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1. 发明授权

US5298548A Epoxy resin composition and semiconductor devices encapsulated therewith 失效
标题翻译：环氧树脂组合物和封装的半导体器件
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
申请人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
发明人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译：包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性，弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。

2. 发明授权

US5179176A Propenyl group-containing epoxy resin 失效
标题翻译：含丙烯基的环氧树脂
公开(公告)号：US5179176A
公开(公告)日：1993-01-12
申请号：US649027
申请日：1991-02-01
申请人： Toshio Shiobara , Hisashi Shimizu , Takayuki Aoki
发明人： Toshio Shiobara , Hisashi Shimizu , Takayuki Aoki
IPC分类号： C07D303/27 , C08G8/12 , C08G59/08 , C08G59/32 , C08L63/00 , C08L79/08
CPC分类号： C08L63/00 , C08G59/08 , C08G59/3218 , C08G8/12 , C08L79/085
摘要： An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

3. 发明授权

US06297306B1 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US06297306B1
公开(公告)日：2001-10-02
申请号：US09310924
申请日：1999-05-13
申请人： Shoichi Osada , Takayuki Aoki , Toshio Shiobara , Kazutoshi Tomiyoshi , Eiichi Asano
发明人： Shoichi Osada , Takayuki Aoki , Toshio Shiobara , Kazutoshi Tomiyoshi , Eiichi Asano
IPC分类号： C08K310
CPC分类号： C08K3/22 , C08K3/2279 , C08K2003/2227 , C08L63/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译：一种环氧树脂组合物，其包含（A）联苯骨架环氧树脂，（B）作为固化剂的联苯骨架酚醛树脂，（C）钼化合物和（D）无机填料适合于半导体封装，因为它是有效模塑的并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。它不会对人体健康或环境构成危害。

4. 发明授权

US06291556B1 Semiconductor encapsulating epoxy resin composition and semiconductor device 失效
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US06291556B1
公开(公告)日：2001-09-18
申请号：US09534386
申请日：2000-03-24
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： C08K6300
CPC分类号： H01L23/293 , C08K3/2279 , C08K9/08 , C08K2003/026 , C08K2201/019 , C08L63/00 , H01L2924/0002 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译：提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）包含涂覆有热塑性树脂和/或热固性树脂的红磷基芯的微胶囊阻燃剂，（D）钼化合物和（E）无机填料。即使没有卤化环氧树脂和氧化锑，该组合物及其固化产品具有防湿可靠性和高阻燃性。

5. 发明授权

US06143423A Flame retardant epoxy resin compositions 失效
标题翻译：阻燃环氧树脂组合物
公开(公告)号：US06143423A
公开(公告)日：2000-11-07
申请号：US55301
申请日：1998-04-06
申请人： Toshio Shiobara , Satoshi Okuse , Takayuki Aoki , Hideto Kato
发明人： Toshio Shiobara , Satoshi Okuse , Takayuki Aoki , Hideto Kato
IPC分类号： C08L63/00 , H01L23/29 , H01L29/12
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528
摘要： An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.
摘要翻译：环氧树脂组合物含有（A）环氧当量至少为185的环氧树脂，其具有两个苯环直接或通过脂族不饱和双键相互结合的结构的骨架，具有原子的碳原子 SP2类型的轨道占碳数的至少50％，（B）羟基当量至少为160的酚醛树脂，具有Sp2类型的原子轨道的碳原子占碳数的至少85％（C）相对于100重量份组分（A）和（B）组合的量为1-20重量份的聚酰亚胺树脂，和（D）无机填料的整个组合物的70-85体积％。该组合物即使不含溴化合物和锑化合物，也可固化成具有阻燃性和高温可靠性的产品。

6. 发明授权

US07943706B2 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US07943706B2
公开(公告)日：2011-05-17
申请号：US11386667
申请日：2006-03-23
申请人： Yasuo Kimura , Eiichi Asano , Toshio Shiobara , Takayuki Aoki
发明人： Yasuo Kimura , Eiichi Asano , Toshio Shiobara , Takayuki Aoki
IPC分类号： C08F283/00 , B32B27/38 , C08G59/50
CPC分类号： H01L23/293 , C08G59/245 , C08G59/3218 , C08G59/621 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/16 , H01L2924/00
摘要： An epoxy resin composition comprising(A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210,(B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and(C) an inorganic filler,the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
摘要翻译：一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B）在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

7. 发明授权

US06723452B2 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US06723452B2
公开(公告)日：2004-04-20
申请号：US10196222
申请日：2002-07-17
申请人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
发明人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08G59/20 , C08G59/245 , C08G59/3218 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L2666/22 , H01L2924/00
摘要： Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
摘要翻译：环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。

8. 发明授权

US06177489B1 Semiconductor encapsulating epoxy resin composition and semiconductor device 失效
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US06177489B1
公开(公告)日：2001-01-23
申请号：US09003517
申请日：1998-01-06
申请人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
发明人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
IPC分类号： C08L6302
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K3/36 , C08K5/20 , C08K5/5397 , C08K5/54 , C08L63/00 , C09K21/14 , H01L2924/0002 , C08L83/00 , C08L2666/22 , H01L2924/00
摘要： A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.
摘要翻译：适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个酚羟基和（C）二氧化硅。组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。

9. 发明授权

US6162878A Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US6162878A
公开(公告)日：2000-12-19
申请号：US310999
申请日：1999-05-13
申请人： Shoichi Osada , Kazutoshi Tomiyoshi , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
发明人： Shoichi Osada , Kazutoshi Tomiyoshi , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
IPC分类号： C08G59/08 , C08G59/20 , C08G59/40 , C08G59/62 , C08K3/00 , C08L61/04 , C08L63/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/08 , C08G59/4085 , C08L61/04 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译：一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料，适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。它不会对人体健康或环境构成危害。

10. 发明授权

US6160078A Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US6160078A
公开(公告)日：2000-12-12
申请号：US189408
申请日：1998-11-10
申请人： Shoichi Osada , Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi
发明人： Shoichi Osada , Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi
IPC分类号： C08K3/00 , C08G59/32 , C08G59/62 , C08L63/00 , H01L23/29 , C08G59/08
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01L2924/0002 , C08L2666/22 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.
摘要翻译：包含特定结构的环氧树脂，特定结构的酚醛树脂和无机填料的环氧树脂组合物适用于半导体封装，因为它可有效地模塑并固化成具有改进的阻燃性，回流裂纹性和介电性能的产品。

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