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1. 发明授权

US08622594B2 Light emitting element module and manufacturing method thereof, and backlight apparatus 有权
标题翻译：发光元件模块及其制造方法以及背光装置
公开(公告)号：US08622594B2
公开(公告)日：2014-01-07
申请号：US12832755
申请日：2010-07-08
申请人： Toshiya Ishio , Yasuhiko Tanaka
发明人： Toshiya Ishio , Yasuhiko Tanaka
IPC分类号： F21V17/00 , H01L33/00
CPC分类号： G02F1/133606 , G02F1/133603 , G02F2001/133607 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting element module with a high yield where a portion through which a substrate and a lens are bonded can be prevented from cracking and peeling due to thermal expansion is provided. A light emitting element part equipped with a light emitting element and an optical lens for diffusing light from the light emitting element are provided on a substrate in the light emitting element module, where the lens is fixed to the substrate with an adhesive resin having a tensile breaking elongation of 50% or more. The lens also has a plurality of supports and is fixed to the substrate through these supports, so that stress in the portion where the substrate and the lens are bonded can be dispersed between the supports, and a layer in which air can circulate so as to release heat is provided between the substrate and the lens.
摘要翻译：提供了一种具有高产量的发光元件模块，其中衬底和透镜通过其接合的部分被提供，因为可以防止由于热膨胀而产生的开裂和剥离。在发光元件模块中的基板上设置有配备有发光元件的发光元件和用于漫射来自发光元件的光的透镜的发光元件部，其中透镜通过具有拉伸的粘合树脂固定到基板断裂伸长率在50％以上。透镜还具有多个支撑体，并且通过这些支撑件固定到基板上，使得基板和透镜结合的部分中的应力可以分散在支撑件之间和空气可以循环的层中，以便在基板和透镜之间设置释放热。

2. 发明申请

US20110007493A1 LIGHT EMITTING ELEMENT MODULE AND MANUFACTURING METHOD THEREOF, AND BACKLIGHT APPARATUS 有权
标题翻译：发光元件组件及其制造方法及背光装置
公开(公告)号：US20110007493A1
公开(公告)日：2011-01-13
申请号：US12832755
申请日：2010-07-08
申请人： Toshiya Ishio , Yasuhiko Tanaka
发明人： Toshiya Ishio , Yasuhiko Tanaka
IPC分类号： G02F1/13357 , H01L33/58 , H01L33/48
CPC分类号： G02F1/133606 , G02F1/133603 , G02F2001/133607 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014
摘要： The invention provides a light emitting element module with a high yield where a portion through which a substrate and a lens are bonded can be prevented from cracking and peeling due to thermal expansion. A light emitting element part equipped with a light emitting element and an optical lens for diffusing light from the light emitting element are provided on a substrate in the light emitting element module, where the lens is fixed to the substrate with an adhesive resin having a tensile breaking elongation of 50% or more. The lens also has a plurality of supports and is fixed to the substrate through these supports, so that stress in the portion where the substrate and the lens are bonded can be dispersed between the supports, and a layer in which air can circulate so as to release heat is provided between the substrate and the lens.
摘要翻译：本发明提供了一种发光元件模块，其具有高的屈服度，其中可以防止基板和透镜结合的部分由于热膨胀而破裂和剥离。在发光元件模块中的基板上设置有配备有发光元件的发光元件和用于漫射来自发光元件的光的透镜的发光元件部，其中透镜通过具有拉伸的粘合树脂固定到基板断裂伸长率在50％以上。透镜还具有多个支撑体，并且通过这些支撑件固定到基板上，使得基板和透镜结合的部分中的应力可以分散在支撑件之间和空气可以循环的层中，以便在基板和透镜之间设置释放热。

3. 发明授权

US07906856B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US07906856B2
公开(公告)日：2011-03-15
申请号：US12109664
申请日：2008-04-25
申请人： Toshiya Ishio
发明人： Toshiya Ishio
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/525 , H01L23/3114 , H01L23/5225 , H01L24/05 , H01L24/45 , H01L2224/023 , H01L2224/0231 , H01L2224/05624 , H01L2224/45147 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/12044 , H01L2924/19042 , H01L2924/30105 , H01L2224/48824 , H01L2924/00 , H01L2224/48
摘要： A semiconductor device has a semiconductor chip provided with an insulating layer formed so as to be thinner in a first secondary-wire-free area than in a first secondary-wire-containing area. Further, the semiconductor chip has an edge extending further outward than a side wall, which severs as an edge of an upper insulating layer, in an extending direction of a circuit-forming surface of the semiconductor chip on which electrode pads are provided. This makes it possible to provide a semiconductor device capable of suppressing electromagnetic interference between a secondary wire and an electronic circuit of a semiconductor chip and the curvature of a wafer even in the case of overlap between the secondary wire and the electronic circuit, and of reducing the risk of occurrence of chipping in a dicing step.
摘要翻译：半导体器件具有半导体芯片，该半导体芯片设置有绝缘层，该绝缘层形成为在比在第一二次电线容纳区域中的第一次二线区域更薄。此外，半导体芯片具有比在其上设置有电极焊盘的半导体芯片的电路形成表面的延伸方向作为上绝缘层的边缘的侧壁进一步向外延伸的边缘。这使得可以提供能够抑制二次线和半导体芯片的电子电路之间的电磁干扰的半导体器件以及即使在二次线和电子电路之间的重叠的情况下的晶片的曲率，并且还原在切割步骤中发生切屑的风险。

4. 发明申请

US20060237848A1 Semiconductor device having a leading wiring layer 有权
标题翻译：具有引线布线层的半导体器件
公开(公告)号：US20060237848A1
公开(公告)日：2006-10-26
申请号：US11474469
申请日：2006-06-26
申请人： Shinji Suminoe , Hiroyuki Nakanishi , Toshiya Ishio , Yoshihide Iwazaki , Katsunobu Mori
发明人： Shinji Suminoe , Hiroyuki Nakanishi , Toshiya Ishio , Yoshihide Iwazaki , Katsunobu Mori
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/05 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05006 , H01L2224/05546 , H01L2224/05567 , H01L2224/13 , H01L2224/13007 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2224/05552 , H01L2924/00
摘要： A manufacturing method of a semiconductor device, comprising the steps of forming an insulation layer, which has an opening section in an area including an area on an electrode pad, on a top surface of the semiconductor substrate on which the electrode pad is formed; at least forming a first barrier metal layer, which becomes a part of a leading wiring layer, in an inner peripheral surface of the opening section including the top surface of the electrode pad; at least forming a main conductor layer, which becomes a part of the leading wiring layer, in an area surrounded by the first barrier metal layer in the opening section; eliminating an upper portion of the main conductor layer at least to a position at which the first barrier metal layer is exposed, and forming a second barrier metal layer, which becomes a part of the leading wiring layer, so as to cover the whole top surface of the main conductor layer.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：在形成有电极焊盘的半导体衬底的顶表面上形成绝缘层，该绝缘层在包括电极焊盘的区域的区域中具有开口部分; 至少在包括所述电极焊盘的顶面的所述开口部的内周面中形成成为前导布线层的一部分的第一阻挡金属层; 至少在由开口部分中的第一阻挡金属层包围的区域中形成成为引导布线层的一部分的主导体层; 消除主导体层的上部至少到第一阻挡金属层露出的位置，形成作为引导布线层的一部分的第二阻挡金属层，以覆盖整个顶表面的主导体层。

5. 发明授权

US08297784B2 Surface-emission unit and method for producing the same 有权
标题翻译：表面发射单元及其制造方法
公开(公告)号：US08297784B2
公开(公告)日：2012-10-30
申请号：US12835492
申请日：2010-07-13
申请人： Toshiya Ishio , Mitsuru Hineno , Nobuo Ogata , Shinji Suminoe
发明人： Toshiya Ishio , Mitsuru Hineno , Nobuo Ogata , Shinji Suminoe
IPC分类号： F21V1/00
CPC分类号： G02B19/0014 , G02B19/0061 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A surface-emission unit to prevent irregularity in brightness from being generated is provided. The surface-emission unit is composed of light-emission element parts each having a light-emission element, aligned and arranged on a substrate two-dimensionally, and optical lenses each arranged on the substrate with respect to each light-emission element part, to diffuse light from the light-emission element, and a support part to fix the optical lens onto the substrate is arranged so as not overlap a line connecting the light-emission element part corresponding to the optical lens fixed by the support part, to another light-emission element part adjacent to the light-emission element part.
摘要翻译：提供了防止产生亮度不均的表面发射单元。表面发射单元由二维排列并排列在基板上的发光元件和相对于每个发光元件部分配置在基板上的光学透镜的发光元件部分组成，将发光元件的漫射光和将光学透镜固定在基板上的支撑部被配置为不与将与由支撑部固定的光学透镜对应的发光元件部连接到另一个光 - 发光元件部分。

6. 发明授权

US06838748B2 Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof 有权
标题翻译：具有背面/侧面上的电磁屏蔽层的半导体元件
公开(公告)号：US06838748B2
公开(公告)日：2005-01-04
申请号：US10434205
申请日：2003-05-09
申请人： Toshiya Ishio , Hiroyuki Nakanishi , Katsunobu Mori , Yoshihide Iwazaki , Shinji Suminoe
发明人： Toshiya Ishio , Hiroyuki Nakanishi , Katsunobu Mori , Yoshihide Iwazaki , Shinji Suminoe
IPC分类号： H01L23/00 , H01L23/31 , H01L23/552 , H01L29/06
CPC分类号： H01L23/552 , H01L23/3114 , H01L24/45 , H01L24/48 , H01L24/97 , H01L29/0657 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/16 , H01L2224/45144 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding layer for shielding electromagnetic waves. With this, it is possible to provide a semiconductor element capable of being easily manufactured into a smaller semiconductor device compared with a conventional semiconductor device equipped with a shielding cap; a semiconductor device; and a method for manufacturing a semiconductor element.
摘要翻译：本发明的半导体芯片被布置成使得其上形成有元件电路的正面具有电极焊盘，并且侧面和背面涂覆有用于屏蔽电磁波的屏蔽层。由此，与配备有屏蔽盖的现有的半导体装置相比，可以提供能够容易地制造成较小的半导体装置的半导体元件; 半导体器件; 以及半导体元件的制造方法。

7. 发明授权

US06552426B2 Semiconductor device and method of manufacturing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06552426B2
公开(公告)日：2003-04-22
申请号：US09847314
申请日：2001-05-03
申请人： Toshiya Ishio , Hiroyuki Nakanishi , Katsunobu Mori
发明人： Toshiya Ishio , Hiroyuki Nakanishi , Katsunobu Mori
IPC分类号： H01L2352
CPC分类号： H01L24/97 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/06558 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a quality and reliable high-density package (Chip Size Package) semiconductor device without problems related to the manufacturing process. The semiconductor device includes the first semiconductor substrate piece having electrode pads formed on its principle surface, and a second semiconductor mounting piece mounted thereon via a first insulating film and a die-attaching material. On the surface opposite the first semiconductor substrate piece of the second semiconductor substrate piece, formed are wiring patterns and a second insulating film for protecting the wiring patterns. The wiring patterns include electrode pads, wires, and lands where external connection terminals are provided.
摘要翻译：本发明提供了质量可靠的高密度封装（芯片尺寸封装）半导体器件，而与制造工艺无关。半导体器件包括：第一半导体衬底片，其具有形成在其主表面上的电极焊盘;以及第二半导体安装件，其经由第一绝缘膜和管芯附着材料安装在其上。在与第二半导体衬底片的第一半导体衬底片相对的表面上形成布线图案和用于保护布线图案的第二绝缘膜。布线图案包括设置有外部连接端子的电极焊盘，电线和焊盘。

8. 发明授权

US07667336B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07667336B2
公开(公告)日：2010-02-23
申请号：US11889113
申请日：2007-08-09
申请人： Toshiya Ishio
发明人： Toshiya Ishio
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40 , H01L23/485 , H01L23/488
CPC分类号： H01L24/13 , H01L23/3185 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/0231 , H01L2224/0401 , H01L2224/05017 , H01L2224/05018 , H01L2224/05027 , H01L2224/05554 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05567 , H01L2224/05572 , H01L2224/05599 , H01L2224/114 , H01L2224/116 , H01L2224/13005 , H01L2224/13006 , H01L2224/13022 , H01L2224/13027 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/351 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device provided with a semiconductor chip wherein an electrode pad is formed on a circuit formation surface, includes a first passivation film, which serves as an adhering layer; a second passivation film formed on the first passivation film, for protecting the semiconductor chip from external physical damage; a metal film formed so as to cover at least a first electrode-pad opening section of the first passivation film; and an external connection terminal to connect the electrode pad to an external equipment. A second electrode-pad opening section of the second passivation film is formed so as to expose the first electrode-pad opening section entirely. The second passivation film is formed so as not to be in direct contact with the electrode pad.
摘要翻译：具有半导体芯片的半导体器件，其中电极焊盘形成在电路形成表面上，包括用作粘合层的第一钝化膜; 形成在所述第一钝化膜上的用于保护所述半导体芯片免受外部物理损坏的第二钝化膜; 形成为覆盖所述第一钝化膜的至少第一电极焊盘开口部的金属膜; 以及将电极焊盘连接到外部设备的外部连接端子。形成第二钝化膜的第二电极焊盘开口部分，以使第一电极焊盘开口部分完全露出。第二钝化膜形成为不与电极焊盘直接接触。

9. 发明申请

US20080036086A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20080036086A1
公开(公告)日：2008-02-14
申请号：US11889113
申请日：2007-08-09
申请人： Toshiya Ishio
发明人： Toshiya Ishio
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/13 , H01L23/3185 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/0231 , H01L2224/0401 , H01L2224/05017 , H01L2224/05018 , H01L2224/05027 , H01L2224/05554 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05567 , H01L2224/05572 , H01L2224/05599 , H01L2224/114 , H01L2224/116 , H01L2224/13005 , H01L2224/13006 , H01L2224/13022 , H01L2224/13027 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/351 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device provided with a semiconductor chip wherein an electrode pad is formed on a circuit formation surface, includes a first passivation film, which serves as an adhering layer; a second passivation film formed on the first passivation film, for protecting the semiconductor chip from external physical damage; a metal film formed so as to cover at least a first electrode-pad opening section of the first passivation film; and an external connection terminal to connect the electrode pad to an external equipment. A second electrode-pad opening section of the second passivation film is formed so as to expose the first electrode-pad opening section entirely. The second passivation film is formed so as not to be in direct contact with the electrode pad.
摘要翻译：具有半导体芯片的半导体器件，其中电极焊盘形成在电路形成表面上，包括用作粘合层的第一钝化膜; 形成在所述第一钝化膜上的用于保护所述半导体芯片免受外部物理损坏的第二钝化膜; 形成为覆盖所述第一钝化膜的至少第一电极焊盘开口部的金属膜; 以及将电极焊盘连接到外部设备的外部连接端子。形成第二钝化膜的第二电极焊盘开口部分，以使第一电极焊盘开口部分完全露出。第二钝化膜形成为不与电极焊盘直接接触。

10. 发明授权

US06921980B2 Integrated semiconductor circuit including electronic component connected between different component connection portions 失效
标题翻译：集成半导体电路，包括连接在不同部件连接部分之间的电子部件
公开(公告)号：US06921980B2
公开(公告)日：2005-07-26
申请号：US10059113
申请日：2002-01-31
申请人： Hiroyuki Nakanishi , Toshiya Ishio , Katsunobu Mori
发明人： Hiroyuki Nakanishi , Toshiya Ishio , Katsunobu Mori
IPC分类号： H01L23/52 , H01L21/3205 , H01L23/31 , H01L25/00 , H01L25/065 , H01L25/16 , H01L23/48 , H01L29/40
CPC分类号： H01L23/3114 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/16 , H01L2224/05001 , H01L2224/05022 , H01L2224/05184 , H01L2224/05548 , H01L2224/1403 , H01L2224/16145 , H01L2224/16265 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73207 , H01L2224/73265 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19104 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/05647 , H01L2224/05166 , H01L2924/00012
摘要： An integrated semiconductor circuit includes a semiconductor chip on which surface a plurality of connection electrodes are formed, a lower insulating layer covering the surface of the semiconductor chip such that the connection electrodes are exposed, a plurality of wiring portions formed on the lower insulating layer, each of the wiring portions being connected to the connection electrode at one end and provided with a component connection portion at the other end, an upper insulating layer covering the wiring portions such that the component connection portions are exposed, and an electronic component connected between different component connection portions.
摘要翻译：集成半导体电路包括其上形成有多个连接电极的表面的半导体芯片，覆盖半导体芯片的表面的下绝缘层，使得连接电极露出，形成在下绝缘层上的多个布线部分，每个布线部分在一端连接到连接电极，并且在另一端处设置有部件连接部分，覆盖布线部分的上绝缘层使得部件连接部分暴露，以及连接在不同的部件之间的电子部件部件连接部分。

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