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    • 3. 发明申请
    • MICROSTRUCTURE FOR A SEEBECK EFFECT THERMOELECTRIC GENERATOR, AND METHOD FOR MAKING SUCH A MICROSTRUCTURE
    • 用于SEEBECK效应的热电发生器的微结构以及用于制造这种微结构的方法
    • US20120060888A1
    • 2012-03-15
    • US13297540
    • 2011-11-16
    • Natalio MINGO BISQUERTTristan CaroffMarc PlissonnierVincent RemondiereShidong Wang
    • Natalio MINGO BISQUERTTristan CaroffMarc PlissonnierVincent RemondiereShidong Wang
    • H01L35/32H01L35/34
    • H01L35/32H01L35/34
    • A method for making a thermoelectric microstructure includes: forming an insulating substrate; forming, on the substrate, a first assembly of conductor or semiconductor elements extending in parallel and in a first direction from first to second connection areas, and having a first Seebeck coefficient; forming, on the substrate, a second assembly of conductor or semiconductor elements electrically insulated from the first assembly and extending in parallel and in a second direction other than the first one, from the first to second connection areas, and having a second Seebeck coefficient other than the first one; providing, in the first and second connection areas, electric connection elements, each of which electrically connects at least one element of first and second assemblies; two conductor or semiconductor elements of a single assembly are separated in a predetermined direction by a predetermined average distance in the connection areas.
    • 制造热电微结构的方法包括:形成绝缘基板; 在所述基板上形成从第一连接区域到第二连接区域平行延伸并且沿第一方向延伸的导体或半导体元件的第一组件,并具有第一塞贝克系数; 在所述基板上形成与所述第一组件电绝缘并且从所述第一连接区域到所述第二连接区域平行延伸并且沿除第一方法之外的第二方向延伸的导体或半导体元件的第二组件,并且具有第二塞贝克系数其他 比第一个 在第一和第二连接区域中提供电连接元件,每个电连接元件电连接第一和第二组件的至少一个元件; 单个组件的两个导体或半导体元件在连接区域中沿预定方向分开预定的平均距离。