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    • 4. 发明授权
    • Thin film transistor substrate, manufacturing method thereof, liquid
crystal display panel and liquid crystal display equipment
    • 薄膜晶体管基板,其制造方法,液晶显示面板和液晶显示设备
    • US5889573A
    • 1999-03-30
    • US928719
    • 1997-09-12
    • Hideaki YamamotoHaruo MatsumaruYasuo TanakaKen TsutsuiToshihisa TsukadaKazuo ShirahashiAkira SasanoYuka Matsukawa
    • Hideaki YamamotoHaruo MatsumaruYasuo TanakaKen TsutsuiToshihisa TsukadaKazuo ShirahashiAkira SasanoYuka Matsukawa
    • G02F1/1343G02F1/1345G02F1/136G02F1/1362G02F1/1368G09F9/30G09G3/36H01L21/3205H01L21/336H01L27/12H01L29/49H01L29/78H01L29/786H01L29/04
    • G02F1/136286G02F1/1345G02F1/136213H01L29/4908H01L2924/0002
    • The present invention concerns an active-matrix addressed TFT substrate using a thin film transistor, a manufacturing method and an anodic oxidation method thereof, a liquid crystal display panel using the TFT substrate and a liquid crystal display equipment using the liquid crystal display panel and, more in particular, it relates to a structure and a manufacturing method which enables to improve the characteristics thereof.In the present invention, Cr or Ta is used for gate terminals, aluminum or a metal mainly composed of aluminum is used for gate bus-lines extended therefrom, gate electrodes and thin film capacitances (additional capacitance, storage capacitance) and an anodic oxidized film composed of the metal and free from defect is used for at least one of gate insulators, dielectric films of the thin film capacitances and interlayer insulation films for the intersections between the bus-lines. In a more preferred structure, the anodic oxidized film is used for all of the gate insulators, the dielectric films for the thin film capacitances and the interlayer insulation films for the intersections between the bus-lines.The present invention also relates to a method of selectively forming an anodic oxidized film on an aluminum pattern. That is, in a case of forming a selective oxidation mask to a desired region on the aluminum pattern with a positive type photoresist, in the present invention, an angle (.theta.) formed between the selective oxidation mask and the aluminum pattern is made as: .theta..gtoreq.110-20T (T: film thickness of the positive type photoresist).
    • 本发明涉及使用薄膜晶体管的有源矩阵寻址TFT基板,其制造方法和阳极氧化方法,使用TFT基板的液晶显示面板和使用该液晶显示面板的液晶显示设备, 更具体地,涉及能够改善其特性的结构和制造方法。 在本发明中,Cr或Ta用于栅极端子,铝或主要由铝组成的金属用于从其延伸的栅极总线,栅电极和薄膜电容(附加电容,存储电容)和阳极氧化膜 由金属构成并且没有缺陷用于栅极绝缘体,薄膜电容的介电膜和用于总线之间的交叉点的层间绝缘膜中的至少一个。 在更优选的结构中,阳极氧化膜用于所有栅极绝缘体,用于薄膜电容的介电膜和用于总线之间的交叉点的层间绝缘膜。 本发明还涉及在铝图案上选择性地形成阳极氧化膜的方法。 也就是说,在使用正型光致抗蚀剂在铝图案上的期望区域上形成选择性氧化掩模的情况下,在本发明中,在选择性氧化掩模和铝图案之间形成的角度(θ)为: θ= 110-20T(T:正型光致抗蚀剂的膜厚度)。