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1. 发明授权

US07375874B1 Light modulator with integrated drive and control circuitry 失效
标题翻译：具有集成驱动和控制电路的光调制器
公开(公告)号：US07375874B1
公开(公告)日：2008-05-20
申请号：US11472954
申请日：2006-06-21
申请人： Vlad Novotny , Bharat Sastri , Chitranjan N. Reddy
发明人： Vlad Novotny , Bharat Sastri , Chitranjan N. Reddy
IPC分类号： G02B26/00 , H01L21/00 , H01L29/84 , C23F1/00
CPC分类号： G02B26/0841 , B81B2201/047 , B81B2207/015 , B81C1/00238 , G09G3/346 , G09G2300/023 , G09G2300/0426 , G09G2300/0439 , G09G2300/0842 , H01L27/06
摘要： Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.
摘要翻译：描述了与CMOS控制电子单片集成的MEMS镜阵列。 MEMS阵列包括机械优于其他MEMS应用中使用的金属的多晶硅或多晶硅 - 锗组件，但需要与常规CMOS技术不兼容的工艺温度。与多晶硅或锗锗结构一起使用的CMOS电路使用可承受MEMS制造过程中使用的高温的互连材料。这些互连材料包括掺杂多晶硅，多硅化物和钨金属。

2. 发明授权

US07015885B2 MEMS devices monolithically integrated with drive and control circuitry 有权
标题翻译： MEMS器件与驱动器和控制电路单片集成
公开(公告)号：US07015885B2
公开(公告)日：2006-03-21
申请号：US10861963
申请日：2004-06-04
申请人： Vlad Novotny , Bharat Sastri , Chitranjan N. Reddy
发明人： Vlad Novotny , Bharat Sastri , Chitranjan N. Reddy
IPC分类号： G09G3/34 , G09G5/00
CPC分类号： B81C1/00246 , B81C2203/0735 , G02B26/0841
摘要： Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.
摘要翻译：描述了与CMOS控制电子单片集成的MEMS镜阵列。 MEMS阵列包括机械优于其他MEMS应用中使用的金属的多晶硅或多晶硅 - 锗组件，但需要与常规CMOS技术不兼容的工艺温度。与多晶硅或锗锗结构一起使用的CMOS电路使用可承受MEMS制造过程中使用的高温的互连材料。这些互连材料包括掺杂多晶硅，多硅化物和钨金属。

3. 发明授权

US07075701B2 Light modulator with integrated drive and control circuitry 失效
标题翻译：具有集成驱动和控制电路的光调制器
公开(公告)号：US07075701B2
公开(公告)日：2006-07-11
申请号：US11286075
申请日：2005-11-23
申请人： Vlad Novotny , Bharat Sastri , Chitranjan N. Reddy
发明人： Vlad Novotny , Bharat Sastri , Chitranjan N. Reddy
IPC分类号： G02B26/00 , H01L21/00 , H01L29/84 , C23F1/00
CPC分类号： B81C1/00246 , B81C2203/0735 , G02B26/0841
摘要： Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.
摘要翻译：描述了与CMOS控制电子单片集成的MEMS镜阵列。 MEMS阵列包括机械优于其他MEMS应用中使用的金属的多晶硅或多晶硅 - 锗组件，但需要与常规CMOS技术不兼容的工艺温度。与多晶硅或锗锗结构一起使用的CMOS电路使用可承受MEMS制造过程中使用的高温的互连材料。这些互连材料包括掺杂多晶硅，多硅化物和钨金属。

4. 发明授权

US06301629B1 High speed/low speed interface with prediction cache 失效
标题翻译：具有预测缓存的高速/低速接口
公开(公告)号：US06301629B1
公开(公告)日：2001-10-09
申请号：US09034537
申请日：1998-03-03
申请人： Bharat Sastri , Thomas Alexander , Chitranjan N. Reddy
发明人： Bharat Sastri , Thomas Alexander , Chitranjan N. Reddy
IPC分类号： G06F1338
CPC分类号： G06F13/4059
摘要： The present invention provides a monolithic or discrete high speed/low speed interface that is capable of interfacing with the high speed subsystems of a data processing system and low speed subsystems of a data processing system. In one embodiment, the high speed/low speed interface subsystem of the present invention comprises a high speed interface for interfacing with high speed subsystems via a high speed bus, a low speed interface for interfacing with low speed subsystems via a low speed bus, a control circuitry coupled to both the high speed and low speed interfaces, and an internal bus coupled to the control circuitry and the high speed and low speed interfaces. The control circuitry controls the transfer of information between the interfaces. In a second embodiment of the present invention, the high speed/low speed interface subsystem of the present invention comprises all the elements of the first embodiment and a prediction unit. In a third embodiment of the present invention, the high speed/low speed interface subsystem comprises all the elements of the second embodiment and a memory controller. The embodiments of the present invention could be implemented with discrete components or could be implemented on a single semiconductor substrate.
摘要翻译：本发明提供了能够与数据处理系统的高速子系统和数据处理系统的低速子系统进行接口的单片或离散高速/低速接口。在一个实施例中，本发明的高速/低速接口子系统包括用于经由高速总线与高速子系统接口的高速接口，用于经低速总线与低速子系统接口的低速接口，耦合到高速和低速接口的控制电路以及耦合到控制电路和高速和低速接口的内部总线。控制电路控制接口之间的信息传输。在本发明的第二实施例中，本发明的高速/低速接口子系统包括第一实施例的所有元件和预测单元。在本发明的第三实施例中，高速/低速接口子系统包括第二实施例的所有元件和存储器控制器。本发明的实施例可以用分立元件实现，或者可以在单个半导体衬底上实现。

5. 发明申请

US20050002079A1 MEMS devices monolithically integrated with drive and control circuitry 有权
标题翻译： MEMS器件与驱动器和控制电路单片集成
公开(公告)号：US20050002079A1
公开(公告)日：2005-01-06
申请号：US10861963
申请日：2004-06-04
申请人： Vlad Novotny , Bharat Sastri , Chitranjan Reddy
发明人： Vlad Novotny , Bharat Sastri , Chitranjan Reddy
IPC分类号： G02B26/08 , H01L21/00 , G02F1/03 , G02F1/07
CPC分类号： B81C1/00246 , B81C2203/0735 , G02B26/0841
摘要： Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.
摘要翻译：描述了与CMOS控制电子单片集成的MEMS镜阵列。 MEMS阵列包括机械优于其他MEMS应用中使用的金属的多晶硅或多晶硅 - 锗组件，但需要与常规CMOS技术不兼容的工艺温度。与多晶硅或锗锗结构一起使用的CMOS电路使用可承受MEMS制造过程中使用的高温的互连材料。这些互连材料包括掺杂多晶硅，多硅化物和钨金属。

6. 发明申请

US20060077531A1 Light modulator with integrated drive and control circuitry 失效
公开(公告)号：US20060077531A1
公开(公告)日：2006-04-13
申请号：US11286075
申请日：2005-11-23
申请人： Vlad Novotny , Bharat Sastri , Chitranjan Reddy
发明人： Vlad Novotny , Bharat Sastri , Chitranjan Reddy
IPC分类号： G02B26/00
CPC分类号： B81C1/00246 , B81C2203/0735 , G02B26/0841
摘要： Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

7. 发明申请

US20060015579A1 Architecture and protocol for a wireless communication network to provide scalable web services to mobile access devices 审中-公开
标题翻译：用于无线通信网络的架构和协议，以向移动接入设备提供可扩展的web服务
公开(公告)号：US20060015579A1
公开(公告)日：2006-01-19
申请号：US10892975
申请日：2004-07-16
申请人： Bharat Sastri , Shiv Balakrishnan
发明人： Bharat Sastri , Shiv Balakrishnan
IPC分类号： G06F15/16
CPC分类号： H04W84/00 , H04L51/38 , H04W4/00 , H04W80/00 , H04W88/02
摘要： A network architecture for small, low-cost, high functionality portable wireless devices which shifts many of the functions performed in typical handheld communication devices to a central Application Server (AS) computer. Communication between the AS and the portable devices is performed using standard Internet Protocol (IP) devices. The AS includes a Client Proxy Server (CPS) which interfaces of applications on the server, and Device Personality Objects (DPOs) that handle the special characteristics of each different types of portable devices. Each portable device has a unique CPS/DPO pair running on the AS that accepts input from the portable devices and provides input to the various applications on the AS and which accepts outputs from the various applications and passes it to the portable devices. Communication from the portable devices to the AS is entirely via IP packets.
摘要翻译：用于小型，低成本，高功能的便携式无线设备的网络架构，其将在典型的手持通信设备中执行的许多功能转移到中央应用服务器（AS）计算机。 AS和便携式设备之间的通信使用标准互联网协议（IP）设备进行。 AS包括客户端代理服务器（CPS），服务器上的应用程序接口以及处理每种不同类型便携式设备的特殊特性的设备个性对象（DPO）。每个便携式设备具有在AS上运行的独特的CPS / DPO对，其接受来自便携式设备的输入，并向AS上的各种应用提供输入，并且接收来自各种应用的输出并将其传递到便携式设备。从便携式设备到AS的通信完全通过IP数据包。

8. 发明授权

US06785255B2 Architecture and protocol for a wireless communication network to provide scalable web services to mobile access devices 有权
标题翻译：用于无线通信网络的架构和协议，以向移动接入设备提供可扩展的web服务
公开(公告)号：US06785255B2
公开(公告)日：2004-08-31
申请号：US10099370
申请日：2002-03-13
申请人： Bharat Sastri , Shiv Balakrishnan
发明人： Bharat Sastri , Shiv Balakrishnan
IPC分类号： H04Q724
CPC分类号： H04M1/72522 , H04L67/04 , H04L67/28 , H04L67/2823 , H04L67/2857 , H04L67/2895 , H04L69/329 , H04M1/2535 , H04M1/72547 , H04M1/72561 , H04W4/00 , H04W4/18 , H04W88/02 , H04W88/182
摘要： A network architecture for small, low-cost, high functionality portable wireless devices which shifts many of the functions performed in typical handheld communication devices to a central Application Server (AS) computer. Communication between the AS and the portable devices is performed using standard Internet Protocol (IP) packets. The AS includes a Client Proxy Server (CPS) which interfaces to applications on the server, and Device Personality Objects (DPOs) that handle the special characteristics of each different types of portable devices. Each portable device has a unique CPS/DPO pair running on the AS that accepts input from the portable devices and provides input to the various applications on the AS and which accepts outputs from the various applications and passes it to the portable devices. Communication from the portable devices to the AS is entirely via IP packets.
摘要翻译：用于小型，低成本，高功能的便携式无线设备的网络架构，其将在典型的手持通信设备中执行的许多功能转移到中央应用服务器（AS）计算机。 AS和便携式设备之间的通信使用标准互联网协议（IP）数据包进行。 AS包括与服务器上的应用程序接口的客户端代理服务器（CPS），以及处理每种不同类型便携式设备的特殊特性的设备个性对象（DPO）。每个便携式设备具有在AS上运行的独特的CPS / DPO对，其接受来自便携式设备的输入，并向AS上的各种应用提供输入，并且接收来自各种应用的输出并将其传递到便携式设备。从便携式设备到AS的通信完全通过IP数据包。

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