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    • 2. 发明授权
    • Hot-melt silicone adhesive
    • 热熔硅胶
    • US08093333B2
    • 2012-01-10
    • US11909770
    • 2006-03-27
    • Toyohiko FujisawaYoshito UshioManabu SutohYoshinori TaniguchiKoji Nakanishi
    • Toyohiko FujisawaYoshito UshioManabu SutohYoshinori TaniguchiKoji Nakanishi
    • C08L83/04B32B33/00
    • C08L83/04C08G77/12C08G77/18C08G77/20C08G77/70C08G2170/20Y10T428/1476C08L83/00
    • A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250° C.; (B) an organopolysiloxane that at 25° C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.
    • 一种热熔性硅氧烷粘合剂,其包含:(A)软化点在40至250℃范围内的有机聚硅氧烷树脂; (B)在25℃下为液体或处于粗橡胶状态的有机聚硅氧烷,其在一个分子中含有至少两个烯基; (C)选自(i)含硅键合的氢原子的有机聚硅氧烷和(ii)含有硅键合的烷氧基的有机硅化合物的混合物的组合物; 或(iii)含硅键合氢原子和与硅键合的烷氧基的有机聚硅氧烷; (D)氢化硅烷化催化剂; 和(E)氢化硅烷化反应抑制剂,即使在低压下也具有高表面粗糙度的被粘物的热压粘合中的良好间隙填充能力,并且在交联后对被粘物提供强粘合性。