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1. 发明授权

US4535105A Wholly aromatic polyamic acid solution composition 失效
标题翻译：全芳香族聚酰胺酸溶液组成
公开(公告)号：US4535105A
公开(公告)日：1985-08-13
申请号：US587177
申请日：1984-03-07
申请人： Toshihiro Inaike , Shuji Yamamoto , Shunji Ohe , Kazunori Otsuka
发明人： Toshihiro Inaike , Shuji Yamamoto , Shunji Ohe , Kazunori Otsuka
IPC分类号： C08J3/09 , C08K5/34 , C08K5/20 , C08K5/41 , C08L79/08
CPC分类号： C08J3/091 , C08J2379/08
摘要： An aromatic polyamic acid solution composition useful as an electrically insulating varnish, comprises (1) an aromatic polyamic acid which is a polymerization product of (A) a tetracarboxylic acid component containing at least 80 molar % of the sum of (a) a first acid ingredient consisting of 3,3',4,4'-biphenyltetracarboxylic dianhydride and (b) a second acid ingredient consisting of at least one member selected from the group consisting of pyromellitic dianhydride, and 3,3'4,4'-benzophenone tetracarboxylic dianhydride, the molar ratio of the first acid ingredient to the second acid ingredient being in the range of from 30:70 to 75:25, with (B) an amine component consisting of at least one aromatic amine in a molar ratio of the tetracarboxylic acid component to the amine component of from 97:100 to 103:100, and which polymeric acid has a logarithmic viscosity number of from 0.1 to 1.5 determined in a concentration of 0.5 g/100 ml in N-methyl-2-pyrrolidone at a temperature of 30.degree. C., and dissolved in a concentration of from 5% to 40% by weight in (2) an organic polar solvent.
摘要翻译：可用作电绝缘漆的芳族聚酰胺酸溶液组合物包括（1）芳族聚酰胺酸，其是（A）含有（a）第一酸的总量的至少80摩尔％的四羧酸组分的聚合产物由3,3'，4,4'-联苯四羧酸二酐组成的成分和（b）由至少一种选自均苯四酸二酐和3,3'4,4'-二苯甲酮四羧酸组成的第二酸成分二酸酐，第一酸成分与第二酸成分的摩尔比在30:70至75:25的范围内，（B）由至少一种芳族胺组成的胺组分，四羧酸的摩尔比酸组分为97:100至103:100，并且该聚合酸的浓度为0.5g / 100ml，在N-甲基-2-吡咯烷酮中的对数粘度为0.1至1.5，温度30℃，并且在（2）有机极性溶剂中以5重量％至40重量％的浓度溶解。

2. 发明授权

US4568715A Aromatic polyimide composition comprising mixed solvent 失效
标题翻译：包含混合溶剂的芳族聚酰亚胺组合物
公开(公告)号：US4568715A
公开(公告)日：1986-02-04
申请号：US714008
申请日：1985-03-20
申请人： Hiroshi Itatani , Toshihiro Inaike , Shuji Yamamoto
发明人： Hiroshi Itatani , Toshihiro Inaike , Shuji Yamamoto
IPC分类号： C08G73/10 , C08L79/08
CPC分类号： C08G73/1042 , C08G73/1032 , C08G73/1071 , C08L79/08
摘要： An aromatic polyimide composition usable for producing shaped articles, for example, films, or as varnish, lacquer, or bonding agent, comprises a high molecular weight aromatic polyimide resin which is a polycondensation-imidization product of an aromatic tetracarboxylic acid component comprising 50 molar % or more of 3,4,3',4'-biphenyltetracarboxylic acid, anhydride, salt, or ester with an aromatic diamine component including 50 molar % or more of 4,4'-diaminodiphenylether, and which is dissolved in a mixed solvent consisting essentially of 10% by weight or more of a first solvent component selected from naphthol and resorcin and the balance of a second solvent component selected from phenol and cresols.
摘要翻译：可用于生产成型制品的芳族聚酰亚胺组合物，例如薄膜，或作为清漆，漆或粘合剂，包括高分子量芳族聚酰亚胺树脂，其是包含50摩尔％的芳族四羧酸组分的缩聚酰亚胺化产物，或更多的3,4,3'，4'-联苯四羧酸，酸酐，盐或酯与包含50摩尔％以上的4,4'-二氨基二苯基醚的芳族二胺组分混合，并将其溶解在由基本上为10重量％以上的选自萘酚和间苯二酚的第一溶剂成分，余量为选自苯酚和甲酚的第二溶剂成分。

3. 发明授权

US4508766A Process for producing aromatic imide polymer laminate material 失效
标题翻译：制备芳族酰亚胺聚合物层压材料的方法
公开(公告)号：US4508766A
公开(公告)日：1985-04-02
申请号：US487140
申请日：1983-04-21
申请人： Toshihiro Inaike , Katsuhiko Ushimi , Shuji Yamamoto , Toshihiro Inoue
发明人： Toshihiro Inaike , Katsuhiko Ushimi , Shuji Yamamoto , Toshihiro Inoue
IPC分类号： B05D5/12 , B32B15/08 , B32B15/088 , H05K1/03 , H05K1/05 , B05D3/02
CPC分类号： H05K1/0346 , Y10T428/31721
摘要： An aromatic imide polymer laminate material usable as a flexible circuit board substrate is produced by the process comprising coating a surface of a metallic foil with a solution of an aromatic imide polymer comprising at least 90 molar % of recurring unit of the formula (I): ##STR1## wherein R is a symmetrical bivalent aromatic radical having no substituent, and dissolved in a solvent consisting essentially of at least one phenolic compound; and heat drying the resultant solution layer to form an aromatic imide polymer solid layer firmly bonded directly to the metallic foil.
摘要翻译：可用作柔性电路板基底的芳族酰亚胺聚合物层压材料通过包括用包含至少90摩尔％的式（I）的重复单元的芳族酰亚胺聚合物的溶液涂覆金属箔的表面的方法来生产：（I）其中R是不具有取代基的对称二价芳族基团，并且溶解在基本上由至少一种酚类化合物组成的溶剂中; 并加热干燥所得溶液层，以形成直接与金属箔牢固结合的芳族酰亚胺聚合物固体层。

4. 发明授权

US4528833A Method for removal of curling of circuit printable flexible substrate 失效
标题翻译：消除电路可印刷柔性基板卷曲的方法
公开(公告)号：US4528833A
公开(公告)日：1985-07-16
申请号：US517799
申请日：1983-07-27
申请人： Toshihiro Inaike , Katsuhiko Ushimi , Toshihiro Inoue
发明人： Toshihiro Inaike , Katsuhiko Ushimi , Toshihiro Inoue
IPC分类号： B21D1/05 , B29C53/18 , H05K1/00 , H05K3/00 , H05K3/02 , B21D1/00 , B21D1/02
CPC分类号： H05K3/0011 , B21D1/05 , B29C53/18 , B29L2031/3425 , H05K1/0393 , H05K2201/0154 , H05K2201/09136 , H05K2203/0271 , H05K3/022 , Y10T29/49124
摘要： A method for removal of curling of a circuit printable flexible substrate comprising a metal foil and a film layer of an aromatic polyamideimide or an aromatic polyimide formed by coating on the said metal foil a solution of an aromatic polyamideimide, an aromatic polyimide precursor or an aromatic polyimide, and drying the coated solution layer to setting, whose curling is produced to direct the metal foil surface to face outside, which comprises sliding under tension the curled circuit printable flexible substrate on a curved surface of a bar having a curvature radius of 0.5-25 mm, at which the substrate is turned back at a turning angle of not less than 90.degree., placing the metal foil layer in contact with the bar, at a temperature of not higher than 80.degree. C. A method employing two such bars is also disclosed.
摘要翻译：一种除去电路可印刷柔性基材的卷曲的方法，其包括金属箔和芳族聚酰胺酰亚胺或芳族聚酰亚胺的膜层，其通过在所述金属箔上涂覆芳族聚酰胺酰亚胺，芳族聚酰亚胺前体或芳族化合物的溶液而形成聚酰亚胺，并且将涂布的溶液层干燥以使其卷曲被产生以将金属箔表面引导到外部，其包括在卷曲电路可印刷的柔性基板上的张力下滑动在曲率半径为0.5的条的曲面上，在不高于80℃的温度下将金属箔层与棒接触的情况下，基板以不小于90°的转动角度回转的方式为25mm。使用两根这样的棒的方法是也披露。

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