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1. 发明申请

US20110298000A1 CHIP PACKAGE 有权
标题翻译：芯片包装
公开(公告)号：US20110298000A1
公开(公告)日：2011-12-08
申请号：US13154337
申请日：2011-06-06
申请人： Tsang-Yu LIU , Yu-Lin YEN , Chuan-Jin SHIU , Po-Shen LIN
发明人： Tsang-Yu LIU , Yu-Lin YEN , Chuan-Jin SHIU , Po-Shen LIN
IPC分类号： H01L33/52 , H01L31/0203
CPC分类号： H01L27/14623 , H01L23/481 , H01L24/05 , H01L24/13 , H01L33/44 , H01L2224/0401 , H01L2224/05027 , H01L2224/0557 , H01L2224/05572 , H01L2224/93 , H01L2224/94 , H01L2924/0002 , H01L2924/01021 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2224/81 , H01L2224/11 , H01L2224/05552 , H01L2924/00
摘要： According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.
摘要翻译：根据本发明的实施例，提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 在所述基板的所述第一表面和所述第二表面之间的光学装置; 形成在所述基板的第二表面上的保护层，其中所述保护层具有至少一个开口; 至少形成在所述保护层的开口中并电连接到所述光学装置的导电凸起; 以及形成在所述保护层上的遮光层，其中所述遮光层进一步延伸到所述保护层的开口的侧壁上。

2. 发明申请

US20130045549A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
标题翻译：芯片包装及其形成方法
公开(公告)号：US20130045549A1
公开(公告)日：2013-02-21
申请号：US13588898
申请日：2012-08-17
申请人： Chuan-Jin SHIU , Po-Shen LIN , Shen-Yuan MAO , Cheng-Chi PENG
发明人： Chuan-Jin SHIU , Po-Shen LIN , Shen-Yuan MAO , Cheng-Chi PENG
IPC分类号： H01L33/60 , H01L31/0232
CPC分类号： H01L27/14618 , H01L2224/13 , H01L2933/0025
摘要： An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.
摘要翻译：本发明的一个实施例提供了一种用于形成芯片封装的方法，其包括：提供具有第一表面和第二表面的衬底，其中在衬底中形成至少一个光电器件; 在所述基板上形成绝缘层; 在所述基板上的所述绝缘层上形成导电层，其中所述导电层电连接到所述至少一个光电器件; 以及在所述基板的第二表面上喷射遮光材料的溶液，以在所述基板的第二表面上形成遮光层。

3. 发明申请

US20130001621A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
标题翻译：芯片包装及其形成方法
公开(公告)号：US20130001621A1
公开(公告)日：2013-01-03
申请号：US13536628
申请日：2012-06-28
申请人： Chuan-Jin SHIU , Po-Shen LIN , Yi-Ming CHANG
发明人： Chuan-Jin SHIU , Po-Shen LIN , Yi-Ming CHANG
IPC分类号： H01L33/60
CPC分类号： H01L27/14618 , H01L27/1463 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.
摘要翻译：本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 遮光层，其设置在所述基板的所述第二表面上并与所述导电层直接接触，其中所述遮光层具有大于约80％的遮光率并且具有暴露所述导电层的至少一个开口; 以及布置在所述遮光层的开口中以与所述导电层电接触的导电凸块，其中所述遮光层和所述导电凸起部分都基本上完全覆盖所述基板的第二表面。

4. 发明申请

US20130026523A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
标题翻译：芯片包装及其形成方法
公开(公告)号：US20130026523A1
公开(公告)日：2013-01-31
申请号：US13560842
申请日：2012-07-27
申请人： Chuan-Jin SHIU , Po-Shen LIN , Yi-Ming CHANG , Hui-Ching YANG , Chiung-Lin LAI
发明人： Chuan-Jin SHIU , Po-Shen LIN , Yi-Ming CHANG , Hui-Ching YANG , Chiung-Lin LAI
IPC分类号： H01L33/52 , H01L31/0216
CPC分类号： H01L27/14623 , H01L24/13 , H01L27/14618 , H01L27/14632 , H01L27/14634 , H01L27/14636 , H01L27/14687 , H01L27/1469 , H01L33/52 , H01L2224/02372 , H01L2224/0401 , H01L2224/13024 , H01L2924/12041 , H01L2924/13091 , H01L2924/1461 , H01L2924/00
摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.
摘要翻译：本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 设置在所述基板的第二表面上的第一遮光层; 以及第二遮光层，其设置在所述第一遮光层上并与所述第一遮光层直接接触，其中所述第一遮光层和所述第二遮光层之间的接触界面。

5. 发明申请

US20120292744A1 CHIP PACKAGE, METHOD FOR FORMING THE SAME, AND PACKAGE WAFER 有权
标题翻译：芯片封装，其形成方法和封装波形
公开(公告)号：US20120292744A1
公开(公告)日：2012-11-22
申请号：US13476748
申请日：2012-05-21
申请人： Tsang-Yu LIU , Chia-Sheng LIN , Chia-Ming CHENG , Po-Shen LIN
发明人： Tsang-Yu LIU , Chia-Sheng LIN , Chia-Ming CHENG , Po-Shen LIN
IPC分类号： H01L23/544 , H01L21/78
CPC分类号： H01L21/78 , H01L21/682 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L23/544 , H01L2223/54406 , H01L2223/54433 , H01L2223/5448 , H01L2224/02372 , H01L2224/02375 , H01L2224/0401 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2924/13091 , H01L2924/1461 , H01L2924/014 , H01L2924/00
摘要： An embodiment of the invention provides a chip package which includes: a substrate, wherein the substrate is diced from a wafer; a device region formed in the substrate; a conducting layer disposed on the substrate and electrically connected to the device region; an insulating layer disposed between the substrate and the conducting layer; and a material layer formed on the insulating layer, wherein the material layer has a recognition mark, and the recognition mark shows position information of the substrate in the wafer before the substrate is diced from the wafer.
摘要翻译：本发明的实施例提供了一种芯片封装，其包括：衬底，其中所述衬底从晶片切割; 形成在所述基板中的器件区域; 导电层，其设置在所述基板上并电连接到所述器件区域; 设置在所述基板和所述导电层之间的绝缘层; 以及形成在所述绝缘层上的材料层，其中所述材料层具有识别标记，并且所述识别标记在从所述晶片切割所述基板之前，示出所述晶片中的所述基板的位置信息。

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