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1. 发明申请

US20070130839A1 ROLL-OFF REDUCING AGENT 审中-公开
标题翻译：滚筒式减速机
公开(公告)号：US20070130839A1
公开(公告)日：2007-06-14
申请号：US11625097
申请日：2007-01-19
申请人： Toshiya Hagihara , Shigeo Fujii , Yoshiaki Oshima
发明人： Toshiya Hagihara , Shigeo Fujii , Yoshiaki Oshima
IPC分类号： B24D3/02
CPC分类号： C09G1/02
摘要： A roll-off reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; and a roll-off reducing agent composition comprising a roll off-reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; an abrasive; and water.
摘要翻译：包含一种或多种选自由具有OH基或具有OH基团或基团的基团的碳原子数为2〜20的羧酸的化合物的降低还原剂，或具有1〜20个碳原子的单羧酸，以及具有 2至3个碳原子，及其盐; 以及包含一种或多种选自具有OH基团或基团或SH基团的碳原子数为2〜20的羧酸的一种或多种化合物的脱脂还原剂的滚降还原剂组合物，具有1个 20个碳原子的碳原子数为2〜3的二羧酸及其盐，研磨剂和水。

2. 发明授权

US07220676B2 Roll-off reducing agent 有权
标题翻译：滚降还原剂
公开(公告)号：US07220676B2
公开(公告)日：2007-05-22
申请号：US09842769
申请日：2001-04-27
申请人： Toshiya Hagihara , Shigeo Fujii , Yoshiaki Oshima
发明人： Toshiya Hagihara , Shigeo Fujii , Yoshiaki Oshima
IPC分类号： H01L21/461 , C09K13/00 , C09K13/04
CPC分类号： C09G1/02
摘要： A roll-off reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; and a roll-off reducing agent composition comprising a roll off-reducing agent comprising one or more compounds selected from the group consisting of carboxylic acids having 2 to 20 carbon atoms having either OH group or groups or SH group or groups, monocarboxylic acids having 1 to 20 carbon atoms, and dicarboxylic acids having 2 to 3 carbon atoms, and salts thereof; an abrasive; and water.
摘要翻译：包含一种或多种选自由具有OH基或具有OH基团或基团的基团的碳原子数为2〜20的羧酸的化合物的降低还原剂，或具有1〜20个碳原子的单羧酸，以及具有 2至3个碳原子，及其盐; 以及包含一种或多种选自具有OH基团或基团或SH基团的碳原子数为2〜20的羧酸的一种或多种化合物的脱脂还原剂的滚降还原剂组合物，具有1个 20个碳原子的碳原子数为2〜3的二羧酸及其盐，研磨剂和水。

3. 发明授权

US06902591B2 Polishing composition 失效
标题翻译：抛光组成
公开(公告)号：US06902591B2
公开(公告)日：2005-06-07
申请号：US10625593
申请日：2003-07-24
申请人： Hiroaki Kitayama , Shigeo Fujii , Yoshiaki Oshima , Toshiya Hagihara
发明人： Hiroaki Kitayama , Shigeo Fujii , Yoshiaki Oshima , Toshiya Hagihara
IPC分类号： C09G1/02 , B24B1/00 , C09G1/04
CPC分类号： C09G1/02 , B24B37/044 , C09K3/1463 , Y10T428/32
摘要： A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa·s at a shearing rate of 1500 s−1 and 25° C.; a roll-off reducing agent comprising a Brönsted acid or a salt thereof, having an action of lowering viscosity so that the amount of viscosity lowered is 0.01 mPa·s or more, wherein the amount of viscosity lowered is expressed by the following equation: (Amount of Viscosity Lowered)=(Viscosity of Standard Polishing Composition)−(Viscosity of Roll-Off Reducing Agent-Containing Polishing Composition), wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al2O3 purity of 98.0% by weight or more composed of α-type co-random crystal, 1 part by weight of citric acid, and 79 parts by weight of water; the roll-off reducing agent-containing polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al2O3 purity of 98.0% by weight or more composed of α-type co-random crystal, 1 part by weight of citric acid, 78.9 parts by weight of water and 0.1 parts by weight of a roll-off reducing agent; and the viscosity is a viscosity at a shearing rate of 1500 s−1 and 25° C. The polishing composition can be favorably used in polishing the substrate for precision parts.
摘要翻译：一种抛光组合物，其包含磨料，水和有机酸或其盐，其中所述组合物在剪切速率为1500s -1和25℃时具有1.0至2.0mPa.s的特定粘度 C。; 包含布朗斯台德酸或其盐的滚降还原剂，具有降低粘度的作用，使粘度降低量为0.01mPa.s以上，其中降低粘度的量由下式表示：（在线公式）end =“lead”？>（粘度降低）=（标准抛光组合物的粘度） - （含有折射率的还原剂的抛光组合物的粘度） <？in-line-formula description =“In-line Formulas”end =“tail”？>其中制备的标准抛光组合物包含20重量份的研磨剂，所述磨料是具有Al _{2O 3 O 3纯度为98.0重量％或更多，由α型共无规晶体组成，1重量份柠檬酸和79重量份水; 制备含滚降还原剂的抛光组合物，其包含20重量份的研磨剂，所述磨料是具有Al 2 O 3 O 3 3纯度的高纯度氧化铝 98.0重量％以上，由α型协同随机晶体组成，1重量份柠檬酸，78.9重量份水和0.1重量份的滚降还原剂; 粘度为剪切速率为1500秒-1和25℃时的粘度。抛光组合物可有利地用于抛光基板用于精密零件。}

4. 发明授权

US07204936B2 Polishing composition 有权
标题翻译：抛光组成
公开(公告)号：US07204936B2
公开(公告)日：2007-04-17
申请号：US10625610
申请日：2003-07-24
申请人： Hiroaki Kitayama , Shigeo Fujii , Toshiya Hagihara
发明人： Hiroaki Kitayama , Shigeo Fujii , Toshiya Hagihara
IPC分类号： C09K13/00 , C09K13/06 , H01L21/302
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition comprising 0.03 to 0.5% by weight of an organic acid or a salt thereof, an abrasive and water, wherein the abrasive has a surface potential of from −140 to 200 mV; a roll-off reducing agent comprising an inorganic compound having a property of controlling a surface potential of an abrasive in a polishing composition, wherein a surface potential of the abrasive in a standard polishing composition is controlled to −110 to 250 mV by the presence of the inorganic compound, wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, the abrasive being high-purity alumina having Al2O3 purity of 98.0% by weight or more composed of α-type corundum crystal, 1 part by weight of citric acid, 78 parts by weight of water and 1 part by weight of an inorganic compound. The polishing composition or the roll-off reducing agent composition can be favorably used in polishing the substrate for precision parts.
摘要翻译：一种抛光组合物，其包含0.03至0.5重量％的有机酸或其盐，研磨剂和水，其中所述研磨剂具有-140至200mV的表面电位; 包括具有控制抛光组合物中研磨剂的表面电位的性质的无机化合物的滚降还原剂，其中通过存在下述方法将标准抛光组合物中的研磨剂的表面电位控制在-110至250mV 无机化合物，其中制备包含20重量份研磨剂的标准抛光组合物，所述研磨剂是具有98.0的纯度的高纯度氧化铝由α型刚玉晶体，1重量份柠檬酸，78重量份水和1重量份无机化合物组成的重量％以上。抛光组合物或滚降还原剂组合物可有利地用于抛光精密零件用基板。

5. 发明申请

US20080160881A1 POLISHING COMPOSITION 失效
标题翻译：抛光组合物
公开(公告)号：US20080160881A1
公开(公告)日：2008-07-03
申请号：US11948705
申请日：2007-11-30
申请人： Shigeo Fujii , Hiroyuki Yoshida , Toshiya Hagihara , Hiroaki Kitayama
发明人： Shigeo Fujii , Hiroyuki Yoshida , Toshiya Hagihara , Hiroaki Kitayama
IPC分类号： C09G1/02 , B24B1/00 , C09K3/14
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.
摘要翻译：一种抛光组合物，其包含研磨剂和水，其中所述抛光组合物的沉降度指数为80以上且100以下; 一种生产基材的方法，包括使用上述组合物抛光待抛光的基材; 包括施加上述组合物的防止抛光垫堵塞的方法; 一种用于防止抛光垫堵塞的方法，包括将上述组合物用抛光用的待研磨的含镍物体的抛光垫进行抛光; 以及防止抛光垫堵塞的方法，其包括在其分子中施加包含其分子中具有两个或更多个亲水基团的亲水性聚合物和分子量为300以上的组合物或能够溶解氢氧化镍的化合物在pH为8.0的组合物，和水用抛光用的抛光垫进行抛光。

6. 发明授权

US06918938B2 Polishing composition 有权
标题翻译：抛光组成
公开(公告)号：US06918938B2
公开(公告)日：2005-07-19
申请号：US10689085
申请日：2003-10-21
申请人： Toshiya Hagihara , Shigeo Fujii
发明人： Toshiya Hagihara , Shigeo Fujii
IPC分类号： C09G1/02 , B24B1/00
CPC分类号： C09G1/02
摘要： A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition. The polishing composition of the present invention is used for polishing a substrate for precision parts such as substrates for magnetic recording media such as magnetic disks, optical disks, opto-magnetic disks, and the like; photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, concretely polishing a substrate for memory hard disks, and especially finish polishing.
摘要翻译：包含研磨剂，酸和/或其盐和水的抛光组合物，其中每公斤抛光组合物含有1mg或更少量的铜（Cu）; 一种用于减少基材的表面缺陷的方法，包括向基材或抛光垫施用包含研磨剂，酸和/或其盐和水的抛光组合物，其中包含铜（Cu）的量为1 mg / kg / kg的进料到基材或抛光垫的抛光组合物; 以及包括抛光步骤的基材的制造方法，包括将上述抛光组合物施加到基材或抛光垫上。本发明的研磨用组合物用于研磨诸如磁盘，光盘，光磁盘等磁记录介质的基板等精密零件的基板; 光掩模基板，光学透镜，光学镜，光学棱镜和半导体基板，具体地研磨用于存储硬盘的基板，特别是精抛光。

7. 发明授权

US07666238B2 Polishing composition 失效
标题翻译：抛光组成
公开(公告)号：US07666238B2
公开(公告)日：2010-02-23
申请号：US11948705
申请日：2007-11-30
申请人： Shigeo Fujii , Hiroyuki Yoshida , Toshiya Hagihara , Hiroaki Kitayama
发明人： Shigeo Fujii , Hiroyuki Yoshida , Toshiya Hagihara , Hiroaki Kitayama
IPC分类号： B24D3/02 , C09C1/68 , C09G1/02 , C09K13/00
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.
摘要翻译：一种抛光组合物，其包含研磨剂和水，其中所述抛光组合物的沉降度指数为80以上且100以下; 用于制造基材的方法，包括使用上述组合物抛光待抛光的基材; 防止抛光垫堵塞的方法，包括施加上述组合物; 一种用于防止抛光垫堵塞的方法，包括将上述组合物用抛光用的待研磨的含镍物体的抛光垫进行抛光; 以及防止抛光垫堵塞的方法，包括在其分子中施加包含其分子中具有两个或更多个亲水基团的亲水性聚合物和分子量为300以上的组合物或能够溶解氢氧化镍的化合物在pH为8.0的组合物，和水用抛光用的抛光垫进行抛光。

8. 发明授权

US06454820B2 Polishing composition 有权
标题翻译：抛光组成
公开(公告)号：US06454820B2
公开(公告)日：2002-09-24
申请号：US09772906
申请日：2001-01-31
申请人： Toshiya Hagihara , Koichi Naito , Shigeo Fujii
发明人： Toshiya Hagihara , Koichi Naito , Shigeo Fujii
IPC分类号： C09K314
CPC分类号： G11B23/505 , B24B37/044 , C09G1/02 , G11B5/8404
摘要： A polishing composition comprising silica particles, water, and Fe salt and/or Al salt of a polyaminocarboxylic acid; a polishing process comprising applying the polishing composition; a process for manufacturing a magnetic disk substrate, comprising the step of polishing a substrate with the polishing composition; a magnetic disk substrate manufactured by applying the polishing composition.
摘要翻译：一种抛光组合物，其包含二氧化硅颗粒，水，以及聚氨基羧酸的Fe盐和/或Al盐; 抛光工艺，包括施加抛光组合物; 一种制造磁盘基片的方法，包括用抛光组合物抛光基片的步骤; 通过应用抛光组合物制造的磁盘基片。

9. 发明授权

US06569216B1 Abrasive fluid compositions 有权
标题翻译：研磨液组成
公开(公告)号：US06569216B1
公开(公告)日：2003-05-27
申请号：US09856713
申请日：2001-05-25
申请人： Koji Taira , Shigeo Fujii , Yoshiaki Oshima , Koichi Naito
发明人： Koji Taira , Shigeo Fujii , Yoshiaki Oshima , Koichi Naito
IPC分类号： C09G102
CPC分类号： C09K3/1463 , C09G1/02 , C09K3/1409
摘要： A polishing composition comprising a chelating compound or a salt thereof; a partially esterified product and/or partially etherified product of a polyhydric alcohol compound; and water; a polishing composition comprising water, an abrasive, an intermediate alumina, and a chelating compound or a salt thereof, wherein the content of the intermediate alumina is from 1 to 50 parts by weight, based on 100 parts by weight of the abrasive; and a polishing composition comprising water, an abrasive, an intermediate alumina, a chelating compound or a salt thereof, and a partially esterified product and/or partially etherified product of a polyhydric alcohol compound, wherein the content of the intermediate alumina is from 1 to 50 parts by weight, based on 100 parts by weight of the abrasive. By using the polishing composition, the polishing rate can be increased, and the surface roughness can be lowered, without causing defects such as scratches and pits on the surface of an object to be polished.
摘要翻译：一种抛光组合物，其包含螯合化合物或其盐; 多元醇化合物的部分酯化产物和/或部分醚化产物; 和水; 抛光组合物，其包含水，研磨剂，中间体氧化铝和螯合化合物或其盐，其中基于100重量份的所述研磨剂，所述中间氧化铝的含量为1至50重量份; 以及包含水，研磨剂，中间体氧化铝，螯合化合物或其盐以及多元醇化合物的部分酯化产物和/或部分醚化产物的抛光组合物，其中中间体氧化铝的含量为1〜 50重量份，基于100重量份的研磨剂。通过使用抛光组合物，可以提高抛光速率，并且可以降低表面粗糙度，而不会在被抛光物体的表面上产生划痕和凹痕等缺陷。

10. 发明授权

US07955517B2 Polishing fluid composition 有权
标题翻译：抛光液组成
公开(公告)号：US07955517B2
公开(公告)日：2011-06-07
申请号：US12415548
申请日：2009-03-31
申请人： Shigeo Fujii , Yoshiaki Oshima , Koichi Naito
发明人： Shigeo Fujii , Yoshiaki Oshima , Koichi Naito
IPC分类号： C03C15/00 , B44C1/22 , H01L21/302
CPC分类号： C09G1/02 , B24B37/044
摘要： To provide a polishing composition capable of increasing polishing rate and reducing surface roughness, without causing surface defects on a surface of an object to be polished; and a polishing process for a substrate to be polished. [1] a polishing composition comprising water, an abrasive, an intermediate alumina, and a polycarboxylic acid having 4 or more carbon atoms with no OH groups or a salt thereof, wherein a content of the intermediate alumina is from 1 to 90 parts by weight, based on 100 parts by weight of the abrasive; and [2] a polishing process for a substrate to be polished, comprising polishing a substrate to be polished under conditions that a composition of a polishing liquid during polishing is the composition as defined in item [1] above.
摘要翻译：提供能够提高抛光速度并降低表面粗糙度的抛光组合物，而不会在被抛光物体的表面上引起表面缺陷; 以及用于待抛光的基底的抛光工艺。 [1]一种抛光组合物，其包含水，研磨剂，中间体氧化铝和具有4个以上没有OH基团的碳原子的多元羧酸或其盐，其中所述中间体氧化铝的含量为1〜90重量份，基于100重量份的研磨剂; 以及[2]一种抛光用基材的研磨方法，其特征在于，在抛光中的研磨液的成分为上述[1]所述的组成的条件下，研磨抛光用基板。

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