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1. 发明授权

US09275322B2 Stretchable multi-layer wearable tag capable of wireless communications 有权
公开(公告)号：US09275322B2
公开(公告)日：2016-03-01
申请号：US14454457
申请日：2014-08-07
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Jie Li
IPC分类号： G06K19/077
CPC分类号： G06K19/07762 , G06K19/07722 , G06K19/0775 , G06K19/07773
摘要： A wearable tag capable of wireless communications includes a first elastic layer, a second elastic layer over the first elastic layer, wherein the second elastic layer is embedded with a first conductive circuit. The wearable tag includes a dielectric layer on the second elastic layer, a third elastic layer on the dielectric layer, wherein the third elastic layer is embedded with a second conductive circuit, wherein the dielectric layer comprises via holes that contain electric connections between the semiconductor chip and the first conductive circuit. A semiconductor chip is in connection with the first conductive circuit and the second conductive circuit, wherein the semiconductor chip, the first conductive circuit, and the second conductive circuit are configured to wirelessly communicate with external devices. The wearable tag also includes a fourth elastic layer on the semiconductor chip.

2. 发明申请

US20160026213A1 Highly compliant wearable wireless patch having stress-relief capability 有权
标题翻译：高度兼容的可佩戴无线贴片，具有应力消除能力
公开(公告)号：US20160026213A1
公开(公告)日：2016-01-28
申请号：US14491665
申请日：2014-09-19
申请人： VivaLnk Limited (Cayman Islands)
发明人： Jiang Li , Junfeng Mei
IPC分类号： G06F1/16
CPC分类号： G06F1/163 , A61M35/00 , A61M37/00 , H01Q1/273 , H01Q9/0407 , H05K1/028 , H05K1/0283 , H05K1/0313 , H05K1/142 , H05K1/148 , H05K1/183
摘要： A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.
摘要翻译：能够进行无线通信的穿戴式贴片包括粘合剂层和可剪切电路层，其包括在粘合剂层上包括一个或多个开口的支撑衬底，其中支撑衬底中的一个或多个开口被定位成允许可剪切电路层被剪裁和伸长，透气。导电电路嵌入支撑基板。一个或多个半导体芯片与导电电路连接。弹性层位于可剪切电路层上。一个或多个半导体芯片和导电电路可以与外部设备无线通信。

3. 发明授权

US09993203B2 Electronic stickers with modular structures 有权
公开(公告)号：US09993203B2
公开(公告)日：2018-06-12
申请号：US14552433
申请日：2014-11-24
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Jiang Li
IPC分类号： A61B5/00 , H04B5/00 , A61B5/04 , A61B5/01
CPC分类号： A61B5/6833 , A61B5/0006 , A61B5/0022 , A61B5/01 , A61B5/04 , H04B5/0031 , H04B5/0062
摘要： An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

4. 发明授权

US09513666B2 Highly compliant wearable wireless patch having stress-relief capability 有权
公开(公告)号：US09513666B2
公开(公告)日：2016-12-06
申请号：US14491665
申请日：2014-09-19
申请人： VivaLnk Limited (Cayman Islands)
发明人： Jiang Li , Junfeng Mei
IPC分类号： H05K1/18 , G06F1/16 , A61M35/00 , A61M37/00 , H01Q1/27 , H05K1/02 , H05K1/03 , H05K1/14 , H01Q9/04
CPC分类号： G06F1/163 , A61M35/00 , A61M37/00 , H01Q1/273 , H01Q9/0407 , H05K1/028 , H05K1/0283 , H05K1/0313 , H05K1/142 , H05K1/148 , H05K1/183
摘要： A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

5. 发明授权

US09483726B2 Three dimensional electronic patch 有权
标题翻译：三维电子贴片
公开(公告)号：US09483726B2
公开(公告)日：2016-11-01
申请号：US14814347
申请日：2015-07-30
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Zhigang Wang
IPC分类号： G01K13/00 , G06K19/077 , H01Q1/27 , A61B5/01 , A61B5/00 , H01Q1/22 , H01Q7/00
CPC分类号： A61B5/01 , A61B5/0002 , A61B5/0008 , A61B5/0205 , A61B5/024 , A61B5/0476 , A61B5/6814 , A61B5/6833 , A61B2560/0252 , G01K13/002 , G06K19/0776 , G06K19/07773 , H01Q1/2225 , H01Q1/273 , H01Q7/00
摘要： A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.
摘要翻译：三维电子贴片包括平坦柔性电路基板，其包括包括第一部分和第二部分的弹性层。第二部分至少包括连接到弹性层的一侧和由弹性层中的一个或多个切口限定的一个或多个侧面。三维电子贴片还包括在弹性层的第一部分上的第一传感器，在弹性层的第一部分下方并与第一传感器电连接的第一导电感测垫，以及在第二部分下的导电层的弹性层并与第一传感器电连接。第二部分被折叠以将导电层定位成远离第一部分。

6. 发明申请

US20160171363A1 Three dimensional electronic patch 有权
公开(公告)号：US20160171363A1
公开(公告)日：2016-06-16
申请号：US14814347
申请日：2015-07-30
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Zhigang Wang
IPC分类号： G06K19/077 , A61B5/01 , A61B5/00 , H01Q1/27
CPC分类号： A61B5/01 , A61B5/0002 , A61B5/0008 , A61B5/0205 , A61B5/024 , A61B5/0476 , A61B5/6814 , A61B5/6833 , A61B2560/0252 , G01K13/002 , G06K19/0776 , G06K19/07773 , H01Q1/2225 , H01Q1/273 , H01Q7/00
摘要： A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

7. 发明申请

US20160066854A1 Electronic Stickers with Modular Structures 有权
标题翻译：具有模块化结构的电子贴纸
公开(公告)号：US20160066854A1
公开(公告)日：2016-03-10
申请号：US14552433
申请日：2014-11-24
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Jiang Li
IPC分类号： A61B5/00 , H05K1/02 , A61B5/04 , H04B5/00
CPC分类号： A61B5/6833 , A61B5/0006 , A61B5/0022 , A61B5/01 , A61B5/04 , H04B5/0031 , H04B5/0062
摘要： An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.
摘要翻译：电子贴纸组件包括第一电子贴纸，其包括上表面，下表面和上表面上的第一组导电连接点，第一电子贴纸上的第一粘合剂层，包括第一窗口。第一窗口定位成暴露第一组一个或多个导电连接点。第一粘合剂层上的第二电子标签包括下表面和下表面上的一个或多个第二导电连接点。第一电子标签的上表面上的第一组导电连接点通过第一粘合剂层中的第一窗口与第二电子标签的下表面上的一个或多个第二导电连接点接触。

8. 发明授权

US09632533B2 Stretchable wireless device 有权
公开(公告)号：US09632533B2
公开(公告)日：2017-04-25
申请号：US14511578
申请日：2014-10-10
申请人： VivaLnk Limited (Cayman Islands)
发明人： Jiang Li , Junfeng Mei
IPC分类号： H05K7/00 , G06F1/16 , A61M35/00 , A61M37/00 , H01Q1/27 , H05K1/02 , H05K1/03 , H05K1/14 , H05K1/18 , H01Q9/04
CPC分类号： G06F1/163 , A61M35/00 , A61M37/00 , H01Q1/273 , H01Q9/0407 , H05K1/028 , H05K1/0283 , H05K1/0313 , H05K1/142 , H05K1/148 , H05K1/183
摘要： A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

9. 发明授权

US09563836B2 Stretchable multi-layer wearable tag capable of wireless communications 有权
标题翻译：可伸缩多层耐磨标签，能够进行无线通讯
公开(公告)号：US09563836B2
公开(公告)日：2017-02-07
申请号：US14997660
申请日：2016-01-18
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Jie Li
IPC分类号： H01Q1/12 , G06K19/077
CPC分类号： G06K19/07762 , G06K19/07722 , G06K19/0775 , G06K19/07773
摘要： A wearable tag capable of wireless communications includes a first elastic layer, a second elastic layer over the first elastic layer, wherein the second elastic layer is embedded with a first conductive circuit. The wearable tag includes a dielectric layer on the second elastic layer, a third elastic layer on the dielectric layer, wherein the third elastic layer is embedded with a second conductive circuit, wherein the dielectric layer comprises via holes that contain electric connections between the semiconductor chip and the first conductive circuit. A semiconductor chip is in connection with the first conductive circuit and the second conductive circuit, wherein the semiconductor chip, the first conductive circuit, and the second conductive circuit are configured to wirelessly communicate with external devices. The wearable tag also includes a fourth elastic layer on the semiconductor chip.
摘要翻译：能够进行无线通信的穿戴式标签包括第一弹性层，第一弹性层上的第二弹性层，其中第二弹性层嵌有第一导电电路。所述耐磨标签包括在所述第二弹性层上的电介质层，所述电介质层上的第三弹性层，其中所述第三弹性层嵌有第二导电电路，其中所述电介质层包括通孔，所述通孔包含所述半导体芯片和第一导电电路。半导体芯片与第一导电电路和第二导电电路连接，其中半导体芯片，第一导电电路和第二导电电路被配置为与外部设备无线通信。耐磨标签还包括半导体芯片上的第四弹性层。

10. 发明授权

US09560975B2 Three dimensional electronic patch 有权
公开(公告)号：US09560975B2
公开(公告)日：2017-02-07
申请号：US15274119
申请日：2016-09-23
申请人： VivaLnk Limited (Cayman Islands)
发明人： Junfeng Mei , Zhigang Wang
IPC分类号： G01K13/00 , A61B5/01 , G06K19/077 , A61B5/00 , H01Q7/00 , H01Q1/22
CPC分类号： A61B5/01 , A61B5/0002 , A61B5/0008 , A61B5/0205 , A61B5/024 , A61B5/0476 , A61B5/6814 , A61B5/6833 , A61B2560/0252 , G01K13/002 , G06K19/0776 , G06K19/07773 , H01Q1/2225 , H01Q1/273 , H01Q7/00
摘要： A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

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