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    • 5. 发明申请
    • Electric control device and manufacturing method thereof
    • 电控装置及其制造方法
    • US20090147482A1
    • 2009-06-11
    • US12292057
    • 2008-11-12
    • Hajime Katsuro
    • Hajime Katsuro
    • H05K7/20H01S4/00
    • H05K7/20854H05K5/0039H05K7/20454Y10T29/49002
    • An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.
    • 电气部件安装在电路板上,并且将预发泡的散热构件施加在电气部件上。 将电路板插入具有盒形形状的底盘中,其一侧的开口朝向开口的相对侧。 预发泡散热构件的厚度小于电气部件的前表面和底座的内表面之间的距离。 因此,当电路板插入底架时,预发泡的散热构件不会被刮擦而被去除。 然后,将预发泡散热构件加热膨胀直到散热构件到达底盘,并且提供电气部件和底盘之间的散热路径。 因此,能够提高电气部件的散热性。
    • 6. 发明授权
    • Electronic control unit
    • 电子控制单元
    • US06867968B2
    • 2005-03-15
    • US10316023
    • 2002-12-11
    • Hajime KatsuroAkihiro Mizutani
    • Hajime KatsuroAkihiro Mizutani
    • H05K5/00H05K7/20
    • H05K7/20854
    • An electronic control unit installed on a high temperature heat source or in its vicinity exhibits an improved heat dissipation ability within its installation environment. The electronic control unit has a chassis incorporating a printed circuit board where electronic devices are mounted. The outer surface of the chassis on the side of the high temperature heat source has a coating for lowering infrared absorption, while the outer surface of the chassis on the side away from the high temperature heat source has a coating for enhancing heat emissivity. Preferably, the inner surfaces of the chassis are subject to a surface treatment for increasing infrared absorption.
    • 安装在高温热源或其附近的电子控制单元在其安装环境中表现出改善的散热能力。 电子控制单元具有安装电子装置的印刷电路板的底盘。 在高温热源侧的底盘的外表面具有用于降低红外吸收的涂层,而远离高温热源的一侧的底盘的外表面具有用于增强发热率的涂层。 优选地,底盘的内表面经受表面处理以增加红外吸收。
    • 7. 发明授权
    • Electric control device and manufacturing method thereof
    • 电控装置及其制造方法
    • US07813134B2
    • 2010-10-12
    • US12292057
    • 2008-11-12
    • Hajime Katsuro
    • Hajime Katsuro
    • H05K7/20
    • H05K7/20854H05K5/0039H05K7/20454Y10T29/49002
    • An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the pre-foamed heat radiating member is less than a distance between a front surface of the electric component and an inner surface of the chassis. Thus, the pre-foamed heat radiating member is not removed by scraping when the circuit board is inserted into the chassis. Then, the pre-foamed heat radiating member is heated and expands until the radiating member reaches the chassis, and a heat radiating path between the electric component and the chassis is provided. Therefore, the heat radiating property of the electric component can be increased.
    • 电气部件安装在电路板上,并且将预发泡的散热构件施加在电气部件上。 将电路板插入具有盒形形状的底盘中,其一侧的开口朝向开口的相对侧。 预发泡散热构件的厚度小于电气部件的前表面和底座的内表面之间的距离。 因此,当电路板插入底架时,预发泡的散热构件不会被刮擦而被去除。 然后,将预发泡散热构件加热膨胀直到散热构件到达底盘,并且提供电气部件和底盘之间的散热路径。 因此,能够提高电气部件的散热性。