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1. 发明授权

US07854197B2 Method for manufacturing printed circuit boards using legend printing stencil 有权
标题翻译：使用传说印刷模板制造印刷电路板的方法
公开(公告)号：US07854197B2
公开(公告)日：2010-12-21
申请号：US11940910
申请日：2007-11-15
申请人： Tso-Hung Yeh , Hsiao-Chun Huang , Chun-Ta Huang , Meng-Hung Wu
发明人： Tso-Hung Yeh , Hsiao-Chun Huang , Chun-Ta Huang , Meng-Hung Wu
IPC分类号： B41M1/12
CPC分类号： H05K1/0266 , B05C17/06 , H05K3/0052 , H05K3/1225 , H05K2201/09936 , H05K2203/0557 , Y10T29/49155
摘要： An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.
摘要翻译：提供了用于印刷用于制造多个印刷电路板的电路基板的示例性图案印刷模版。模板包括至少第一印刷部分，至少第二印刷部分和第一印刷部分和第二印刷部分之间的连接部分。第一印刷部分和第二印刷部分各自在其中限定多个图例孔。第一印刷部分和第二部分被配置为附接在电路基板的相应的电路板单元上并覆盖其上，以在电路板单元上打印图例。接合部分在其中限定槽，并且被配置用于附接在电路基板的对应连接部分上并覆盖其上，以在连接部分上印刷图例油墨层。还提供了使用该模板制造多个印刷电路板的方法。

2. 发明授权

US07877872B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US07877872B2
公开(公告)日：2011-02-01
申请号：US11967004
申请日：2007-12-29
申请人： Hsiao-Chun Huang , Meng-Hung Wu , Cheng-Hsien Lin
发明人： Hsiao-Chun Huang , Meng-Hung Wu , Cheng-Hsien Lin
IPC分类号： H01K3/10
CPC分类号： H05K3/4092 , H05K3/061 , H05K3/281 , H05K2201/0397 , H05K2201/09063 , H05K2203/063 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.
摘要翻译：一种中空印刷电路板的制造方法，包括以下步骤：提供导电层; 层压具有限定在其中的第一通孔的第一电介质层在导电层的第一表面上; 在第一开口中的导电层的第一表面上形成保护层; 在导电层中形成导电图案; 去除保护层; 并且以使得所述第一通孔与所述第二通孔对准的方式层压具有限定在其中的第二通孔的第二介电层，所述第二介电层在所述导电层的相对的第二表面上，从而一部分所述导电层暴露于外部通过第一通孔和第二通孔。

3. 发明申请

US20070215490A1 METHOD OF ANALYZING ACCELERATOR FOR COPPER ELECTROPLATING 审中-公开
标题翻译：铜电解加速器分析方法
公开(公告)号：US20070215490A1
公开(公告)日：2007-09-20
申请号：US11308356
申请日：2006-03-18
申请人： Wei-Ping Dow , Ming-Yao Yen , Hsiao-Chun Huang
发明人： Wei-Ping Dow , Ming-Yao Yen , Hsiao-Chun Huang
IPC分类号： G01N27/26
CPC分类号： G01N27/42 , C25D3/38 , C25D21/12
摘要： A method of analyzing accelerator of copper electroplating includes a selective adsorption step and an electrochemical deposition step. First, a gold electrode is placed into a plating solution, which contains organic additives. Then, the gold electrode is dipped in the plating solution for a while to adsorb the sulfur-containing accelerators. After the sulfur-containing accelerators are adsorbed on the gold electrode, the gold electrode is rinsed with Milli-Q ultra pure water. Then, the gold electrode is put into an electrolyte, which contains PEG and chloride ions to carry out a cathodic cyclic voltammetry (CCV) for copper deposition on the gold electrode. A calibration curve for the accelerator analysis can be obtained by integrating the polarization curve measured from the CCV.
摘要翻译：分析铜电镀加速剂的方法包括选择性吸附步骤和电化学沉积步骤。首先，将金电极放入含有有机添加剂的电镀液中。然后，将金电极浸渍在电镀液中一段时间以吸附含硫促进剂。在含硫促进剂被吸附在金电极上之后，金电极用Milli-Q超纯水冲洗。然后，将金电极放入含有PEG和氯离子的电解质中，以进行阴极循环伏安法（CCV），以在金电极上沉积铜。可以通过积分从CCV测量的极化曲线来获得加速器分析的校准曲线。

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