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1. 发明授权

US07569418B2 Methods for securing packaged semiconductor devices to carrier substrates 失效
标题翻译：将封装的半导体器件固定到载体衬底的方法
公开(公告)号：US07569418B2
公开(公告)日：2009-08-04
申请号：US11219214
申请日：2005-09-01
申请人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
发明人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
IPC分类号： H01L21/00
CPC分类号： H05K3/301 , H01L25/105 , H01L2225/107 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K2201/10454 , H05K2201/10696 , Y10S83/942 , Y10T29/49121 , Y10T29/4913 , Y10T29/49135 , Y10T29/49147 , Y10T29/49156 , Y10T29/49169 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.
摘要翻译：一种用于将半导体器件固定到载体衬底的方法包括：将半导体器件从其底部边缘延伸到与载体衬底相关联的对准器件的插座中插入多个短截线。在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，半导体器件被偏置以便建立并维持半导体器件和载体衬底之间的电连通。

2. 发明授权

US06828173B2 Semiconductor device including edge bond pads and methods 失效
标题翻译：半导体器件包括边缘焊盘和方法
公开(公告)号：US06828173B2
公开(公告)日：2004-12-07
申请号：US10132429
申请日：2002-04-25
申请人： Warren M. Farnworth , Larry D. Kinsman , Walter L. Moden
发明人： Warren M. Farnworth , Larry D. Kinsman , Walter L. Moden
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L23/485 , H01L24/02 , H01L24/45 , H01L2224/02371 , H01L2224/0401 , H01L2224/13099 , H01L2224/45144 , H01L2224/45147 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/3011 , H01L2224/48 , H01L2924/00
摘要： A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the semiconductor wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device such that the bond pad is aligned with a corresponding terminal of the carrier substrate and establishing an electrical connection between the bond pad and the terminal. Preferably, an electrically conductive material is disposed between the bond pad and the terminal to establish an electrically conductive bond between the semiconductor device and the carrier substrate.
摘要翻译：一种垂直安装的半导体器件，包括设置在其边缘上的至少一个接合焊盘。接合焊盘包括设置在其上的导电凸块。半导体器件还可以包括保护性外涂层。本发明还包括一种制造半导体器件的方法，包括在半导体晶片中形成断开的凹口，将电路迹线重定向到每个凹口中，以及沿着凹口划分半导体晶片，以在所得半导体的边缘上形成接合焊盘设备。将半导体器件附接到载体衬底的方法包括使半导体器件定向，使得接合焊盘与载体衬底的相应端子对准并且在接合焊盘和端子之间建立电连接。优选地，导电材料设置在接合焊盘和端子之间，以在半导体器件和载体衬底之间建立导电接合。

3. 发明授权

US06684493B2 Vertically mountable interposer, assembly and method 有权
标题翻译：用于建立半导体器件和衬底之间的通信的方法
公开(公告)号：US06684493B2
公开(公告)日：2004-02-03
申请号：US10099483
申请日：2002-03-13
申请人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
发明人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
IPC分类号： H05K336
CPC分类号： H05K3/301 , H01L23/32 , H01L25/105 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49169 , H01L2924/00
摘要： A support assembly for mounting a semiconductor device vertically relative to a carrier substrate is disclosed. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releaseably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.
摘要翻译：公开了一种用于相对于载体衬底垂直安装半导体器件的支撑组件。支撑组件包括插入件，半导体器件附接到该插入器。支撑组件还包括承载在插入器上的迹线，其将半导体器件电连接到插入器上的触点。触点沿着插入器的单个边缘设置。本发明还包括用于可释放地安装支撑组件的对准装置。安装到载体基板的对准装置包括一个或多个插座。当支撑组件插入到插座中时，对准装置在触点和载体基板上的相应端子之间建立电连接。组件还可以包括附接到对准装置的顶部并将插入件偏压抵靠载体基板的盖。

4. 发明授权

US06455351B2 Vertical surface mount assembly and methods 有权
标题翻译：垂直表面安装组件及方法
公开(公告)号：US06455351B2
公开(公告)日：2002-09-24
申请号：US09819297
申请日：2001-03-27
申请人： Larry D. Kinsman , Jerry M. Brooks , Warren M. Farnworth , Walter L. Moden , Terry R. Lee
发明人： Larry D. Kinsman , Jerry M. Brooks , Warren M. Farnworth , Walter L. Moden , Terry R. Lee
IPC分类号： H01L2144
CPC分类号： H05K3/301 , H01L2924/0002 , Y10T29/4913 , H01L2924/00
摘要： A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferable, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.
摘要翻译：一种可垂直安装的半导体器件组件，包括半导体器件和用于将半导体器件附着到载体衬底的机构。半导体器件的每个接合焊盘都设置在其单个边缘附近。优选地，半导体器件的至少一部分被暴露。对准装置附接到载体基板。可垂直安装的半导体器件封装上的安装元件与对准装置接合以使半导体器件和对准器件互连。优选地，对准装置将垂直安装的半导体器件封装相对于载体衬底垂直固定。接合焊盘和载体基板上的对应端子之间的距离非常小以减少阻抗。垂直安装的半导体器件封装也可以容易地用户升级。

5. 发明授权

US06437435B1 Vertically mountable interposer, assembly and method 有权
标题翻译：垂直安装的插件，组装和方法
公开(公告)号：US06437435B1
公开(公告)日：2002-08-20
申请号：US09651491
申请日：2000-08-30
申请人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
发明人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
IPC分类号： H01L2312
CPC分类号： H05K3/301 , H01L23/32 , H01L25/105 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49169 , H01L2924/00
摘要： A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releasably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.
摘要翻译：一种用于相对于载体衬底垂直安装半导体器件的支撑组件。支撑组件包括插入件，半导体器件附接到该插入器。支撑组件还包括承载在插入器上的迹线，其将半导体器件电连接到插入器上的触点。触点沿着插入器的单个边缘设置。本发明还包括用于可释放地安装支撑组件的对准装置。安装到载体基板的对准装置包括一个或多个插座。当支撑组件插入到插座中时，对准装置在触点和载体基板上的相应端子之间建立电连接。组件还可以包括附接到对准装置的顶部并将插入件偏压抵靠载体基板的盖。

6. 发明授权

US06414374B2 Semiconductor device including edge bond pads and methods 有权
标题翻译：半导体器件包括边缘焊盘和方法
公开(公告)号：US06414374B2
公开(公告)日：2002-07-02
申请号：US09862942
申请日：2001-05-22
申请人： Warren M. Farnworth , Larry D. Kinsman , Walter L. Moden
发明人： Warren M. Farnworth , Larry D. Kinsman , Walter L. Moden
IPC分类号： H01L23544
CPC分类号： H01L24/11 , H01L23/485 , H01L24/02 , H01L24/45 , H01L2224/02371 , H01L2224/0401 , H01L2224/13099 , H01L2224/45144 , H01L2224/45147 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/3011 , H01L2224/48 , H01L2924/00
摘要： A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the semiconductor wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device such that the bond pad is aligned with a corresponding terminal of the carrier substrate, and establishing an electrical connection between the bond pad and the terminal. Preferably, an electrically conductive material is disposed between the bond pad and the terminal to establish an electrically conductive bond between the semiconductor device and the carrier substrate.
摘要翻译：一种垂直安装的半导体器件，包括设置在其边缘上的至少一个接合焊盘。接合焊盘包括设置在其上的导电凸块。半导体器件还可以包括保护性外涂层。本发明还包括一种制造半导体器件的方法，包括在半导体晶片中形成断开的切口，将电路迹线重定向到每个凹口中，以及沿着凹口划分半导体晶片，以在所得半导体的边缘上形成接合焊盘设备。将半导体器件附接到载体衬底的方法包括使半导体器件定向，使得接合焊盘与载体衬底的相应端子对准，并且在焊盘和端子之间建立电连接。优选地，导电材料设置在接合焊盘和端子之间，以在半导体器件和载体衬底之间建立导电接合。

7. 发明授权

US06295209B1 Semiconductor device including combed bond pad opening, assemblies and methods 有权
公开(公告)号：US06295209B1
公开(公告)日：2001-09-25
申请号：US09651460
申请日：2000-08-30
申请人： Warren M. Farnworth , Walter L. Moden , Larry D. Kinsman
发明人： Warren M. Farnworth , Walter L. Moden , Larry D. Kinsman
IPC分类号： H05K710
CPC分类号： H01L23/32 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/12042 , H01L2924/3011 , H01L2924/00
摘要： A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

8. 发明授权

US06268655B1 Semiconductor device including edge bond pads and methods 有权
标题翻译：半导体器件包括边缘焊盘和方法
公开(公告)号：US06268655B1
公开(公告)日：2001-07-31
申请号：US09409782
申请日：1999-09-30
申请人： Warren M. Farnworth , Larry D. Kinsman , Walter L. Moden
发明人： Warren M. Farnworth , Larry D. Kinsman , Walter L. Moden
IPC分类号： H01L2330
CPC分类号： H01L24/11 , H01L23/485 , H01L24/02 , H01L24/45 , H01L2224/02371 , H01L2224/0401 , H01L2224/13099 , H01L2224/45144 , H01L2224/45147 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/3011 , H01L2224/48 , H01L2924/00
摘要： A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device such that the bond pad is aligned with a corresponding terminal of the carrier substrate, and establishing an electrical connection between the bond pad and the terminal. Preferably, an electrically conductive material is disposed between the bond pad and the terminal to establish an electrically conductive bond between the semiconductor device and the carrier substrate.
摘要翻译：一种垂直安装的半导体器件，包括设置在其边缘上的至少一个接合焊盘。接合焊盘包括设置在其上的导电凸块。半导体器件还可以包括保护性外涂层。本发明还包括一种制造半导体器件的方法，包括在半导体晶片中形成断开的凹口，将电路迹线重定向到每个凹口中，以及沿着凹口将晶片分离，以在所得半导体器件的边缘上形成接合焊盘。将半导体器件附接到载体衬底的方法包括使半导体器件定向，使得接合焊盘与载体衬底的相应端子对准，并且在焊盘和端子之间建立电连接。优选地，导电材料设置在接合焊盘和端子之间，以在半导体器件和载体衬底之间建立导电接合。

9. 发明授权

US06191474B1 Vertically mountable interposer assembly and method 失效
标题翻译：垂直安装的插件，组装和方法
公开(公告)号：US06191474B1
公开(公告)日：2001-02-20
申请号：US09001406
申请日：1997-12-31
申请人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
发明人： Larry D. Kinsman , Walter L. Moden , Warren M. Farnworth
IPC分类号： H01L2312
CPC分类号： H05K3/301 , H01L23/32 , H01L25/105 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49169 , H01L2924/00
摘要： A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on the interposer, which electronically connect the semiconductor device to contacts on the interposer. The contacts are disposed along a single edge of the interposer. The invention also includes an alignment device for releaseably mounting the support assembly. The alignment device, which mounts to a carrier substrate, includes one or more receptacles. As a support assembly is inserted into a receptacle, the alignment device establishes an electrical connection between the contacts and corresponding terminals on the carrier substrate. The assembly may also include a cover that attaches to the top of the alignment device and biases the interposer against the carrier substrate.
摘要翻译：一种用于相对于载体基板垂直安装半导体器件的支撑组件。支撑组件包括插入件，半导体器件附接到该插入器。支撑组件还包括承载在插入器上的迹线，其将半导体器件电连接到插入器上的触点。触点沿着插入器的单个边缘设置。本发明还包括用于可释放地安装支撑组件的对准装置。安装到载体基板的对准装置包括一个或多个插座。当支撑组件插入到插座中时，对准装置在触点和载体基板上的相应端子之间建立电连接。组件还可以包括附接到对准装置的顶部并将插入件偏压抵靠载体基板的盖。

10. 发明授权

US6144560A Semiconductor device including combed bond pad opening, assemblies and methods 有权
标题翻译：半导体器件包括精梳接合焊盘开口，组件和方法
公开(公告)号：US6144560A
公开(公告)日：2000-11-07
申请号：US464992
申请日：1999-12-16
申请人： Warren M. Farnworth , Walter L. Moden , Larry D. Kinsman
发明人： Warren M. Farnworth , Walter L. Moden , Larry D. Kinsman
IPC分类号： H01L23/32 , H01L23/48 , H05K7/10
CPC分类号： H01L23/32 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/12042 , H01L2924/3011
摘要： A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.
摘要翻译：一种半导体器件，包括靠近其边缘的接合焊盘和外涂层。外涂层在每个接合焊盘周围形成凹口。外涂层可以由可光成像的材料例如可光成像的环氧树脂形成。本发明还包括将半导体器件垂直地固定在载体衬底上的对准装置。对准装置包括对应于半导体器件的接合焊盘的中间导电元件。在将半导体器件插入到对准装置中时，凹口有助于键合焊盘与其对应的中间导电元件的对准。中间导电元件在半导体器件和载体衬底之间建立电连接。

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