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1. 发明授权

US07538509B1 Controlling the speed of cooling fans for multiple computer systems based on altitude/fluid density measurements from a centralized sensor 有权
标题翻译：根据集中传感器的高度/流体密度测量，控制多台计算机系统的冷却风扇的速度
公开(公告)号：US07538509B1
公开(公告)日：2009-05-26
申请号：US12192983
申请日：2008-08-15
申请人： Troy W. Glover , Michael S. June , Whitcomb R. Scott, III , Robert S. Smith
发明人： Troy W. Glover , Michael S. June , Whitcomb R. Scott, III , Robert S. Smith
IPC分类号： H02P5/68
CPC分类号： G06F1/20 , H05K7/20836 , Y10S388/929
摘要： The present invention can include an automated method controlling the fan speed of computer system cooling fans with altitude and/or fluid density data from a centralized sensor. Such a method can utilize a centralized sensor to determine the altitude/fluid density within an enclosed area. The centralized sensor can be positioned so as to be unaffected by extraneous activities within the enclosed area. The determined altitude/fluid density can be conveyed to a computer system containing one or more cooling fans. The computer system can be located within the enclosed area. Then, the computer system can determine the need for adjusting the speed of the cooling fans based on the altitude/fluid density. When the need for adjustment exists, the speed of the cooling fans can be adjusted in accordance with the altitude/fluid density.
摘要翻译：本发明可以包括一种自动化方法，其控制来自集中式传感器的高度和/或流体密度数据的计算机系统冷却风扇的风扇速度。这种方法可以利用集中传感器来确定封闭区域内的高度/流体密度。集中传感器可以定位成不受封闭区域内的外部活动的影响。确定的高度/流体密度可被传送到包含一个或多个冷却风扇的计算机系统。计算机系统可以位于封闭区域内。然后，计算机系统可以根据高度/流体密度确定调整冷却风扇速度的需要。当需要调整时，可以根据高度/流体密度来调节冷却风扇的速度。

2. 发明授权

US07595986B2 Controlling airflow in a computer chassis 有权
标题翻译：控制计算机机箱中的气流
公开(公告)号：US07595986B2
公开(公告)日：2009-09-29
申请号：US11936104
申请日：2007-11-07
申请人： Troy W. Glover , Michael S. June , Vinod Kamath , Whitcomb R. Scott, III
发明人： Troy W. Glover , Michael S. June , Vinod Kamath , Whitcomb R. Scott, III
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要翻译：配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

3. 发明申请

US20090116190A1 Controlling Airflow In A Computer Chassis 有权
标题翻译：控制计算机机箱中的气流
公开(公告)号：US20090116190A1
公开(公告)日：2009-05-07
申请号：US11936104
申请日：2007-11-07
申请人： Troy W. Glover , Michael S. June , Vinod Kamath , Whitcomb R. Scott, III
发明人： Troy W. Glover , Michael S. June , Vinod Kamath , Whitcomb R. Scott, III
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要翻译：配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

4. 发明申请

US20130133859A1 HEAT SINK WITH HEAT BUS AND FIN STRUCTURE 审中-公开
标题翻译：散热与散热和熔体结构
公开(公告)号：US20130133859A1
公开(公告)日：2013-05-30
申请号：US13307562
申请日：2011-11-30
申请人： Troy W. Glover , Michael S. June , Bejoy J. Kochuparambil , Chunjian Ni , Pradeep Ramineni , Whitcomb R. Scott, III
发明人： Troy W. Glover , Michael S. June , Bejoy J. Kochuparambil , Chunjian Ni , Pradeep Ramineni , Whitcomb R. Scott, III
IPC分类号： F28F13/00 , F28F7/00
CPC分类号： H01L23/367 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.
摘要翻译：散热器，用于从机箱内的处理器移除热量，使空气流过散热片上的翅片结构。散热器的实施例包括接合处理器的热母线，以将热量从处理器传导到具有相互连接的重复蜂窝空气通道的翅片结构。 U形热母线包括底座以及从翅片结构的相对侧延伸的第一和第二腿部。热量总线的一个实施例具有固体导电芯，以将热量从处理器传导通过基座，第一和第二支腿传导到翅片结构的侧面。或者，热量总线的一个实施例具有一个中空的芯，该中空芯含有一种流体，用于将来自处理器的热量从底部以及第一和第二支腿蒸发地传递到翅片结构的侧面。

5. 发明授权

US09875951B2 Heat sink with orientable fins 有权
公开(公告)号：US09875951B2
公开(公告)日：2018-01-23
申请号：US13302729
申请日：2011-11-22
申请人： Troy W. Glover , Chunjian Ni , Whitcomb R. Scott, III , Mark E. Steinke
发明人： Troy W. Glover , Chunjian Ni , Whitcomb R. Scott, III , Mark E. Steinke
IPC分类号： F28F7/02 , H01L23/36 , H01L23/40 , H01L23/467
CPC分类号： H01L23/36 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.

6. 发明申请

US20130126145A1 HEAT SINK WITH ORIENTABLE FINS 有权
标题翻译：加热与定向FINS
公开(公告)号：US20130126145A1
公开(公告)日：2013-05-23
申请号：US13302729
申请日：2011-11-22
申请人： Troy W. Glover , Chunjian Ni , Whitcomb R. Scott, III , Mark E. Steinke
发明人： Troy W. Glover , Chunjian Ni , Whitcomb R. Scott, III , Mark E. Steinke
IPC分类号： F28F7/00
CPC分类号： H01L23/36 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.
摘要翻译：散热器包括第一导热底座，其具有第一面以热接合发热电子部件，第二导热基座具有在第一面和第二面上的多个翅片以接合第一基座。第二基座上的翅片可相对于散热器耦合到的发热电子部件的两个取向中的任一个定位。翅片选择性地放置在最佳地利用可用于散热器的空气流动方向的方向上。散热片的可取向散热片在电路板上布置发热电子部件或将电路板布置在计算机机箱内时具有灵活性。

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