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    • 9. 发明申请
    • Layout and Method of Singulating Miniature Ultrasonic Transducers
    • 微型超声波传感器的布局和方法
    • US20140184023A1
    • 2014-07-03
    • US14105902
    • 2013-12-13
    • Volcano Corporation
    • Cheryl RiceDongjuan Chris Xi
    • H01L41/04H01L41/332B06B1/06H01L41/053H01L41/16
    • H01L41/332B06B1/0651B06B1/0685H01L41/098H01L41/193H01L41/338
    • The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer.
    • 本公开提供了一种从晶片分离多个微型超声换能器的方法。 该方法包括接收其上形成有多个微型超声换能器的晶片。 微型超声波换能器包括含有压电材料的换能器膜。 该方法包括从晶片的前侧蚀刻多个沟槽进入晶片。 在顶视图中,每个沟槽至少部分地围绕相应的一个微型超声换能器。 每个沟槽包括近似圆形的段。 该方法包括从与前侧相反的背面使晶片变薄。 执行晶片的薄化,使得沟槽向后侧开放。 该方法包括对晶片执行切割处理以将微型超声换能器彼此分离。 切割过程在晶片上不进行交叉切割的情况下进行。