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1. 发明授权

US4357269A Molding compound 失效
标题翻译：成型化合物
公开(公告)号：US4357269A
公开(公告)日：1982-11-02
申请号：US241521
申请日：1981-03-09
申请人： Vincent R. Landi , Jeffrey L. Dalton
发明人： Vincent R. Landi , Jeffrey L. Dalton
IPC分类号： C08L31/00 , C08J3/20 , C08K9/10 , C08L31/08 , C08L35/02
CPC分类号： C08K9/10 , Y10S525/936
摘要： A molding compound is disclosed comprising a diallyl phthalate compound and capsules of water.
摘要翻译：公开了一种包含邻苯二甲酸二烯丙酯化合物和水胶囊的模塑料。

2. 发明授权

US06415104B1 Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions 有权
标题翻译：包含聚丁二烯和聚异戊二烯的热固性组合物的加热元件
公开(公告)号：US06415104B1
公开(公告)日：2002-07-02
申请号：US09539971
申请日：2000-03-31
申请人： Bruce B. Fitts , Elana E. Haveles , David E. Manso , Vincent R. Landi
发明人： Bruce B. Fitts , Elana E. Haveles , David E. Manso , Vincent R. Landi
IPC分类号： H05B340
CPC分类号： C08L9/00 , C08L53/00 , H05B3/42 , H05B3/46 , H05B3/48 , H05B3/82 , H05K1/032 , C08L2666/24 , C08L2666/04
摘要： Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.
摘要翻译：制品由基于聚丁二烯或聚异戊二烯树脂的热固性组合物形成，其经受大于250℃的高温固化步骤。热固性组合物可以包括填料，例如颗粒状陶瓷填料，还可以包括用于改善尺寸稳定性的织造网并降低脆性。本发明的形成方法特别适用于制造用于微波和数字电路的电路基板，通常以热固性组合物的形式层压在金属导电箔（例如铜）的一个或两个相对的表面上。该组合物特别用于封装和电绝缘用于流体的电阻加热元件。

3. 发明授权

US4725650A Heat stable phenolic composition containing aramid fibers 失效
标题翻译：含有芳族聚酰胺纤维的热稳定性酚醛组合物
公开(公告)号：US4725650A
公开(公告)日：1988-02-16
申请号：US834197
申请日：1986-02-27
申请人： Vincent R. Landi , Bruce B. Fitts
发明人： Vincent R. Landi , Bruce B. Fitts
IPC分类号： C08J5/04 , C08L61/06 , C08L9/00 , C08L47/00 , C08L61/04 , C08L61/12
CPC分类号： C08J5/04 , C08L61/06 , C08J2361/06
摘要： A phenolic compound having improved retention of useful properties over long periods of time at elevated temperatures is presented. The novel phenolic compound, preferably a glass reinforced phenol-formaldehyde with mineral fillers has incorporated therein elastomers which primarily undergo crosslinking on oxidative aging, such as butadiene based rubbers, and/or molecular sulfur or sulfur donor components. These additives unexpectedly retard thermal degradation with time of aging and provide exceptionally good retention of weight, molded dimensions and mechanical properties.
摘要翻译：提出了一种在高温下长时间保持有用性能的酚类化合物。新型酚类化合物，优选具有矿物填料的玻璃增强酚醛树脂，其中引入了主要在氧化老化上进行交联的弹性体，例如丁二烯基橡胶和/或分子硫或硫供体组分。这些添加剂意外地延缓了老化时的热降解，并提供了非常好的保持重量，成型尺寸和机械性能。

4. 发明授权

US06291374B1 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture 有权
标题翻译：聚丁二烯和聚异戊二烯基热固性组合物及其制备方法
公开(公告)号：US06291374B1
公开(公告)日：2001-09-18
申请号：US09531947
申请日：2000-03-21
申请人： Vincent R. Landi
发明人： Vincent R. Landi
IPC分类号： D03D300
CPC分类号： C08J5/24 , B32B15/08 , C08J2309/00 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L9/00 , C08L23/16 , C08L53/00 , H05K1/0203 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/2934 , Y10T442/2992 , Y10T442/3415 , Y10T442/3423 , Y10T442/3431 , Y10T442/3455 , C08L2666/06 , C08L2666/24
摘要： An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polyisoprene resin, an ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant additive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strength and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.
摘要翻译：提供一种电气基材材料，其包括包含热固性聚丁二烯或聚异戊二烯树脂的树脂基质，乙丙橡胶和任选的含热塑性不饱和丁二烯或含异戊二烯的聚合物; 颗粒状填料，阻燃添加剂，固化剂，织造或无纺织物。乙烯丙烯橡胶的存在增强了基材材料的热老化性能，特别是介电强度和机械性能，而材料的其它电学，化学和机械性能也不会受到不利影响。

5. 发明授权

US4647125A Solderless connector technique 失效
标题翻译：无焊接连接器技术
公开(公告)号：US4647125A
公开(公告)日：1987-03-03
申请号：US757602
申请日：1985-07-22
申请人： Vincent R. Landi , Edwin R. Rowlands
发明人： Vincent R. Landi , Edwin R. Rowlands
IPC分类号： H01R12/61 , H05K3/32 , H05K3/36 , H01R9/07
CPC分类号： H01R12/61 , H05K3/365 , Y10T29/49202
摘要： A solderless connector especially suited for interconnecting a flexible circuit to another circuit or component, either rigid or flexible, is presented. The solderless connector of the present invention utilizes the pressure mating of contact areas with the added advantage of a wiping or cleaning action on the contacting surfaces. In one embodiment of the present invention, this wiping action is achieved by bending or crimping the two layers adjacent to the contact areas, thereby causing them to have mutual relative sliding motion over each other as they are being pressed into contact therebetween. In another embodiment, the bending or crimping of the flexible circuit layers is accomplished in the structure of the solderless connector itself.
摘要翻译：提出了一种特别适用于将柔性电路与另一电路或组件（刚性或柔性）互连的无焊接连接器。本发明的无焊连接器利用接触区域的压力配合，并且在接触表面上具有擦拭或清洁作用的附加优点。在本发明的一个实施例中，这种擦拭作用是通过相邻于接触区域的两个层弯曲或压接来实现的，从而当它们被压接在它们之间时，使它们相互相对滑动运动。在另一个实施例中，柔性电路层的弯曲或压接在无焊接连接器本身的结构中实现。

6. 发明授权

US4610495A Solderless connector apparatus and method of making the same 失效
标题翻译：无焊接连接器装置及其制造方法
公开(公告)号：US4610495A
公开(公告)日：1986-09-09
申请号：US708981
申请日：1985-03-07
申请人： Vincent R. Landi
发明人： Vincent R. Landi
IPC分类号： H01R12/00 , H01R12/61 , H01R12/62 , H05K3/36 , H01R9/09
CPC分类号： H01R12/61 , H05K3/365 , H01R12/57 , Y10T29/49202
摘要： A solderless connection method and apparatus is presented wherein means are provided to either gradate or minimize the change in impedance between the contact portions of circuits which are to be connected therein. In a first embodiment of the present invention, a solderless electrical connector is provided in which impedance is gradated between the two different characteristic impedances of the circuits which are to be connected. The procedure for carrying out such a gradual change in impedance is the change in dielectric constant caused by compression of a shaped cellular polymeric material. In a second embodiment, a solderless electrical connection is provided which applies even pressure across the circuit element, but which also has a low dielectric constant. Such a connector includes syntactic foam produced by adding hollow microspheres, such as glass or silica microspheres, to an elastomer.
摘要翻译：提供了一种无焊接方法和装置，其中提供了用于使要连接在其中的电路的接触部分之间的阻抗变化渐变或最小化的装置。在本发明的第一实施例中，提供了一种无焊电连接器，其中阻抗在要连接的电路的两个不同特性阻抗之间变化。进行阻抗的这种逐渐变化的过程是由成形的多孔聚合材料的压缩引起的介电常数的变化。在第二实施例中，提供无焊电连接，其在电路元件上施加均匀的压力，但是也具有低的介电常数。这种连接器包括通过向弹性体中添加诸如玻璃或二氧化硅微球的空心微球而产生的复合泡沫。

7. 发明授权

US07022404B2 Circuit substrate material, circuits comprising the same, and method of manufacture thereof 有权
公开(公告)号：US07022404B2
公开(公告)日：2006-04-04
申请号：US10700343
申请日：2003-11-03
申请人： Murali Sethumadhavan , Vincent R. Landi , Bruce G. Kosa
发明人： Murali Sethumadhavan , Vincent R. Landi , Bruce G. Kosa
IPC分类号： B32B3/00 , H05K1/00
CPC分类号： H05K1/032 , B32B27/04 , C08K3/22 , C08K3/36 , C08K5/14 , C08L9/00 , C08L27/12 , H05K1/0373 , H05K2201/015 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24917 , Y10T428/249933 , Y10T428/25 , Y10T428/3154 , Y10T428/31605 , Y10T428/31609 , Y10T428/31707 , C08L2666/04
摘要： An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.

8. 发明授权

US06586533B1 Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions 失效
标题翻译：聚丁二烯和聚异戊二烯基热固性组合物的制造方法
公开(公告)号：US06586533B1
公开(公告)日：2003-07-01
申请号：US08238178
申请日：1994-05-04
申请人： Vincent R. Landi , J. Mark Mersereau , Walter A. Robbins , Michael E. St. Lawrence
发明人： Vincent R. Landi , J. Mark Mersereau , Walter A. Robbins , Michael E. St. Lawrence
IPC分类号： C08C1928
CPC分类号： C08L9/00 , C08L53/00 , H05K1/032 , C08L2666/24 , C08L2666/04
摘要： Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper).
摘要翻译：制品由基于聚丁二烯或聚异戊二烯树脂的热固性组合物形成，其经受大于250℃的高温固化步骤。热固性组合物可以包括填料，例如颗粒状陶瓷填料，还可以包括用于改善尺寸稳定性的织造网并降低脆性。本发明的形成方法特别适用于制造用于微波和数字电路的电路基板，通常以热固性组合物的形式层压在金属导电箔（例如铜）的一个或两个相对的表面上。

9. 发明授权

US5972811A Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof 失效
标题翻译：聚丁二烯和聚异戊二烯热固性组合物及其制备方法
公开(公告)号：US5972811A
公开(公告)日：1999-10-26
申请号：US90789
申请日：1998-06-04
申请人： Michael E. St. Lawrence , Doris I. Hand , Vincent R. Landi , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
发明人： Michael E. St. Lawrence , Doris I. Hand , Vincent R. Landi , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
IPC分类号： C08J5/08 , C08J5/10 , C08J5/24 , C08K3/00 , C08K3/10 , C08K3/22 , C08K3/24 , C08K3/34 , C08K3/38 , C08K3/40 , C08K5/00 , C08K5/02 , C08K5/06 , C08K5/3417 , C08K7/00 , C08K7/02 , C08K7/14 , C08K7/16 , C08K7/20 , C08L9/00 , C08L21/00 , C08L27/18 , C08L47/00 , C08L53/00 , C08L53/02 , C08L77/10 , H01B3/30 , H05K1/02 , H05K1/03 , H05K1/16 , B32B7/00
CPC分类号： C08J5/24 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L9/00 , H05K1/032 , H05K1/0366 , H05K1/0373 , C08J2309/00 , C08L15/00 , C08L23/04 , C08L53/00 , C08L7/00 , C08L9/02 , C08L9/06 , H05K1/0203 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/2934 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3455
摘要： An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.
摘要翻译：提供了一种电气基材材料，其包含聚丁二烯或聚异戊二烯的热固性基质和不同于第一树脂的可共固化的第二树脂。可以任选地加入过氧化物固化引发剂和/或交联剂。存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

10. 发明授权

US5571609A Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof 失效
标题翻译：聚丁二烯和聚异戊二烯基热固性组合物及其制备方法
公开(公告)号：US5571609A
公开(公告)日：1996-11-05
申请号：US322890
申请日：1994-10-13
申请人： Michael E. St. Lawrence , Vincent R. Landi , Doris I. Hand , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
发明人： Michael E. St. Lawrence , Vincent R. Landi , Doris I. Hand , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
IPC分类号： C08J5/24 , C08K3/00 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/00 , C08K5/02 , C08K7/00 , C08K7/14 , C08L9/00 , C08L21/00 , C08L53/00 , C08L53/02 , H05K1/02 , H05K1/03 , H05K1/16 , B32B7/00
CPC分类号： C08J5/24 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L9/00 , H05K1/032 , H05K1/0366 , H05K1/0373 , C08J2309/00 , C08L15/00 , C08L23/04 , C08L53/00 , C08L7/00 , C08L9/02 , C08L9/06 , H05K1/0203 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/3431 , Y10T442/3569
摘要： An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.
摘要翻译：提供了一种电气基材材料，其包括热固性基质，其包含聚丁二烯或聚异戊二烯树脂和含量为25至50体积％的不饱和丁二烯或含异戊二烯的聚合物。％; 10〜40体积％的编织玻璃织物。％; 粒度为5至60体积％的陶瓷填料。％; 阻燃剂和过氧化物固化引发剂。优选的组合物具有18％的玻璃织物，41％的颗粒填料和30％的热固性基质。上述组分比，特别是颗粒填料的相对高范围是本发明的重要特征，因为该填充的复合材料导致具有非常小的粘性的预浸料，因此可以容易地由操作者处理。这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。另外，本发明的另一个重要特征是玻璃织物填料相对于较高范围的颗粒填料的含量较低，这导致在Z轴或厚度方向上改进（降低）CTE，改善了电性能（例如耗散因子）更低的成本和通过适当选择颗粒填料来调整介电常数的能力。

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