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    • 1. 发明授权
    • Process for treatment of exhaust gas
    • 废气处理工艺
    • US5560894A
    • 1996-10-01
    • US351746
    • 1994-12-08
    • Tsutomu UenoYutaka KitayamaHiroaki TsuchiaiAtsushi TataniHiroshi FujitaShinichiro Kotake
    • Tsutomu UenoYutaka KitayamaHiroaki TsuchiaiAtsushi TataniHiroshi FujitaShinichiro Kotake
    • B01D53/40B01D53/34B01D53/50B01D53/56B01D53/68B01D53/81B01J8/00C01B7/00C01B17/22
    • B01D53/502
    • A process for removing environmental contaminants from an exhaust gas by a semidry method through contact with an absorbent slurry containing alkaline compounds in a reactor, comprising the steps of adding a material containing calcium sulfate and/or calcium sulfite, a material containing aluminum oxide, and a material containing silicon dioxide to a material capable of supplying calcium oxide, mixing the mixture with water, curing the whole mixture in hot water, and then introducing and dispersing the resulting absorbent slurry in the reactor for contact with the environmental contaminants. In a modification the absorbent slurry is obtained by adding a material capable of supplying aluminum oxide, silicon dioxide, and calcium sulfate and/or calcium sulfite to a material capable of supplying calcium oxide, calcining the mixture at 750.degree.-950.degree. C., mixing the calcined product with water, and curing the mixture in hot water. To the absorbent slurry obtained in either way is added a soluble compound that elevates the boiling point of water.
    • 一种通过在反应器中与含有碱性化合物的吸收剂淤浆接触的方法,通过半干法从废气中除去环境污染物的方法,包括以下步骤:加入含有硫酸钙和/或亚硫酸钙的材料,含有氧化铝的材料和 将含有二氧化硅的材料加入到能够供应氧化钙的材料中,将混合物与水混合,将整个混合物固化在热水中,然后将所得的吸收剂浆料引入和分散在与环境污染物接触的反应器中。 在改性中,通过向能够供应氧化钙的材料中加入能够提供氧化铝,二氧化硅和硫酸钙和/或亚硫酸钙的材料,在750-950℃下煅烧该混合物, 将煅烧产物与水混合,并在热水中固化混合物。 向以任一方式获得的吸收剂浆料中加入提高水的沸点的可溶性化合物。
    • 4. 发明授权
    • Method of bending glass plate
    • 玻璃板弯曲方法
    • US4173461A
    • 1979-11-06
    • US909691
    • 1978-05-25
    • Yoshihiro EbataTsutomu UenoNagamasa KataokaAkimasa Akao
    • Yoshihiro EbataTsutomu UenoNagamasa KataokaAkimasa Akao
    • C03B23/025C03B23/02
    • C03B23/0258Y10S65/04
    • As a first step to bend a glass along a line traversing the plate, external heat is applied to the glass plate such that a narrow zone containing the entire length of the bending line is heated more intensely than the remaining area to reach a temperature at which the glass does not yet soften but exhibits an appreciable lowering of its electrical resistivity. Then an electric current is caused to flow through the glass in the intensely heated zone from one terminal of the bending line to the other terminal, until the glass is softened only in this zone, i.e. along the bending line by the Joule effect of the current. In this state, desired manner of bending is achieved by the use of a suitably shaped bending die.
    • 作为沿着穿过板弯曲玻璃的第一步骤,将外部热量施加到玻璃板,使得包含整个弯曲线的整个长度的窄区域被比其余区域更强烈地加热到达该温度 玻璃尚未软化,但其电阻率显着降低。 然后使电流从强加热区域中的玻璃流出,从弯曲线的一个端子到另一个端子,直到玻璃仅在该区域中软化,即沿着弯曲线由电流的焦耳效应 。 在这种状态下,通过使用合适的弯曲模具来实现所需的弯曲方式。
    • 5. 发明申请
    • Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking Substrate
    • 由脆性材料制成的基板划线和断裂方法以及划线和断裂基板的系统
    • US20080305615A1
    • 2008-12-11
    • US11722355
    • 2005-12-27
    • Tsutomu UenoKenji OtodaKoji Yamamoto
    • Tsutomu UenoKenji OtodaKoji Yamamoto
    • H01L21/301B23K26/00
    • H05K3/0052B23K26/40B23K2103/50B28D5/0011B65G2249/04C03B33/0222C03B33/033C03B33/091C03B33/093H01L21/67092H01L21/67282H05K1/0306H05K3/0029H05K2201/09036H05K2201/0909H05K2203/302Y02P40/57
    • An object of the present invention is to provide a method of scribing and breaking a substrate made of a brittle material by which good-quality cutting surface of the substrate can be obtained without any defects such as chippings on the substrate.The method comprises (a) the first scribing step in the first direction by controlling the relative moving velocity and output power of the laser beam so that local volume shrinkage and local tensile stress can be generated in the vicinity of the formed first scribed line, (b) the second scribing step in the second direction of forming locally trigger cracks, which use tensile stress in the vicinity of the first scribed line and work as a starting point in the second direction, in the vicinity of the intersection of a scribed line in the first direction with a scribed line in the second direction, (c) the first breaking step of breaking the substrate along the first scribed line in the first direction, and (d) the second breaking step of breaking the substrate along the second scribed line in the second direction after the first breaking step and performing the breaking from the trigger that works as a starting point of breaking.
    • 本发明的目的是提供一种划片和断裂由脆性材料制成的基材的方法,通过该方法可以获得基材的优质切割表面,而没有诸如基材上的切屑的任何缺陷。 该方法包括:(a)通过控制激光束的相对移动速度和输出功率在第一方向上的第一划刻步骤,使得可以在形成的第一划线附近产生局部体积收缩和局部拉伸应力( b)形成局部触发裂纹的第二划线方向上的第二刻划步骤,其在第一划线附近使用拉伸应力,作为第二方向的起点,在与第 所述第一方向在所述第二方向上具有划线,(c)所述第一断裂步骤,沿着所述第一方向沿着所述第一划线切断所述基板;以及(d)所述第二断裂步骤,沿着所述第二划线切断所述基板 在第一断裂步骤之后的第二方向上,并且从作为断裂起点的触发器执行断开。