as temperature across a surface 有权
标题翻译：用于测量表面温度等参数的光学技术
公开(公告)号：US06616332B1
公开(公告)日：2003-09-09
申请号：US09442413
申请日：1999-11-18
申请人： Wayne Renken , Mei H. Sun , Arwa Ginwalla
发明人： Wayne Renken , Mei H. Sun , Arwa Ginwalla
IPC分类号： G01K1112
CPC分类号： G01K11/12
摘要： A sensor of a parameter such as temperature includes an indicator encapsulated within a rigid enclosure, wherein the sensor has a characteristic that varies with the parameter that is detectable upon illumination with electromagnetic radiation through a window of the enclosure that is transparent to the radiation. In a specific example, the indicator changes an optical characteristic such as its color as a function of its temperature, and may be of an irreversible type in order to indicate the peak temperature reached. The sensor may include a pattern of such indicators that have different peak temperatures to which they respond, so that the sensor gives a unique visual pattern at each temperature within its measurement range. This pattern may be viewed directly or processed by computer to compare the pattern with those which indicate known temperatures. The sensor and system utilizing it have particular advantages for operation in a vacuum, and/or under ion bombardment, such occurs in plasma etching and deposition machines, and/or within a strong electromagnetic field, such as within the radio frequency and microwave frequency ranges. An array of such sensors positioned across a surface of a thermally conductive substrate is especially useful for measuring a temperature distribution occurring across semiconductor wafers in wafer processing machinery.
摘要翻译：诸如温度的参数的传感器包括封装在刚性外壳内的指示器，其中传感器具有随着通过对辐射透明的外壳的窗口的电磁辐射照射时可检测的参数而变化的特性。在具体示例中，指示器将光学特性如其颜色改变为其温度的函数，并且可以是不可逆类型以便指示达到的峰值温度。传感器可以包括这样的指示器的图案，其具有与其响应的不同峰值温度，使得传感器在其测量范围内的每个温度下给出独特的视觉图案。该模式可以直接观看或由计算机处理，以将模式与指示已知温度的模式进行比较。利用它的传感器和系统具有在真空中和/或离子轰击下操作的特殊优点，例如在等离子体蚀刻和沉积机器中和/或在强电磁场（例如在射频和微波频率范围内）。定位在导热基板的表面上的这种传感器的阵列特别适用于测量在晶片加工机械中跨半导体晶片发生的温度分布。

9. 发明申请

US20070113652A1 Wireless Position Sensing Wafer 审中-公开
标题翻译：无线位置感应晶片
公开(公告)号：US20070113652A1
公开(公告)日：2007-05-24
申请号：US11539465
申请日：2006-10-06
申请人： Wayne Renken
发明人： Wayne Renken
IPC分类号： G01P15/00 , G01D21/02
CPC分类号： G01D9/005
摘要： A wireless position sensing wafer includes at least one accelerometer that measures acceleration along one direction. Integrating acceleration allows velocity and displacement from a starting point to be obtained. Orientation may be obtained from one or more gyroscopes or from a magnetic sensor. One or more artificial magnetic fields may be created for such a magnetic sensor. Position may also be found by triangulation with respect to fixed transmitters.
摘要翻译：无线位置感测晶片包括至少一个加速度计，其测量沿着一个方向的加速度。积分加速允许从起始点获得速度和位移。可以从一个或多个陀螺仪或从磁传感器获得取向。可以为这样的磁传感器创建一个或多个人造磁场。位置也可以通过三角测量相对于固定发射器来发现。

10. 发明授权

US5746513A Temperature calibration substrate 失效
标题翻译：温度校准基板
公开(公告)号：US5746513A
公开(公告)日：1998-05-05
申请号：US877978
申请日：1997-06-18
申请人： Wayne Renken
发明人： Wayne Renken
IPC分类号： G01K1/16 , G01K7/02 , G01K13/00 , G01K7/06 , G01K1/14
CPC分类号： G01K13/00
摘要： A temperature calibration substrate for producing increased temperature measurement accuracy. The temperature calibration substrate includes cavity means located below the surface of said substrate and thermocouple means disposed in the cavity for measuring the temperature of the substrate. The cavity means includes a cavity opening, an inner perimeter, and a length. Heat transfer means is disposed in the cavity means between the thermocouple means and the inner perimeter of the cavity means for transferring heat from the substrate to the thermocouple means. The cavity means is shaped to allow the thermocouple means to lay in close proximity to the substrate, and the thermocouple means is positioned substantially adjacent the inner perimeter of the cavity means and traverses the length of the cavity means thereby enhancing heat transfer efficiency from the substrate to the thermocouple means.
摘要翻译：一种温度校准基板，用于提高温度测量精度。温度校准基板包括位于所述基板的表面下方的空腔装置和设置在空腔中的热电偶装置，用于测量基板的温度。空腔装置包括空腔开口，内周边和长度。热传递装置设置在热电偶装置和空腔装置的内周边之间的空腔装置中，用于将热量从基板传递到热电偶装置。空腔装置被成形为允许热电偶装置靠近基板放置，并且热电偶装置基本上邻近空腔装置的内周边定位，并且穿过空腔装置的长度，从而提高从基板的传热效率到热电偶装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式