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1. 发明申请

US20150064347A1 METHOD FOR PRODUCING HARD DISK SUBSTRATE 审中-公开
标题翻译：生产硬盘基板的方法
公开(公告)号：US20150064347A1
公开(公告)日：2015-03-05
申请号：US14391509
申请日：2013-04-02
申请人： Toyo Kohan Co., Ltd.
发明人： Gen Ishida , Nobuaki Mukai , Takahiro Yoshida
IPC分类号： G11B5/858
CPC分类号： G11B5/858 , G11B5/7315 , G11B5/8404
摘要： An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions. A method for producing a hard disk substrate of the present invention includes a first plating step of immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, the lower layer having smaller average surface roughness than the surface; and a second plating step of immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film, the upper layer having corrosion resistance against acid solutions. Exposure of the lower layer to the atmosphere is suppressed in the period during transition from the first plating step to the second plating step.
摘要翻译：本发明的目的是获得通过无电镀NiP镀层可以具有镀膜的光滑表面的硬质基板，并且不会对酸溶液具有劣化的耐腐蚀性。本发明的硬盘基板的制造方法包括将基板浸渍在含有具有调平作用的添加剂的第一非电解NiP镀液中的第一镀层工序，从而在无机NiP镀膜的表面上形成下层基底，下层具有比表面更小的平均表面粗糙度; 以及第二电镀步骤，在第二无电镀NiP电镀浴中，通过第一电镀步骤将具有形成在其上的无电NiP镀膜的下层的基板浸渍，从而形成无电镀NiP镀膜的上层，对酸溶液具有耐腐蚀性。在从第一电镀步骤到第二电镀步骤的转变期间，下层对大气的曝光被抑制。

2. 发明授权

US09297078B2 Method for producing hard disk substrate 有权
标题翻译：硬盘基板的制造方法
公开(公告)号：US09297078B2
公开(公告)日：2016-03-29
申请号：US14391296
申请日：2013-04-02
申请人： Toyo Kohan Co., Ltd.
发明人： Gen Ishida , Nobuaki Mukai , Takahiro Yoshida
IPC分类号： C23C18/32 , G11B5/73 , G11B5/84 , C23C18/16 , G11B5/858 , C23C18/36 , G11B5/80 , C23C18/18
CPC分类号： C23C18/32 , C23C18/1651 , C23C18/1844 , C23C18/36 , G11B5/7315 , G11B5/8404 , G11B5/858
摘要： An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions. A method for producing a hard disk substrate of the present invention is a method for producing a hard disk substrate with an electroless NiP plating film, the method including immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, the lower layer having smaller average surface roughness than the surface; and immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film, the upper layer having corrosion resistance against acid solutions and having a thickness of greater than or equal to 4 μm.
摘要翻译：本发明的目的是获得通过无电镀NiP镀层可以具有镀膜的光滑表面的硬质基板，并且不会对酸溶液具有劣化的耐腐蚀性。本发明的硬盘基板的制造方法是使用无电NiP镀膜来制造硬盘基板的方法，该方法包括将基板浸入含有具有调平作用的添加剂的第一非电解NiP镀浴中，从而形成在该基板的表面上的无电NiP镀膜的下层，下层的平均表面粗糙度比表面小; 并通过第一电镀NiP电镀浴将具有形成在其上的无电解NiP镀膜的下层的基板浸渍在第二无电NiP电镀浴中，从而形成无电NiP镀膜的上层，上层对酸具有耐腐蚀性溶液并且具有大于或等于4μm的厚度。

3. 发明申请

US20150125598A1 METHOD FOR PRODUCING HARD DISK SUBSTRATE 有权
标题翻译：生产硬盘基板的方法
公开(公告)号：US20150125598A1
公开(公告)日：2015-05-07
申请号：US14391296
申请日：2013-04-02
申请人： TOYO KOHAN CO., LTD.
发明人： Gen Ishida , Nobuaki Mukai , Takahiro Yoshida
IPC分类号： G11B5/858 , C23C18/16 , C23C18/32
CPC分类号： C23C18/32 , C23C18/1651 , C23C18/1844 , C23C18/36 , G11B5/7315 , G11B5/8404 , G11B5/858
摘要： An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions. A method for producing a hard disk substrate of the present invention is a method for producing a hard disk substrate with an electroless NiP plating film, the method including immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, the lower layer having smaller average surface roughness than the surface; and immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film, the upper layer having corrosion resistance against acid solutions and having a thickness of greater than or equal to 4 μm.
摘要翻译：本发明的目的是获得通过无电镀NiP镀层可以具有镀膜的光滑表面的硬质基板，并且不会对酸溶液具有劣化的耐腐蚀性。本发明的硬盘基板的制造方法是使用无电NiP镀膜来制造硬盘基板的方法，该方法包括将基板浸入含有具有调平作用的添加剂的第一非电解NiP镀浴中，从而形成在该基板的表面上的无电NiP镀膜的下层，下层的平均表面粗糙度比表面小; 并通过第一电镀NiP电镀浴将具有形成在其上的无电解NiP镀膜的下层的基板浸渍在第二无电NiP电镀浴中，从而形成无电NiP镀膜的上层，上层对酸具有耐腐蚀性溶液并且具有大于或等于4μm的厚度。

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