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1. 发明授权

US4482209A Mirror structure 失效
标题翻译：镜面结构
公开(公告)号：US4482209A
公开(公告)日：1984-11-13
申请号：US346099
申请日：1982-02-05
申请人： Virinder Grewal , Werner Reindl
发明人： Virinder Grewal , Werner Reindl
IPC分类号： G02B5/08 , G02B1/10 , G02B5/09 , G02B5/28 , H01S3/08 , B32B3/00 , B32B9/00 , C25D11/02
CPC分类号： G02B5/09 , G02B5/0858 , G02B26/12 , Y10T428/1259
摘要： A mirror structure which is provided on a polished metallic surface characterized by an adhesive layer disposed directly on the surface, an amorphous intermediate layer disposed on the adhesive layer, a reflective layer disposed on the amorphous intermediate layer and a protective layer covering the reflective layer. The mirror structure is particularly useful for a highly adhesive and corrosion-proof laser mirror which has good reflection properties and is used in a laser flatbed scanner.
摘要翻译：提供在抛光金属表面上的镜面结构，其特征在于直接设置在表面上的粘合剂层，设置在粘合剂层上的非晶中间层，设置在非晶中间层上的反射层和覆盖反射层的保护层。镜面结构对于具有良好反射性能并用于激光平板扫描仪的高粘合性和耐腐蚀的激光镜特别有用。

2. 发明授权

US4372809A Method for manufacturing solderable, temperable, thin film tracks which do not contain precious metal 失效
标题翻译：用于制造不含贵金属的可焊接，可回火的薄膜轨道的方法
公开(公告)号：US4372809A
公开(公告)日：1983-02-08
申请号：US346100
申请日：1982-02-05
申请人： Virinder Grewal , Werner Reindl
发明人： Virinder Grewal , Werner Reindl
IPC分类号： H05K3/34 , H01L27/01 , H05K1/16 , H05K3/06 , H05K3/24 , C23F1/02 , B05D5/12
CPC分类号： H05K3/244 , H01L27/016
摘要： A method for manufacturing solderable, temperable thin film tracks which do not contain precious metal on an electrically non-conductive substrate serving as a carrier employs the steps of applying an adhesive or resistance layer to the substrate, which serves as an intermediate layer, applying a conductive layer over the intermediate layer, and applying a protective anti-corrosion layer over the conductive layer. The protective layer may consist of aluminum or an aluminum alloy, or may be comprised of a combination of a layer of aluminum and a layer of chrome. An aluminum layer may also be applied between the intermediate layer and the conductive layer.
摘要翻译：在用作载体的不导电基材上不含有贵金属的可焊性，可回火的薄膜轨道的制造方法采用以下步骤：将粘合剂或电阻层施加到作为中间层的基底上，导电层，并在导电层上施加保护性防腐蚀层。保护层可以由铝或铝合金组成，或者可以由铝层和铬层的组合构成。也可以在中间层和导电层之间施加铝层。

3. 发明授权

US5175425A Process for marking semiconductor surfaces 失效
标题翻译：半导体表面标记工艺
公开(公告)号：US5175425A
公开(公告)日：1992-12-29
申请号：US744669
申请日：1991-08-09
申请人： Hans-Hermann Spratte , Werner Reindl
发明人： Hans-Hermann Spratte , Werner Reindl
IPC分类号： G06K1/12 , G06K19/06
CPC分类号： G06K1/126 , G06K19/06028 , G06K2019/06253 , Y10S235/901
摘要： The bar code (Sk) for marking semiconductor surfaces includes a plurality of parallel bar elements (Se) having identical widths (b), wherein every bar element (Se) is formed as a series of overlapping softmark melting points (SSp) produced by means of laser bombardment to a depth of less than 2 u m. Narrow bars (sSt) are preferably formed by means of one bar element (Se) and wide bars (bSt) are preferably formed by means of two bar elements (Se) which are applied at a slight distance (a) relative to one another. The process for marking semiconductor surfaces with this bar code includes producing by laser bombardment with a softmark technique a plurality of parallel bar elements (Se). Each bar element is formed by a series of overlapping softmark melting points (SSp). The melting points (SSp) of the bar elements (Se) are applied at a depth of less than 2 micrometers, and the laser bombardment is controlled with respect to time so that, when producing one of the softmark melting points (SSp), the previously produced softmark melting point is at least partially hardened again.
摘要翻译： PCT No.PCT / DE88 / 00357 Sec。 371日期二○○九年二月十五日 102（e）日期1989年2月15日PCT Filted 1987年6月15日PCT公布。出版物WO88 / 10475 日期为1988年12月29日。用于标记半导体表面的条形码（Sk）包括具有相同宽度（b）的多个平行条形元件（Se），其中每个条形元件（Se）形成为一系列重叠的软标记熔化通过激光轰击产生的深度小于2μm的点（SSp）。窄杆（sSt）优选地通过一个杆元件（Se）形成，并且宽杆（bSt）优选地通过相对于彼此以微小距离（a）施加的两个杆元件（Se）形成。利用该条形码来标记半导体表面的工艺包括通过软标记技术通过激光轰击产生多个平行条形元件（Se）。每个条形元件由一系列重叠的软标记熔点（SSp）形成。条形元件（Se）的熔点（SSp）以小于2微米的深度施加，并且相对于时间控制激光轰击，使得当产生软标记熔点（SSp）之一时，先前产生的软标记熔点至少部分地被硬化。

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