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1. 发明申请

US20080110425A1 Cam mechanism having forced-valve-opening/closing cams and cam-profile setting method 失效
标题翻译：具有强制开阀/闭合凸轮的凸轮机构和凸轮轮廓设定方法
公开(公告)号：US20080110425A1
公开(公告)日：2008-05-15
申请号：US11978635
申请日：2007-10-30
申请人： Tsuneo Endoh , Makoto Uda , Hiroshi Hanabusa
发明人： Tsuneo Endoh , Makoto Uda , Hiroshi Hanabusa
IPC分类号： F01L1/047
CPC分类号： F01L1/30 , F01L1/042 , F01L1/047 , F01L1/08 , Y10T29/49293
摘要： No-load valve lift correction curves of opening and closing cams are set by offsetting no-load curve sections of basic valve lift curves of the cams in such directions as to increase a clearance between the curves, and they are connected with remaining sections of the curves to provide normal valve lift curves of the cams. Cam profiles of the cams are set on the basis of such normal valve lift curves. The cam profiles are set so that an ultimate speed difference between jumping and landing speeds of a follower on an ultimate valve speed curve determined from ultimate valve lift curves, having first and second shift sections where the follower shifts from the opening cam to the closing cam and from the closing cam to the opening cam, is smaller than a basic speed difference between jumping and landing speeds on a basic valve speed curve.
摘要翻译：打开和关闭凸轮的空载气门升程校正曲线是通过偏移凸轮的基本气门升程曲线的空载曲线段来设定，以增加曲线之间的间隙，并与它们的剩余部分相连曲线提供凸轮的正常气门升程曲线。凸轮的凸轮轮廓基于这种正常的气门升程曲线设定。凸轮轮廓被设置成使得从极限气门升程曲线确定的极限阀速度曲线上从动件的跳跃和着陆速度之间的极限速度差异具有第一和第二换档部分，其中从动件从打开凸轮移动到关闭凸轮并且从关闭凸轮到打开凸轮，小于基本阀速度曲线上的跳跃和着陆速度之间的基本速度差。

2. 发明授权

US07301781B2 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US07301781B2
公开(公告)日：2007-11-27
申请号：US11585159
申请日：2006-10-24
申请人： Satoru Konishi , Tsuneo Endoh , Masaaki Tsuchiya , Hirokazu Nakajima
发明人： Satoru Konishi , Tsuneo Endoh , Masaaki Tsuchiya , Hirokazu Nakajima
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/303 , H01L23/3121 , H01L23/3677 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/16225 , H01L2224/16235 , H01L2224/32013 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73257 , H01L2224/73265 , H01L2224/83138 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/183 , H05K2201/0367 , H05K2201/09781 , H05K2201/10515 , H05K2201/2036 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/0401
摘要： The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.
摘要翻译：本发明实现了以半导体模块中的上半导体芯片的下表面接地电极的接地强化和半导体模块的小型化，其中以半导体芯片堆叠的方式安装两个半导体芯片。下半导体芯片固定在形成在模块板的上表面中的凹部的底部，并且上半导体芯片固定到由导体制成的支撑体的上表面，导体的上表面形成在模块的上表面上在休息室周围。外部电极端子和散热垫形成在模块板的下表面上。

3. 发明申请

US20060267220A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060267220A1
公开(公告)日：2006-11-30
申请号：US11499760
申请日：2006-08-07
申请人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima
发明人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima
IPC分类号： H01L23/52
CPC分类号： H01L25/16 , H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2924/01079 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprises a module board having a top surface and a backside surface, a lower chip having a first circuit operated by a first frequency and a second circuit operated by a second frequency, an upper chip disposed so as to overlie over the lower chip, having the first circuit and the second circuit, a plurality of wires electrically bonding the upper chip to the module board, and electrically bonding the lower chip to the module board, respectively, and a plurality of chip components on the module board, and the first circuit of the upper chip is disposed opposite to the second circuits of the lower chip while the second circuit of the upper chip is disposed opposite to the first circuits of the lower chip. As a result, interference by high frequencies is rendered hard to occur between the wires bonded to the upper and lower chips, respectively, at a time when those circuits having respective frequencies are in operation, thereby enabling reliability of the semiconductor device to be enhanced.
摘要翻译：半导体器件包括具有顶表面和背面的模块板，具有由第一频率操作的第一电路的下芯片和由第二频率操作的第二电路，设置成覆盖在下芯片上的上芯片具有第一电路和第二电路，多个电线将上芯片电连接到模块板，并且将下芯片分别电连接到模块板和模块板上的多个芯片组件，以及上芯片的第一电路与下芯片的第二电路相对设置，而上芯片的第二电路与下芯片的第一电路相对设置。结果，在具有各个频率的电路工作时，分别在分别连接到上部和下部芯片的导线之间难以发生高频率的干扰，从而能够提高半导体器件的可靠性。

4. 发明申请

US20060171130A1 Semiconductor module 审中-公开
标题翻译：半导体模块
公开(公告)号：US20060171130A1
公开(公告)日：2006-08-03
申请号：US11391218
申请日：2006-03-29
申请人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima , Masaaki Tsuchiya
发明人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima , Masaaki Tsuchiya
IPC分类号： H05K7/06
CPC分类号： H01L25/0657 , H01L23/3121 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H05K1/0206 , H05K1/0298 , H05K1/183 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.
摘要翻译：本发明实现了半导体模块的小型化。半导体模块包括在其下表面上具有外部电极端子和散热垫的模块板，其中包括其中的高频功率放大装置的初级晶体管的第一半导体芯片，包含下一级的第二半导体芯片晶体管和其中的最后级晶体管，以及构成匹配电路的集成无源器件。第一半导体芯片和第二半导体芯片和集成无源器件中的至少一个以重叠的方式安装在模块板的上表面上。

5. 发明授权

US07021059B2 Heat exchange system 失效
标题翻译：热交换系统
公开(公告)号：US07021059B2
公开(公告)日：2006-04-04
申请号：US10496125
申请日：2002-11-01
申请人： Masashi Shinohara , Tsuneo Endoh , Atsushi Baba
发明人： Masashi Shinohara , Tsuneo Endoh , Atsushi Baba
IPC分类号： F01K23/10 , F01N5/02 , F02G5/02 , F28D7/00
CPC分类号： F01P3/12 , F01N3/043 , F01N3/046 , F01N5/02 , F01N2240/02 , F01P3/22 , F01P2060/16 , F02G5/02 , F22B1/1807 , F28D7/1638 , F28D21/001 , F28F1/32 , Y02E20/363 , Y02T10/16 , Y02T10/166 , Y02T10/20
摘要： A heat exchange system is provided in which low temperature water from a supply pump (15) is split and supplied to an auxiliary evaporator (17) provided so as to cover an exhaust port (16) extending from a combustion chamber of an internal combustion chamber (E) and to a main evaporator (11) provided downstream of the exhaust port (16). The direction of water flowing through the auxiliary evaporator (17) is parallel to the direction of flow of exhaust gas, and as a result an upstream section of the exhaust port (16), which has a high temperature, can be cooled effectively with low temperature water, and the escape of heat from the upstream section of the exhaust port (16) can be suppressed. The direction of water flowing through the main evaporator (11) is opposite to the direction of flow of exhaust gas, thus ensuring that there is a temperature difference between the water and the exhaust gas along the whole length of the water passage of the main evaporator (11) and enabling the heat exchange efficiency to be improved.
摘要翻译：提供了一种热交换系统，其中来自供应泵（15）的低温水被分离并供应到辅助蒸发器（17），所述辅助蒸发器（17）设置成覆盖从内燃机的燃烧室延伸的排气口（16）（E）和设置在排气口（16）下游的主蒸发器（11）。流经辅助蒸发器（17）的水的方向平行于废气流动的方向，结果可以有效地冷却具有高温度的排气口（16）的上游部分可以抑制高温水，并且可以抑制来自排气口（16）的上游部分的热量逸出。流过主蒸发器（11）的水的方向与排气的流动方向相反，从而确保沿着主蒸发器的水通道的整个长度在水和废气之间存在温差（11），能够提高热交换效率。

6. 发明授权

US06949835B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06949835B2
公开(公告)日：2005-09-27
申请号：US10809450
申请日：2004-03-26
申请人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima
发明人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07 , H01L25/16 , H01L23/48
CPC分类号： H01L25/0657 , H01L24/32 , H01L24/45 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/83191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06582 , H01L2924/01014 , H01L2924/01028 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： The size of a power amplifier module is reduced. The power amplifier module includes a module substrate, a lower chip flip-connected to the module substrate, an upper chip stacked face up onto the lower chip, a common electrode disposed on a back surface of the upper chip, plural wires for connecting the upper chip and the module substrate with each other, plural wires for connecting the common electrode and the module substrate with each other, plural chip parts mounted on the module substrate, and a sealing portion formed on the main surface of the module substrate. The common electrode is connected to the module substrate through wires to strengthen the GND of the upper chip. Since the lower chip is flip-connected to the module substrate, the difference in size between the upper and lower chips is diminished to attain a reduction in size of the power amplifier module.
摘要翻译：功率放大器模块的尺寸减小了。功率放大器模块包括模块基板，与模块基板反向连接的下芯片，上芯片堆叠在上芯片上的上芯片，设置在上芯片背面上的公共电极，用于连接上芯片的多根电线芯片和模块基板彼此连接，用于将公共电极和模块基板彼此连接的多个电线，安装在模块基板上的多个芯片部分和形成在模块基板的主表面上的密封部分。公共电极通过导线连接到模块基板，以加强上芯片的GND。由于下部芯片被翻转连接到模块基板，所以上下芯片之间的尺寸差减小，以实现功率放大器模块的尺寸的减小。

7. 发明申请

US20050098137A1 Intake/exhaust valve and its seal for internal combustion engine 失效
标题翻译：进气/排气阀及其内燃机密封件
公开(公告)号：US20050098137A1
公开(公告)日：2005-05-12
申请号：US10983662
申请日：2004-11-09
申请人： Hisato Tanaka , Tsuneo Endoh , Yasuhisa Tateoka , Hiroaki Hara
发明人： Hisato Tanaka , Tsuneo Endoh , Yasuhisa Tateoka , Hiroaki Hara
IPC分类号： F01L3/20 , F01L3/22 , F02F1/00
CPC分类号： F01L3/20 , F01L3/22
摘要： An intake/exhaust valve seal structure for an internal combustion engine is disclosed. A sealing surface is formed by a valve seat surface in a ceiling of a combustion chamber and a valve face surface provided on an intake/exhaust valve. The sealing surface lies on a first conical surface having an axis of the intake/exhaust valve as its rotation axis and includes a line of intersection of the first conical surface with an inner wall face of the ceiling of the combustion chamber. A method for manufacturing the intake/exhaust valve is also disclosed.
摘要翻译：公开了一种用于内燃机的进气/排气阀密封结构。密封面由燃烧室的顶棚中的阀座面和设在进/排气门上的阀面面形成。密封表面位于具有进气/排气阀的轴线作为其旋转轴线的第一圆锥形表面上，并且包括第一锥形表面与燃烧室的天花板的内壁面的相交线。还公开了一种用于制造进/排气门的方法。

8. 发明授权

US06872465B2 Solder 失效
标题翻译：焊接
公开(公告)号：US06872465B2
公开(公告)日：2005-03-29
申请号：US10384931
申请日：2003-03-07
申请人： Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人： Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号： B23K35/14 , B23K35/02 , B23K35/26 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/498 , H05K3/34 , B32B15/02
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/025 , B23K35/262 , H01L23/49816 , H01L24/73 , H01L24/81 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13022 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K2201/0215 , Y10T428/12181 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/1275 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
摘要翻译：在实现温度分级接合中的高温侧焊料接合的焊料中，半导体器件与基板之间的连接部由金属球等构成的金属球和由金属球和Sn形成的化合物形成，金属球通过化合物结合在一起。

9. 发明申请

US20050031479A1 Rotary fluid machine 审中-公开
标题翻译：旋转流体机
公开(公告)号：US20050031479A1
公开(公告)日：2005-02-10
申请号：US10489914
申请日：2002-09-20
申请人： Tsutomu Takahashi , Tsuneo Endoh , Hiroshi Ichikawa , Yasunari Kimura
发明人： Tsutomu Takahashi , Tsuneo Endoh , Hiroshi Ichikawa , Yasunari Kimura
IPC分类号： F01K7/00 , F01B13/06 , F01C1/344 , F01C19/02 , F01C19/10 , F01C21/04 , F01C21/08 , F02B53/00 , F04C18/344 , F04C27/00 , F16J15/447 , F01C19/00
CPC分类号： F04C27/001 , F01B13/06 , F01B13/061 , F01B13/068 , F01C1/3446 , F01C19/02 , F01C21/04 , F01C21/08 , F01C21/0836 , F01C21/0872 , F01C21/0881 , F02B53/00 , F04C18/3446
摘要： A rotary fluid machine is provided that includes a rotor chamber (14) formed in a casing, a rotor (41) rotatably housed within the rotor chamber (14), a plurality of vane channels (49) formed radially in the rotor (41), a plurality of vanes (48) slidably supported in the respective vane channels (49), vane chambers (75) defined between adjacent vanes (48), and an intake port (90) and an exhaust port (91) for supplying and discharging a gas-phase working medium to and from the vane chambers (75). A labyrinth (43g) provided on the outer peripheral face of the rotor (41) prevents the gas-phase working medium from leaking in a region in which there is a large difference in pressure between adjacent vane chambers (75) that are in between the trailing edge of the exhaust port (91) and the leading edge of the intake port (90).
摘要翻译：提供了一种旋转流体机械，其包括形成在壳体中的转子室（14），可旋转地容纳在转子室（14）内的转子（41），在转子（41）中径向形成的多个叶片通道（49），可滑动地支撑在各个叶片通道（49）中的多个叶片（48），限定在相邻叶片（48）之间的叶片室（75）和用于供给和排出的进气口（90）和排气口（91）来自所述叶片室（75）的气相工作介质。设置在转子（41）的外周面上的迷宫（43g）防止气相工作介质在相邻叶片室（75）之间的压力差大的区域内泄漏，排气口（91）的后缘和进气口（90）的前缘。

10. 发明授权

US06831360B2 Semiconductor device having an elastic resin with a low modulus of elasticity 有权
标题翻译：具有弹性低的弹性树脂的半导体装置
公开(公告)号：US06831360B2
公开(公告)日：2004-12-14
申请号：US10021173
申请日：2001-12-19
申请人： Masashi Yamaura , Hirokazu Nakajima , Nobuyoshi Maejima , Mikio Negishi , Tomio Yamada , Tomomichi Koizumi , Tsuneo Endoh
发明人： Masashi Yamaura , Hirokazu Nakajima , Nobuyoshi Maejima , Mikio Negishi , Tomio Yamada , Tomomichi Koizumi , Tsuneo Endoh
IPC分类号： H01L2334
CPC分类号： H05K3/284 , H01L23/29 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/09701 , H01L2924/19105 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.
摘要翻译：一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

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