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    • 3. 发明申请
    • INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM
    • 信息处理设备,信息处理方法和程序
    • US20080141181A1
    • 2008-06-12
    • US11951760
    • 2007-12-06
    • SATORU ISHIGAKITsukasa IkeYasuhiro TaniguchiHisashi Kazama
    • SATORU ISHIGAKITsukasa IkeYasuhiro TaniguchiHisashi Kazama
    • G06F3/048
    • G06F3/017G06F3/011G06F3/0482G06F3/04847
    • According to one embodiment, there is provided an information processing apparatus. A hand-shape database stores first data representing a first hand shape and second data representing a second hand shape. A hand-shape recognition unit determines whether a received image includes one of the first and second hand shapes. The hand-shape recognition unit outputs first predetermined information when the image includes the first hand shape, and outputs second predetermined information when the image includes the second hand shape. When the first predetermined information is received, a gesture interpretation unit displays on a display a user interface including display items each associated with an executable function, and selects one of the display items in accordance with the position information. When the second predetermined information is received in a state where one of the display items is selected, the gesture interpretation unit executes the function associated with the selected display item.
    • 根据一个实施例,提供了一种信息处理装置。 手形数据库存储表示第一手形状的第一数据和表示秒针形状的第二数据。 手形识别单元确定接收到的图像是否包括第一和第二手形状之一。 当图像包括第一手形状时,手形识别单元输出第一预定信息,并且当图像包括秒针形状时输出第二预定信息。 当接收到第一预定信息时,手势解释单元在显示器上显示包括与可执行功能相关联的显示项目的用户界面,并且根据位置信息选择一个显示项目。 当在选择一个显示项目的状态下接收到第二预定信息时,手势解释单元执行与所选择的显示项目相关联的功能。
    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08351254B2
    • 2013-01-08
    • US12818248
    • 2010-06-18
    • Yasuhiro Taniguchi
    • Yasuhiro Taniguchi
    • G11C11/34
    • H01L29/788G11C16/0433G11C2216/10H01L27/11521H01L27/11558
    • The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well.
    • 提高了包括非易失性存储器的半导体器件的性能。 布置在硅衬底上的每个非易失性存储单元包括:第一n阱; 在不同于其位置的地方形成的第二个n阱; 形成在第一n阱中的选择晶体管; 以及具有浮置栅极电极和存储部分p阱的电荷存储部分。 浮栅电极被放置成使其与第一n阱和第二n阱的一部分重叠。 存储部p阱被放置在第一n阱中,使得其与浮栅电极部分重叠。 在该非易失性存储单元中,通过向第二n阱施加正电压来擦除存储器信息,以将浮栅中的电子放电到第二n阱。
    • 5. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US08076192B2
    • 2011-12-13
    • US12563326
    • 2009-09-21
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • H01L21/8238
    • H01L21/823462H01L27/0629H01L27/105H01L27/1052H01L27/11568H01L27/11573
    • Provided is a manufacturing method of a semiconductor device, which comprises forming a film stack of a gate insulating film, a charge storage film, insulating film, polysilicon film, silicon oxide film, silicon nitride film and cap insulating film over a semiconductor substrate; removing the film stack by photolithography and etching from a low breakdown voltage MISFET formation region and a high breakdown voltage MISFET formation region; forming gate insulating films, polysilicon film and cap insulating film over the semiconductor substrate, forming a gate electrode in the low breakdown voltage MISFET formation region and high breakdown voltage MISFET formation region, and then forming a gate electrode in a memory cell formation region. By the manufacturing technology of a semiconductor device for forming the gate electrodes of a first MISFET and a second MISFET in different steps, the present invention makes it possible to provide the first MISFET and the second MISFET each having improved reliability.
    • 提供一种半导体器件的制造方法,其包括在半导体衬底上形成栅极绝缘膜,电荷存储膜,绝缘膜,多晶硅膜,氧化硅膜,氮化硅膜和帽绝缘膜的膜堆叠; 通过光刻和蚀刻从低击穿电压MISFET形成区域和高击穿电压MISFET形成区域去除膜堆叠; 在半导体衬底上形成栅极绝缘膜,多晶硅膜和帽绝缘膜,在低击穿电压MISFET形成区域和高击穿电压MISFET形成区域中形成栅电极,然后在存储器单元形成区域中形成栅电极。 通过以不同的步骤形成第一MISFET和第二MISFET的栅极的半导体器件的制造技术,本发明使得可以提供具有改善的可靠性的第一MISFET和第二MISFET。
    • 6. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20100009529A1
    • 2010-01-14
    • US12563326
    • 2009-09-21
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • H01L21/28H01L21/8238
    • H01L21/823462H01L27/0629H01L27/105H01L27/1052H01L27/11568H01L27/11573
    • Provided is a manufacturing method of a semiconductor device, which comprises forming a film stack of a gate insulating film, a charge storage film, insulating film, polysilicon film, silicon oxide film, silicon nitride film and cap insulating film over a semiconductor substrate; removing the film stack by photolithography and etching from a low breakdown voltage MISFET formation region and a high breakdown voltage MISFET formation region; forming gate insulating films, polysilicon film and cap insulating film over the semiconductor substrate, forming a gate electrode in the low breakdown voltage MISFET formation region and high breakdown voltage MISFET formation region, and then forming a gate electrode in a memory cell formation region. By the manufacturing technology of a semiconductor device for forming the gate electrodes of a first MISFET and a second MISFET in different steps, the present invention makes it possible to provide the first MISFET and the second MISFET each having improved reliability.
    • 提供一种半导体器件的制造方法,其包括在半导体衬底上形成栅极绝缘膜,电荷存储膜,绝缘膜,多晶硅膜,氧化硅膜,氮化硅膜和帽绝缘膜的膜堆叠; 通过光刻和蚀刻从低击穿电压MISFET形成区域和高击穿电压MISFET形成区域去除膜堆叠; 在半导体衬底上形成栅极绝缘膜,多晶硅膜和帽绝缘膜,在低击穿电压MISFET形成区域和高击穿电压MISFET形成区域中形成栅电极,然后在存储器单元形成区域中形成栅电极。 通过以不同的步骤形成第一MISFET和第二MISFET的栅极的半导体器件的制造技术,本发明使得可以提供具有改善的可靠性的第一MISFET和第二MISFET。
    • 7. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07466599B2
    • 2008-12-16
    • US11925106
    • 2007-10-26
    • Kazuyoshi ShibaYasuhiro TaniguchiYasushi Oka
    • Kazuyoshi ShibaYasuhiro TaniguchiYasushi Oka
    • G11C16/04
    • G11C16/0408G11C2216/10H01L27/112
    • Provided is a nonvolatile memory with less element deterioration and good data retaining properties. In a nonvolatile memory formed by the manufacturing steps of a complementary type MISFET without adding thereto another additional step, erasing of data is carried out by applying 9V to an n type well, 9V to a p type semiconductor region, and −9V to another p type semiconductor region and setting the source and drain of data writing and erasing MISFETs and data reading MISFETs at open potential to emit electrons from a gate electrode to a p well by FN tunneling. At this time, by applying a negative voltage to the p well having a capacitive element formed thereover and applying a positive voltage to the p well having the MISFETs formed thereover, a potential difference necessary for data erasing operation can be secured at a voltage low enough not to cause gate breakage.
    • 提供了具有较少元件劣化和良好的数据保存性能的非易失性存储器。 在通过互补型MISFET的制造步骤形成的非易失性存储器中,而不添加另外的附加步骤,通过将9V施加到n型阱,9V到ap型半导体区域,并将-9V施加到另一个p型,进行数据擦除 半导体区域,并设置数据写入和擦除MISFET和数据读取MISFET的源极和漏极,其处于开放电位,以通过FN隧穿从栅电极发射电子。 此时,通过向其中形成有电容元件的p阱施加负电压并向其上形成有MISFET的p阱施加正电压,可以在足够低的电压下确保数据擦除操作所需的电位差 不会造成门破损。