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1. 发明申请

US20080240893A1 HIGH CAPACITY PICK AND PLACE PROCESS 失效
标题翻译：高容量摄影和放置过程
公开(公告)号：US20080240893A1
公开(公告)日：2008-10-02
申请号：US12052948
申请日：2008-03-21
申请人： Ulf Becker , David Halk
发明人： Ulf Becker , David Halk
IPC分类号： B65H1/00
CPC分类号： H01L21/67144 , Y10T29/49117 , Y10T29/4913
摘要： A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.
摘要翻译：准确地放置拾取和放置机器的物体的方法提供原料。在原材料中形成所需的表面形貌。使用斜切将原料切成部分，使得每个部件具有斜面。提供了具有多个间隔空腔的固定装置，每个空腔具有构造和布置成与相关联部件的斜面相配合的斜面。拾取和放置机器将每个部件拾取并放置在相关联的腔中，使得部件的斜面与空腔的斜面相配合。

2. 发明授权

US07730611B2 High capacity pick and place process 失效
标题翻译：高容量的拾放过程
公开(公告)号：US07730611B2
公开(公告)日：2010-06-08
申请号：US12052948
申请日：2008-03-21
申请人： Ulf Becker , David Halk
发明人： Ulf Becker , David Halk
IPC分类号： H05K3/30 , H01L21/70
CPC分类号： H01L21/67144 , Y10T29/49117 , Y10T29/4913
摘要： A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.
摘要翻译：准确地放置拾取和放置机器的物体的方法提供原料。在原材料中形成所需的表面形貌。使用斜切将原料切成部分，使得每个部件具有斜面。提供了具有多个间隔空腔的固定装置，每个空腔具有构造和布置成与相关联部件的斜面相配合的斜面。拾取和放置机器将每个部件拾取并放置在相关联的腔中，使得部件的斜面与空腔的斜面相配合。

3. 发明申请

US20060022273A1 System and method for assembly of semiconductor dies to flexible circuits 审中-公开
标题翻译：将半导体管芯组装到柔性电路的系统和方法
公开(公告)号：US20060022273A1
公开(公告)日：2006-02-02
申请号：US11185062
申请日：2005-07-20
申请人： David Halk
发明人： David Halk
IPC分类号： H01L23/62
CPC分类号： H01L21/6835 , H01L23/4985 , H01L24/79 , H01L24/86 , H01L2221/68322 , H01L2221/68354 , H01L2224/81205 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01033 , H01L2924/01068
摘要： A system and method for assembly of semiconductor dies to flexible circuits, wherein the present invention utilizes UV release tape as a temporary, removable carrier for precisely aligning, and maintaining the alignment of, a semiconductor die, and more specifically, the interconnecting pads thereof, with the conducting leads of a flexible circuit; thereby, expediting subsequent permanent affixation of same via thermo-sonic TAB bonding processes, or the like.
摘要翻译：一种用于将半导体管芯组装到柔性电路的系统和方法，其中本发明利用UV释放带作为临时的可移除载体，用于精确地对准并保持半导体管芯的对准，并且更具体地说，其互连焊盘，具有柔性电路的导线; 从而通过热声TAB粘合工艺等加速其后续的固定。

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