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1. 发明授权

US06664779B2 Package with environmental control material carrier 有权
标题翻译：包装与环境控制材料载体
公开(公告)号：US06664779B2
公开(公告)日：2003-12-16
申请号：US09992178
申请日：2001-11-05
申请人： Vincent C. Lopes , Jwei Wien Liu
发明人： Vincent C. Lopes , Jwei Wien Liu
IPC分类号： G01R342
CPC分类号： H01L23/26 , B81B3/0005 , B81B7/0038 , H01L2924/0002 , H01L2924/00
摘要： A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The environmental control materials are positioned inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. Three types of environmental control materials are typically used in micromirror packages: (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.
摘要翻译：一种落入式环境控制材料载体组件55，其改进了性能并降低了半导体封装的成本。环境控制材料通过能够容纳多达八种材料的落入式环境控制材料载体组件54定位在包装腔内。微镜包装中通常使用三种环境控制材料：（1）用于吸收包装内水分的一种，（2）用于吸收包装内粘合剂除气成分的一种;（3）一种用于储存PFDA润滑剂用于防止微镜反射镜粘贴。提高了微镜器件的性能和寿命，降低了这些微镜是中心部件的投影显示系统的成本。

2. 发明授权

US06879147B2 Package with environmental control material carrier 有权
标题翻译：包装与环境控制材料载体
公开(公告)号：US06879147B2
公开(公告)日：2005-04-12
申请号：US10674829
申请日：2003-09-30
申请人： Vincent C. Lopes , Jwei Wien Liu
发明人： Vincent C. Lopes , Jwei Wien Liu
IPC分类号： B81B7/00 , H01L23/26 , G01R31/302
CPC分类号： H01L23/26 , B81B3/0005 , B81B7/0038 , H01L2924/0002 , H01L2924/00
摘要： A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.
摘要翻译：一种落入式环境控制材料载体组件55，其改进了性能并降低了半导体封装的成本。所公开的方法通过能够容纳多达八种材料的落入式环境控制材料载体组件54将环境控制材料定位在包装腔内。在包装微镜的情况下，吸气剂由至少三种类型组成; 即（1）用于吸收包装内的水分的装置，（2）用于吸收包装内的粘合剂除气成分的装置，和（3）用于储存用于防止微反射镜粘附的PFDA润滑剂的装置。提高了微镜器件的性能和寿命，降低了这些微镜是中心部件的投影显示系统的成本。提交上述摘要的理解是，它只会用于协助从粗略检查中确定37 C.F.R.描述的技术披露的性质和要点。 §1.72（b）。在任何情况下，本摘要不得用于解释任何专利权利要求的范围。

3. 发明授权

US06753037B2 Re-coating MEMS devices using dissolved resins 有权
标题翻译：使用溶解树脂重新涂覆MEMS器件
公开(公告)号：US06753037B2
公开(公告)日：2004-06-22
申请号：US09886781
申请日：2001-06-21
申请人： Seth Miller , Vincent C. Lopes , Michael F. Brenner
发明人： Seth Miller , Vincent C. Lopes , Michael F. Brenner
IPC分类号： B05D312
CPC分类号： G02B26/0841 , B81B3/0005 , B81B2201/042 , B81C1/0096 , B81C2201/112
摘要： A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.
摘要翻译：使用旋涂法涂布独立的微机械装置的方法。具有高固体负载但低粘度的溶液可以渗透微加工结构的自由区域。将该溶液从晶片或模具上旋转导致器件上的膜形成，而没有毛细管作用的预期损坏。如果使用有机聚合物作为固体组分，则结构可以通过传统的灰分过程再释放。该方法可以用作制造微机械装置以保护释放和测试结构的过程，并且克服与湿释放过程相关的微机械装置的与静电相关的变形。

4. 发明授权

US07071025B2 Separating wafers coated with plastic films 有权
公开(公告)号：US07071025B2
公开(公告)日：2006-07-04
申请号：US10038813
申请日：2001-12-31
申请人： Michael F. Brenner , Vincent C. Lopes
发明人： Michael F. Brenner , Vincent C. Lopes
IPC分类号： H01L21/48 , H01L21/31
CPC分类号： B81C1/00896
摘要： The method of protecting micromechanical structures during a wafer fabrication process. A protective layer 402 is deposited to protect the fragile microstructures during a wafer separation process and a post separation cleanup process. Suitable protective layers 402 typically are plastic and tend to deform or delaminate when the wafer is sawn. The deformation of the protective overcoat during the saw process destroys the structures it is intended to protect. To prevent deformation of the protective layer 402, a brittle layer 404 is deposited on the protective layer 402 to hold the protective layer in place during the saw process. Cured photoresist is a suitable protective layer. The photoresist can be applied to the protective layer using standard processes and cured, typically by baking the photoresist. Once the wafer is separated, the brittle layer may be removed. After the debris created during the saw process is removed, the protective overcoat may be removed. The brittle layer 404 and the protective overcoat 402 may be removed at the same time. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

5. 发明授权

US07894121B2 Light valve assembly with a holographic optical element and a method of making the same 有权
标题翻译：具有全息光学元件的光阀组件及其制造方法
公开(公告)号：US07894121B2
公开(公告)日：2011-02-22
申请号：US11940609
申请日：2007-11-15
申请人： Vincent C. Lopes , Bradley Morgan Haskett , Steven Monroe Penn
发明人： Vincent C. Lopes , Bradley Morgan Haskett , Steven Monroe Penn
IPC分类号： G02B26/00 , G02B27/64 , G03H1/10
CPC分类号： G02B5/32 , G02B5/1885 , G02B5/189 , G02B26/0833 , G02B27/0944 , G02F1/133504 , G03H2260/10
摘要： A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.
摘要翻译：光阀组件包括全息光学元件和包括单独可寻址像素的阵列的光阀。光阀组件可以在晶片级或晶片级上制造。

6. 发明申请

US20090128873A1 LIGHT VALVE ASSEMBLY WITH A HOLOGRAPHIC OPTICAL ELEMENT AND A METHOD OF MAKING THE SAME 有权
标题翻译：具有全息光学元件的光阀组件及其制造方法
公开(公告)号：US20090128873A1
公开(公告)日：2009-05-21
申请号：US11940609
申请日：2007-11-15
申请人： Vincent C. Lopes , Bradley Morgan Haskett , Steven Monroe Penn
发明人： Vincent C. Lopes , Bradley Morgan Haskett , Steven Monroe Penn
IPC分类号： G02F1/00 , G02B5/18 , G02B5/32
CPC分类号： G02B5/32 , G02B5/1885 , G02B5/189 , G02B26/0833 , G02B27/0944 , G02F1/133504 , G03H2260/10
摘要： A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.
摘要翻译：光阀组件包括全息光学元件和包括单独可寻址像素的阵列的光阀。光阀组件可以在晶片级或晶片级上制造。

7. 发明授权

US06856014B1 Method for fabricating a lid for a wafer level packaged optical MEMS device 有权
标题翻译：制造晶圆级封装光学MEMS器件的盖子的方法
公开(公告)号：US06856014B1
公开(公告)日：2005-02-15
申请号：US10747862
申请日：2003-12-29
申请人： John C. Ehmke , Vincent C. Lopes , John Paul Harris
发明人： John C. Ehmke , Vincent C. Lopes , John Paul Harris
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B81C1/00333
摘要： A method of individually packaging a multiplicity of devices, such as a spatial light modulator, before the multiplicity of devices formed on a substrate wafer are separated. The method and structure comprises individually sealing each device while the device is still part of sealed by the combination interposer wafer and a cover or window wafer. After each device is sealed by the combination interposer wafer and cover wafer, the combination cover wafer is sawed through down to the substrate wafer. The sealed devices may then be fully separated by scoring and breaking the substrate wafer.
摘要翻译：在形成在基板晶片上的多个器件分离之前，分离地封装多个器件（诸如空间光调制器）的方法。该方法和结构包括单独地密封每个装置，同时装置仍然是由组合插入件晶片和盖或窗玻璃密封的一部分。在每个器件被组合插入器晶片和覆盖晶片密封之后，组合覆盖晶片被锯切到底部晶片。然后可以通过刻划和破坏基板晶片来完全分离密封的装置。

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