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1. 发明授权

US06210993B1 High density semiconductor package and method of fabrication 有权
标题翻译：高密度半导体封装及其制造方法
公开(公告)号：US06210993B1
公开(公告)日：2001-04-03
申请号：US09349417
申请日：1999-07-06
申请人： Warren M. Farnworth , Salman Akram , Alan G. Wood , Mike Brooks , Eugene Cloud
发明人： Warren M. Farnworth , Salman Akram , Alan G. Wood , Mike Brooks , Eugene Cloud
IPC分类号： H01L2144
CPC分类号： H01L25/0657 , H01L23/4985 , H01L24/72 , H01L2225/0652 , H01L2225/06551 , H01L2225/06575 , H01L2225/06579 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/12044 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , H01L2924/00
摘要： A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The polymer interconnect includes a flexible polymer tape with patterns of conductors. The conductors include microbumps for bonding to the die bond pads, and edge contacts for electrical connection to mating contacts on the substrate. The package also includes a force applying mechanism for biasing the dice against the substrate. In alternate embodiments, the polymer interconnect includes resilient edge contacts, cantilevered edge contacts, or multi level edge contacts.
摘要翻译：提供半导体封装和制造方法。封装包括容纳在外壳中的多个半导体裸片，并且安装在边缘到基板上。每个管芯包括连接到管芯的表面并且围绕管芯的端部（或侧面）的聚合物互连。聚合物互连包括具有导体图案的柔性聚合物带。导体包括用于与芯片接合焊盘接合的微胶片，以及用于与衬底上的配合触点电连接的边缘触点。该包装还包括用于将骰子偏压抵靠衬底的施力机构。在替代实施例中，聚合物互连包括弹性边缘触点，悬臂边缘触点或多级边缘触点。

2. 发明授权

US5990566A High density semiconductor package 失效
标题翻译：高密度半导体封装
公开(公告)号：US5990566A
公开(公告)日：1999-11-23
申请号：US82093
申请日：1998-05-20
申请人： Warren M. Farnworth , Salman Akram , Alan G. Wood , Mike Brooks , Eugene Cloud
发明人： Warren M. Farnworth , Salman Akram , Alan G. Wood , Mike Brooks , Eugene Cloud
IPC分类号： H01L23/48 , H01L23/498 , H01L25/065 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L23/4985 , H01L24/72 , H01L2225/0652 , H01L2225/06551 , H01L2225/06575 , H01L2225/06579 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/12044 , H01L2924/14 , H01L2924/3011 , H01L2924/351
摘要： A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The polymer interconnect includes a flexible polymer tape with patterns of conductors. The conductors include microbumps for bonding to the die bond pads, and edge contacts for electrical connection to mating contacts on the substrate. The package also includes a force applying mechanism for biasing the dice against the substrate. In alternate embodiments, the polymer interconnect includes resilient edge contacts, cantilevered edge contacts, or multi level edge contacts.
摘要翻译：提供半导体封装和制造方法。封装包括容纳在外壳中的多个半导体裸片，并且安装在边缘到基板上。每个管芯包括连接到管芯的表面并且围绕管芯的端部（或侧面）的聚合物互连。聚合物互连包括具有导体图案的柔性聚合物带。导体包括用于与芯片接合焊盘接合的微胶片，以及用于与衬底上的配合触点电连接的边缘触点。该包装还包括用于将骰子偏压抵靠衬底的施力机构。在替代实施例中，聚合物互连包括弹性边缘触点，悬臂边缘触点或多级边缘触点。

3. 发明授权

US6060893A Carrier having slide connectors for testing unpackaged semiconductor dice 失效
标题翻译：载体具有用于测试未封装的半导体骰子的滑动连接器
公开(公告)号：US6060893A
公开(公告)日：2000-05-09
申请号：US976846
申请日：1997-11-24
申请人： Warren M. Farnworth , Salman Akram , Mike Brooks
发明人： Warren M. Farnworth , Salman Akram , Mike Brooks
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/66 , H01L21/68 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/42 , G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483 , G01R31/2893 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/80 , H01L24/85 , H05K3/4007 , G01R3/00 , G01R31/2863 , H01L2224/16145 , H01L2224/451 , H01L2224/48 , H01L2224/85001 , H01L2225/06562 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A carrier for testing an unpackaged semiconductor die is provided. The carrier comprises a base for holding the die, an interconnect for establishing a temporary electrical connection with the die, and a force applying mechanism for biasing the die and interconnect together. The base includes external contacts arranged as flat metal pads in a dense grid array and electrically connected to a pattern of contact pads. The carrier also includes a pair of slide connector members which provide an electrical p ath between the contact pads on the base and corresponding contact pads on the interconnect. The slide connector members can be formed of molded plastic or ceramic and include tine contacts that slidably engage the contact pads on the interconnect and base. The slide connector members permit the interconnect to be easily replaced for testing of different types of dice.
摘要翻译：提供了用于测试未封装的半导体管芯的载体。载体包括用于保持模具的基座，用于建立与模具的临时电连接的互连件，以及用于偏压模具并互连在一起的施力机构。底座包括以致密网格阵列布置成平坦金属焊盘并电连接到接触焊盘图案的外部触点。载体还包括一对滑动连接器构件，其在基座上的接触焊盘和互连件上的对应接触垫之间提供电气连接。滑动连接器构件可以由模制塑料或陶瓷形成，并且包括滑动接合互连和底座上的接触垫的齿接触。滑动连接器构件允许容易地替换互连以测试不同类型的骰子。

4. 发明授权

US5691649A Carrier having slide connectors for testing unpackaged semiconductor dice 失效
标题翻译：载体具有用于测试未封装的半导体骰子的滑动连接器
公开(公告)号：US5691649A
公开(公告)日：1997-11-25
申请号：US587175
申请日：1996-01-16
申请人： Warren M. Farnworth , Salman Akram , Mike Brooks
发明人： Warren M. Farnworth , Salman Akram , Mike Brooks
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/66 , H01L21/68 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/42 , G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483 , G01R31/2893 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/80 , H01L24/85 , H05K3/4007 , G01R3/00 , G01R31/2863 , H01L2224/16145 , H01L2224/451 , H01L2224/48 , H01L2224/85001 , H01L2225/06562 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A carrier for testing an unpackaged semiconductor die is provided. The carrier comprises a base for holding the die, an interconnect for establishing a temporary electrical connection with the die, and a force applying mechanism for biasing the die and interconnect together. The base includes external contacts arranged as flat metal pads in a dense grid array and electrically connected to a pattern of contact pads. The carrier also includes a pair of slide connector members which provide an electrical path between the contact pads on the base and corresponding contact pads on the interconnect. The slide connector members can be formed of molded plastic or ceramic and include tine contacts that slidably engage the contact pads on the interconnect and base. The slide connector members permit the interconnect to be easily replaced for testing of different types of dice.
摘要翻译：提供了用于测试未封装的半导体管芯的载体。载体包括用于保持模具的基座，用于建立与模具的临时电连接的互连件，以及用于偏压模具并互连在一起的施力机构。底座包括以致密网格阵列布置成平坦金属焊盘并电连接到接触焊盘图案的外部触点。载体还包括一对滑动连接器构件，其在基座上的接触焊盘和互连上的对应的接触焊盘之间提供电路径。滑动连接器构件可以由模制塑料或陶瓷形成，并且包括滑动接合互连和底座上的接触垫的齿接触。滑动连接器构件允许容易地替换互连以测试不同类型的骰子。

5. 发明授权

US06368896B2 Method of wafer level chip scale packaging 有权
标题翻译：晶圆级芯片级封装方法
公开(公告)号：US06368896B2
公开(公告)日：2002-04-09
申请号：US09298514
申请日：1999-04-23
申请人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
发明人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
IPC分类号： H01L2144
CPC分类号： H01L23/49827 , H01L23/4985 , H01L2224/02333 , H01L2224/73215 , H01L2924/09701 , H01L2924/12044 , H01L2924/15173
摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
摘要翻译：提供了一种芯片级半导体封装和一种制造该封装的方法。该封装包括半导体管芯和连接到管芯的表面的柔性电路。柔性电路包括具有密集阵列的外部触点的聚合物基板和与外部触点电连通的导体图案。封装还包括被配置为在管芯触头（例如，焊盘）之间提供分开的电路径的互连件以及柔性电路上的导体。提供了互连的几个不同实施例，包括：在裸片上的凸起接触，用导电粘合剂层结合到柔性电路导体上; 导体上的聚合物凸块或模具接触件以半固化状态施加，然后完全固化; 使用焊接工具彼此接合的管芯触点和导体上的焊料凸块; 使用金属凸块和引线接合或球焊接装置形成的导体和裸片接触之间的铆钉状接合连接; 导体和裸片接点之间的单点接合连接，用接合工具形成; 以及导体和裸片接触之间的引线键合。

6. 发明授权

US06975037B2 Semiconductor package having flex circuit with external contacts 失效
标题翻译：具有外部触头的柔性电路的半导体封装
公开(公告)号：US06975037B2
公开(公告)日：2005-12-13
申请号：US10871925
申请日：2004-06-18
申请人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
发明人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
IPC分类号： H01L23/498 , H01L29/40
CPC分类号： H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/02333 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48465 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
摘要翻译：提供了一种芯片级半导体封装和一种制造该封装的方法。该封装包括半导体管芯和连接到管芯的表面的挠性电路。柔性电路包括具有密集阵列的外部触点的聚合物基板和与外部触点电连通的导体图案。封装还包括被配置为在管芯触头（例如，焊盘）之间提供分开的电路径的互连件以及柔性电路上的导体。提供了互连的几个不同实施例，包括：在裸片上的凸起接触，用导电粘合剂层结合到柔性电路导体上; 导体上的聚合物凸块或模具接触件以半固化状态施加，然后完全固化; 使用焊接工具彼此接合的管芯触点和导体上的焊料凸块; 使用金属凸块和引线接合或球焊接装置形成的导体和裸片接触之间的铆钉状接合连接; 导体和裸片接点之间的单点接合连接，用接合工具形成; 以及导体和裸片接触之间的引线键合。

7. 发明授权

US06911355B2 Semiconductor package having flex circuit with external contacts 失效
公开(公告)号：US06911355B2
公开(公告)日：2005-06-28
申请号：US10754285
申请日：2004-01-09
申请人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
发明人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
IPC分类号： H01L23/498 , H01L21/44
CPC分类号： H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/02333 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48465 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.

8. 发明授权

US06465877B1 Semiconductor package including flex circuit, interconnects and dense array external contacts 有权
标题翻译：半导体封装包括柔性电路，互连和密集阵列外部触点
公开(公告)号：US06465877B1
公开(公告)日：2002-10-15
申请号：US09536827
申请日：2000-03-27
申请人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
发明人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
IPC分类号： H01L23495
CPC分类号： H01L23/49827 , H01L23/4985 , H01L2224/02333 , H01L2224/73215 , H01L2924/09701 , H01L2924/12044 , H01L2924/15173
摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
摘要翻译：提供了一种芯片级半导体封装和一种制造该封装的方法。该封装包括半导体管芯和连接到管芯的表面的柔性电路。柔性电路包括具有密集阵列的外部触点的聚合物基板和与外部触点电连通的导体图案。封装还包括被配置为在管芯触头（例如，焊盘）之间提供分开的电路径的互连件以及柔性电路上的导体。提供了互连的几个不同实施例，包括：在裸片上的凸起接触，用导电粘合剂层结合到柔性电路导体上; 导体上的聚合物凸块或模具接触件以半固化状态施加，然后完全固化; 使用焊接工具彼此接合的管芯触点和导体上的焊料凸块; 使用金属凸块和引线接合或球焊接装置形成的导体和裸片接触之间的铆钉状接合连接; 导体和裸片接点之间的单点接合连接，用接合工具形成; 以及导体和裸片接触之间的引线键合。

9. 发明授权

US6020629A Stacked semiconductor package and method of fabrication 失效
标题翻译：堆叠半导体封装及其制造方法
公开(公告)号：US6020629A
公开(公告)日：2000-02-01
申请号：US92779
申请日：1998-06-05
申请人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
发明人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
IPC分类号： H01L25/10 , H01L23/12 , H01L23/02 , H01L23/50 , H05K1/18
CPC分类号： H01L24/06 , H01L24/97 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2224/97 , H01L2225/1058 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331
摘要： A semiconductor package and a method for fabricating the package are provided. The package includes multiple substrates in a stacked configuration, each having a semiconductor die mounted thereon. Each substrate includes matching patterns of external contacts and contact pads formed on opposing sides of the substrate, and interconnected by interlevel conductors through the substrate. In the package, the external contacts on a first substrate are bonded to the contact pads on an adjacent second substrate, so that all of the dice in the package are interconnected. The fabrication process includes forming multiple substrates on a panel, mounting the dice to the substrates, stacking and bonding the panels to one another, and then separating the substrates from the stacked panels to form the packages.
摘要翻译：提供半导体封装和制造封装的方法。该封装包括堆叠构造的多个衬底，每个衬底上安装有半导体管芯。每个衬底包括形成在衬底的相对侧上的外部触点和接触焊盘的匹配图案，并且通过穿过衬底的层间导体互连。在封装中，第一衬底上的外部接触件接合到相邻第二衬底上的接触焊盘，使得封装中的所有裸片相互连接。制造工艺包括在面板上形成多个基板，将芯片安装到基板上，将面板彼此堆叠和粘合，然后将基板与堆叠的面板分开以形成封装。

10. 发明授权

US06740960B1 Semiconductor package including flex circuit, interconnects and dense array external contacts 有权
标题翻译：半导体封装包括柔性电路，互连和密集阵列外部触点
公开(公告)号：US06740960B1
公开(公告)日：2004-05-25
申请号：US10231752
申请日：2002-08-29
申请人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
发明人： Warren M. Farnworth , Alan G. Wood , Mike Brooks
IPC分类号： H01L23495
CPC分类号： H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/02333 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48465 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
摘要翻译：提供了一种芯片级半导体封装和一种制造该封装的方法。该封装包括半导体管芯和连接到管芯的表面的柔性电路。柔性电路包括具有密集阵列的外部触点的聚合物基板和与外部触点电连通的导体图案。封装还包括被配置为在管芯触头（例如，焊盘）之间提供分开的电路径的互连件以及柔性电路上的导体。提供了互连的几个不同实施例，包括：在裸片上的凸起接触，用导电粘合剂层粘合到柔性电路导体上; 导体上的聚合物凸块或模具接触件以半固化状态施加，然后完全固化; 使用焊接工具彼此接合的管芯触点和导体上的焊料凸块; 使用金属凸块和引线接合或球焊接装置形成的导体和裸片接触之间的铆钉状接合连接; 导体和裸片接点之间的单点接合连接，用接合工具形成; 以及导体和裸片接触之间的引线键合。

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