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    • 5. 发明申请
    • CONVERTER MODULE AND METHOD OF MANUFACTURING THE SAME
    • 转换器模块及其制造方法
    • US20120025336A1
    • 2012-02-02
    • US13268373
    • 2011-10-07
    • Daisuke INOUEKyoko FUJII
    • Daisuke INOUEKyoko FUJII
    • H01L29/80H01L21/02
    • H04R19/005G01F1/34
    • To provide a converter module easily achieving miniaturization and profile reduction without decreasing the pressure detection sensitivity. The converter module includes: a converter which converts vibration of a diaphragm into an electric signal; and a semiconductor substrate which processes the electric signal obtained as a result of the conversion performed by the converter. The converter includes: a base including a cavity part having an opening in a front surface of the base; and the diaphragm which is arranged on the front surface to cover the opening of the cavity part and converts the vibration into the electric signal. The semiconductor substrate is formed as a part of the base.
    • 为了在不降低压力检测灵敏度的情况下提供易于实现小型化和轮廓缩减的转换器模块。 转换器模块包括:将振膜的振动转换为电信号的转换器; 以及处理由转换器执行的转换的结果而获得的电信号的半导体衬底。 所述转换器包括:基座,其包括在所述基座的前表面中具有开口的空腔部分; 以及隔膜,其布置在前表面上以覆盖空腔部分的开口,并将振动转换成电信号。 半导体衬底形成为基底的一部分。