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    • 1. 发明申请
    • Electronic unit with EMC shielding
    • 带EMC屏蔽的电子单元
    • US20060152912A1
    • 2006-07-13
    • US11328578
    • 2006-01-10
    • Volker KarrerMichael Kirchberger
    • Volker KarrerMichael Kirchberger
    • H01R12/16
    • B60R16/0239H05K7/209H05K7/20927H05K9/0049
    • To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and electrically coupled to a first metal plate. The first metal plate is coupled in turn to a second metal plate in a particular manner via a first insulating layer. A metal housing with a heat sink through which a cooling fluid can flow is disposed, on another side of a second insulating layer. The improvement in EMC is based on an internal short-circuiting of an interference current produced by the power device over a very short loop.
    • 为了改善包含至少一个在高频率下工作的电子设备的电子设备的EMC屏蔽和与该设备热耦合以提供散热的金属外壳,具有设备端子的功率器件被热耦合到第一金属板 。 第一金属板通过第一绝缘层以特定方式依次耦合到第二金属板。 在第二绝缘层的另一侧上设置有具有冷却流体可以流过的散热器的金属外壳。 EMC的改进是基于功率器件在非常短的回路中产生的干扰电流的内部短路。
    • 3. 发明授权
    • Electronic unit with EMC shielding
    • 带EMC屏蔽的电子单元
    • US07272015B2
    • 2007-09-18
    • US11328578
    • 2006-01-10
    • Volker KarrerMichael Kirchberger
    • Volker KarrerMichael Kirchberger
    • H01R12/16
    • B60R16/0239H05K7/209H05K7/20927H05K9/0049
    • To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and electrically coupled to a first metal plate. The first metal plate is coupled in turn to a second metal plate in a particular manner via a first insulating layer. A metal housing with a heat sink through which a cooling fluid can flow is disposed, on another side of a second insulating layer. The improvement in EMC is based on an internal short-circuiting of an interference current produced by the power device over a very short loop.
    • 为了改善包含至少一个高频工作的电子设备的电子设备的EMC屏蔽和与该设备热耦合以提供散热的金属外壳,具有设备端子的功率器件被热耦合到第一金属板 。 第一金属板通过第一绝缘层以特定方式依次耦合到第二金属板。 在第二绝缘层的另一侧上设置有具有冷却流体可以流过的散热器的金属外壳。 EMC的改进是基于功率器件在非常短的回路中产生的干扰电流的内部短路。