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    • 4. 发明授权
    • Vertical surface mount assembly and methods
    • 垂直表面安装组件及方法
    • US06455351B2
    • 2002-09-24
    • US09819297
    • 2001-03-27
    • Larry D. KinsmanJerry M. BrooksWarren M. FarnworthWalter L. ModenTerry R. Lee
    • Larry D. KinsmanJerry M. BrooksWarren M. FarnworthWalter L. ModenTerry R. Lee
    • H01L2144
    • H05K3/301H01L2924/0002Y10T29/4913H01L2924/00
    • A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferable, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.
    • 一种可垂直安装的半导体器件组件,包括半导体器件和用于将半导体器件附着到载体衬底的机构。 半导体器件的每个接合焊盘都设置在其单个边缘附近。 优选地,半导体器件的至少一部分被暴露。 对准装置附接到载体基板。 可垂直安装的半导体器件封装上的安装元件与对准装置接合以使半导体器件和对准器件互连。 优选地,对准装置将垂直安装的半导体器件封装相对于载体衬底垂直固定。 接合焊盘和载体基板上的对应端子之间的距离非常小以减少阻抗。 垂直安装的半导体器件封装也可以容易地用户升级。