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1. 发明授权

US10498310B2 Protective cover for an acoustic wave device and fabrication method thereof 有权
公开(公告)号：US10498310B2
公开(公告)日：2019-12-03
申请号：US15070383
申请日：2016-03-15
申请人： WIN Semiconductors Corp.
发明人： Cheng-Kuo Lin , Shu-Hsiao Tsai , Rong-Hao Syu , Yi-Ling Liu , Re-Ching Lin , Pei-Chun Liao
IPC分类号： H03H9/10
CPC分类号： H03H9/1071 , H03H9/1014
摘要： A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device. The fabrication method comprises: defining a sacrificial area on the acoustic wave device; forming a sacrificial layer on the sacrificial area; covering a metal covering layer on the sacrificial layer and connecting a bottom rim of the metal covering layer to the acoustic wave device and forming an opening between the bottom rim of the metal covering layer and the acoustic wave device; and removing the sacrificial layer to form a cavity between the metal covering layer and the resonant area by using a chemical solution, wherein the chemical solution enters from the opening between the metal covering layer and the acoustic wave device.

2. 发明申请

US20170077899A1 Protective Cover for an Acoustic Wave Device and Fabrication Method Thereof 审中-公开
标题翻译：声波装置的保护罩及其制造方法
公开(公告)号：US20170077899A1
公开(公告)日：2017-03-16
申请号：US15070383
申请日：2016-03-15
申请人： WIN Semiconductors Corp.
发明人： Cheng-Kuo Lin , Shu-Hsiao Tsai , Rong-Hao Syu , Yi-Ling Liu , Re-Ching Lin , Pei-Chun Liao
IPC分类号： H03H9/10
CPC分类号： H03H9/1071 , H03H9/1014
摘要： A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device. The fabrication method comprises: defining a sacrificial area on the acoustic wave device; forming a sacrificial layer on the sacrificial area; covering a metal covering layer on the sacrificial layer and connecting a bottom rim of the metal covering layer to the acoustic wave device and forming an opening between the bottom rim of the metal covering layer and the acoustic wave device; and removing the sacrificial layer to form a cavity between the metal covering layer and the resonant area by using a chemical solution, wherein the chemical solution enters from the opening between the metal covering layer and the acoustic wave device.
摘要翻译：一种用于在包装操作期间保护具有共振区域的声波装置的声波装置保护罩及其制造方法，以避免模制化合物流入声波装置的谐振区域。制造方法包括：在声波装置上限定牺牲区域; 在牺牲区上形成牺牲层; 覆盖牺牲层上的金属覆盖层，并将金属覆盖层的底边缘连接到声波器件，并在金属覆盖层的底边缘与声波器件之间形成开口; 并且通过使用化学溶液去除牺牲层以在金属覆盖层和谐振区域之间形成空腔，其中化学溶液从金属覆盖层和声波器件之间的开口进入。

3. 发明授权

US10453805B2 Protection structure for semiconductor device package 有权
公开(公告)号：US10453805B2
公开(公告)日：2019-10-22
申请号：US15147401
申请日：2016-05-05
申请人： WIN Semiconductors Corp.
发明人： Pei-Chun Liao , Po-Wei Ting , Chih-Feng Chiang , Yu-Kai Wu , Yu-Fan Chang , Re-Ching Lin , Shu-Hsiao Tsai , Cheng-Kuo Lin
IPC分类号： H01L23/00 , H01L25/16 , B81B7/00 , G01C19/5783
摘要： A chip stack having a protection structure for semiconductor device package, which comprises a first chip and a second chip stacked with each other, wherein said first chip has a first surface, said second chip has a second surface, said first surface and said second surface are two surfaces facing to each other, wherein at least one metal pillar is formed on at least one of said first surface and said second surface and connected with the other, at least one protection ring is formed on at least one of said first surface and said second surface and having a first gap with the other, and at least one electrical device is formed on at least one of said first surface and said second surface, wherein said at least one electrical device is located inside at least one of said at least one protection ring.

4. 发明申请

US20170272052A1 Protective Cover for an Acoustic Wave Device and Fabrication Method Thereof 审中-公开
公开(公告)号：US20170272052A1
公开(公告)日：2017-09-21
申请号：US15617576
申请日：2017-06-08
申请人： WIN Semiconductors Corp.
发明人： Cheng-Kuo Lin , Shu-Hsiao Tsai , Rong-Hao Syu , Yi-Ling Liu , Re-Ching Lin , Pei-Chun Liao , Chih-Feng Chiang
IPC分类号： H03H9/10 , G01K7/16 , G01K7/34 , G01K13/00
CPC分类号： H03H9/1071 , G01K7/16 , G01K7/34 , G01K13/00 , H03H9/1014
摘要： A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area on a surface of a substrate during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device, wherein at least one electrical device is provided on the surface of the substrate and the at least one electrical device includes a temperature sensor. The acoustic wave device protection structure comprising: a metal covering layer, having a concave surface and a bottom rim, the bottom rim connected to the acoustic wave device and forming at least one opening between the bottom rim and the acoustic wave device, and the concave surface covering over the resonant area to form a cavity between the concave surface and the resonant area.

5. 发明授权

US10298203B2 Protection structure for semiconductor device package 有权
公开(公告)号：US10298203B2
公开(公告)日：2019-05-21
申请号：US15474613
申请日：2017-03-30
申请人： WIN Semiconductors Corp.
发明人： Pei-Chun Liao , Po-Wei Ting , Chih-Feng Chiang , Yu-Kai Wu , Yu-Fan Chang , Re-Ching Lin , Shu-Hsiao Tsai , Cheng-Kuo Lin
IPC分类号： B81B7/00 , G01C19/5783 , H01L23/00 , H01L25/16 , H03H9/25
摘要： A chip stack having a protection structure for semiconductor device package comprises a first chip and a second chip stacked with each other. A first surface of the first chip and a second surface of the second chip are facing to each other. At least one metal pillar is formed on at least one of the first surface and the second surface and connected with the other. At least one protection ring is formed on at least one of the first surface and the second surface and having a first gap with the other. At least one electrical device is formed on at least one of the first surface and the second surface and is located inside at least one of the at least one protection ring, wherein the at least one electrical device includes a temperature sensor.

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