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1. 发明授权

US08780552B2 Liquid cooling system for stackable modules in energy-efficient computing systems 有权
标题翻译：用于节能计算系统中可堆叠模块的液体冷却系统
公开(公告)号：US08780552B2
公开(公告)日：2014-07-15
申请号：US13435811
申请日：2012-03-30
申请人： Wael R El-Essawy , Thomas W Keller , Jarrod A. Roy , Juan C. Rubio
发明人： Wael R El-Essawy , Thomas W Keller , Jarrod A. Roy , Juan C. Rubio
IPC分类号： H05K7/20
CPC分类号： H05K7/02 , G06F1/18 , G06F1/181 , G06F1/20 , H05K7/20
摘要： A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.
摘要翻译：提供了一种计算系统。在计算系统中，以三维十六指肠配置物理排列的多个模块。在计算系统中，所述至少一个模块是填充有非导电液体冷却剂的液密模块或者通过冷却剂循环冷却的模块，所述冷却剂循环通过安装在电子部件上的冷板。在计算系统中，液体冷却剂通过至少一个泵通过多个软管通过多个热交换器中的至少一个在闭环中循环。在计算系统中，多个热交换器耦合到计算系统表面的外部部分。在计算系统中，多个热交换器通过暴露于周围空气的镀锡管冷却液体冷却剂。

2. 发明授权

US08787015B2 Liquid cooling system for stackable modules in energy-efficient computing systems 失效
标题翻译：用于节能计算系统中可堆叠模块的液体冷却系统
公开(公告)号：US08787015B2
公开(公告)日：2014-07-22
申请号：US13435998
申请日：2012-03-30
申请人： Wael R. El-Essawy , Thomas W Keller , Jarrod A. Roy , Juan C. Rubio
发明人： Wael R. El-Essawy , Thomas W Keller , Jarrod A. Roy , Juan C. Rubio
IPC分类号： H05K7/20
CPC分类号： H05K7/02 , G06F1/18 , G06F1/181 , G06F1/20 , H05K7/20
摘要： A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.
摘要翻译：提供一种处理模块，其包括一组处理模块侧面，每个处理模块侧面包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。每个处理模块侧耦合到另一处理模块侧以形成模块化处理模块。模块化处理模块包括到电源和通信系统的外部连接以及耦合到多个处理节点的多个冷板。液体冷却剂通过多个冷板通过至少一个泵通过多个管并通过至少一个热交换器经由闭环循环。至少一个热交换器耦合到处理模块的外部部分。所述至少一个热交换器使用围绕所述处理模块的空气冷却所述液体冷却剂。

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