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1. 发明申请

US20180100231A1 LITHIUM-CONTAINING TRANSITION METAL OXIDE TARGET 审中-公开
公开(公告)号：US20180100231A1
公开(公告)日：2018-04-12
申请号：US15558364
申请日：2016-03-17
申请人： UMICORE
发明人： Jong-Won SHIN
IPC分类号： C23C14/34 , C01G51/00 , B22F3/04
摘要： A process for the formation of an LiM02 (e.g., LiCoO2) sputtering target with a bi-modal grain size distribution (as in a hollow cylinder target body) that includes a CIP-based process involving, for example, forming or sourcing an LiMO2 (e.g., Li—CoO2) powder; dispersion and milling (e.g., wet milling); binder introduction; drying (e.g., spray drying) to form a granulate; CIP processing of the granulate into a molded shape; and a heating cycle for debinding and sintering to form a densified sintered shape. The target body produced is suited for inclusion on a sputtering target assembly (as in a rotary sputtering target assembly with a plurality of cylindrical target bodies attached to a backing support). The invention is inclusive of the resultant target bodies formed under the CIP based process as well as an induction heater based process for attachment (e.g., metal solder bonding) of the low conductivity target body(ies) of LiMO2 (e.g., LiCoO2) to a common backing support through use of an added conductive wrap or layer provided to the target body and heated with the induction heater during the attachment process.

2. 发明申请

US20180051371A1 METHODS OF FORMING ROTARY SPUTTERING TARGET 审中-公开
公开(公告)号：US20180051371A1
公开(公告)日：2018-02-22
申请号：US15558388
申请日：2016-03-17
申请人： UMICORE
发明人： Jong-Won SHIN , Nikolaus MARGADANT
IPC分类号： C23C14/34 , H01J37/34 , B23K1/002
摘要： A sputtering target assembly formed by relative positioning of a sputtering target body or bodies and a backing support, such that the backing support is placed within the inside diameter of the sputtering target body. The combination is heated with an induction heater surrounding the target body so that there is achieved a suitable temperature for bonding. Heating is discontinued such that there is a cooling of the bonding material and a bonding relationship established between the sputtering target body (or bodies) and the backing support. Embodiments include adding a conductive layer, as in a conductive fabric wrap, between the induction heater and internal target body(ies) that is/are inductively heated in a manner that enhances axial and radial gradient heating during bonding. The conductive wrap can be used with a low conductivity material as in an LiMO2 (e.g., Li—CoO2) target body. A non-adhesive protective wrap can also be placed about the target body such as between the conductive wrap and target body.

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