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1. 发明授权

US06926849B2 Solder paste 有权
标题翻译：焊膏
公开(公告)号：US06926849B2
公开(公告)日：2005-08-09
申请号：US10432844
申请日：2001-11-29
申请人： Toshihiko Taguchi , Kunihito Takaura , Setsuko Tadokoro , Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima
发明人： Toshihiko Taguchi , Kunihito Takaura , Setsuko Tadokoro , Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , B23K35/36 , H01B1/02 , B23K35/363
CPC分类号： B23K35/3613 , B23K35/025 , B23K35/262 , B23K35/3603 , B23K35/3615 , B23K35/3618
摘要： A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
摘要翻译：包含与含有0.5-10.0重量％的异氰脲酸或其卤代烷基酯的含有活化剂的松香基助熔剂混合的含Zn Sn，无铅焊料的粉末的焊膏可以防止形成在回流焊接期间焊球和空隙呈现良好的可焊性。一种焊膏，其包含与含有活化剂的松香基焊剂混合的含Ag或Zn的Sn基，无铅焊料的粉末，其中0.01-10.0重量％的水杨酰胺化合物也不会发生变化粘度和良好的可焊性。

2. 发明授权

US06440228B1 Lead-free zinc-containing solder paste 有权
标题翻译：无铅含锌焊膏
公开(公告)号：US06440228B1
公开(公告)日：2002-08-27
申请号：US09774011
申请日：2001-01-31
申请人： Toshihiko Taguchi , Kunihito Takaura , Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima
发明人： Toshihiko Taguchi , Kunihito Takaura , Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima
IPC分类号： B23K3534
CPC分类号： B23K35/3612 , B23K35/025 , B23K35/262 , B23K35/3613
摘要： A solder paste having a powder of a Zn-containing solder alloy such as an Sn—Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.
摘要翻译：通过将0.1重量％〜5.0重量％的缩水甘油醚化合物，例如添加0.1〜5.0重量％的缩水甘油醚化合物，可以提高含有Sn-Zn系合金等Zn系合金粉末与助熔剂如松香助熔剂的混合物的焊膏，作为烷基，烯基或芳基缩水甘油醚。改进的焊膏具有增加的老化耐受性，并且伴随着焊料合金中的Zn与焊剂中的成分的反应引起的可焊性的劣化，并且具有大大延长的保质期。

3. 发明授权

US06736907B2 Solder paste 有权
标题翻译：焊膏
公开(公告)号：US06736907B2
公开(公告)日：2004-05-18
申请号：US10308167
申请日：2002-12-03
申请人： Toshihiko Taguchi , Kunihito Takaura , Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima
发明人： Toshihiko Taguchi , Kunihito Takaura , Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima
IPC分类号： B23K35363
CPC分类号： B23K35/3618 , B23K35/025 , B23K35/262 , H05K3/3484
摘要： A lead-free solder paste comprises an Sn—Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
摘要翻译：无铅焊膏包含与焊剂混合的Sn-Zn基无铅焊料粉末。助熔剂含有至少一种芳族羟基羧酸，其选自间位具有一个羟基的芳族羧酸（如3-羟基-2-甲基苯甲酸）和具有至少两个羟基的芳族羧酸（如作为二羟基萘甲酸或二羟基苯甲酸），为0.1-10.0质量％。助熔剂还可以含有0.5〜20质量％的脂肪族羟基羧酸（如羟基油酸）。

4. 发明授权

US07282174B2 Lead-free solder and soldered article 有权
标题翻译：无铅焊料和焊接制品
公开(公告)号：US07282174B2
公开(公告)日：2007-10-16
申请号：US10533288
申请日：2003-10-31
申请人： Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima , Toshihiko Taguchi , Yoshitaka Toyoda , Tsukasa Ohnishi
发明人： Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima , Toshihiko Taguchi , Yoshitaka Toyoda , Tsukasa Ohnishi
IPC分类号： B23K35/26
CPC分类号： B23K35/262 , H05K3/3463
摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.
摘要翻译：本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe，和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。

5. 发明申请

US20060102690A1 Lead-free solder and soldered article 有权
标题翻译：无铅焊料和焊接制品
公开(公告)号：US20060102690A1
公开(公告)日：2006-05-18
申请号：US10533288
申请日：2003-10-31
申请人： Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima , Toshihiko Taguchi , Yoshitaka Toyoda , Tsukasa Ohnishi
发明人： Masahiko Hirata , Hisahiko Yoshida , Takashi Nagashima , Toshihiko Taguchi , Yoshitaka Toyoda , Tsukasa Ohnishi
IPC分类号： B23K35/14
CPC分类号： B23K35/262 , H05K3/3463
摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.
摘要翻译：本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe，和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。

6. 发明授权

US6159304A Solder paste 有权
标题翻译：焊膏
公开(公告)号：US6159304A
公开(公告)日：2000-12-12
申请号：US260604
申请日：1999-03-02
申请人： Hiroji Noguchi , Masahiko Hirata , Toshihiko Taguchi , Kunihito Takaura
发明人： Hiroji Noguchi , Masahiko Hirata , Toshihiko Taguchi , Kunihito Takaura
IPC分类号： B23K35/02 , B23K35/26 , B23K35/36 , B23K35/34
CPC分类号： B23K35/262 , B23K35/025 , B23K35/3615
摘要： In order to prevent aging of an Sn--Zn system alloy solder paste, 0.5-5% by weight of a compound obtained by adding an ethylene oxide to cyclohexylamine, preferably together with 0.5-5% by weight of a polyoxyethylene alkylamine is added to a flux of said solder paste.
摘要翻译：为了防止Sn-Zn系合金焊膏的老化，将0.5-5重量％的通过将环氧乙烷加成到环己胺得到的化合物，优选与0.5-5重量％的聚氧乙烯烷基胺一起加入到所述焊膏的焊剂。

7. 发明授权

US06416590B1 Solder powder and method for preparing the same and solder paste 失效
标题翻译：焊粉及其制备方法及焊膏
公开(公告)号：US06416590B1
公开(公告)日：2002-07-09
申请号：US09720722
申请日：2000-12-28
申请人： Masahiko Hirata , Takashi Ohashi , Hisahiko Yoshida , Hiroji Noguchi , Takao Hisazumi , Mamoru Senna , Tetsuhiko Isobe
发明人： Masahiko Hirata , Takashi Ohashi , Hisahiko Yoshida , Hiroji Noguchi , Takao Hisazumi , Mamoru Senna , Tetsuhiko Isobe
IPC分类号： B22F102
CPC分类号： B23K35/0244 , B23K35/025 , B23K35/3618 , H05K3/3463 , H05K3/3484
摘要： An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt. % of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed.
摘要翻译：在含有Sn和Zn的焊料粉末的表面上沉积有机酸盐。或者，0.5至10wt。将％的非离子表面活性剂加入助熔剂中。通过包括这种方法的方法，提供了具有良好焊接特性的无铅焊料粉末和焊膏，其中活化组分与助熔剂中的合金组分的反应被抑制。

8. 发明申请

US20060261131A1 Solder paste and printed board 有权
标题翻译：焊膏和印刷板
公开(公告)号：US20060261131A1
公开(公告)日：2006-11-23
申请号：US10547539
申请日：2004-03-31
申请人： Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
发明人： Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
IPC分类号： A47J36/02
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K2201/0272
摘要： In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
摘要翻译：在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％和Sn的剩余部分。

9. 发明授权

US07681777B2 Solder paste and printed circuit board 有权
标题翻译：焊膏和印刷电路板
公开(公告)号：US07681777B2
公开(公告)日：2010-03-23
申请号：US10547539
申请日：2004-03-31
申请人： Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
发明人： Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
IPC分类号： B23K35/14
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K2201/0272
摘要： In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
摘要翻译：在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％和Sn的剩余部分。

10. 发明申请

US20070044312A1 Bearing sleeve fixing mechanism, manufacturing method thereof and fan device having the same 审中-公开
标题翻译：轴承座固定机构及其制造方法以及具有该轴承座固定机构的风扇装置
公开(公告)号：US20070044312A1
公开(公告)日：2007-03-01
申请号：US11509562
申请日：2006-08-25
申请人： Masahiko Hirata , Yasushi Ayabe , Makoto Wada
发明人： Masahiko Hirata , Yasushi Ayabe , Makoto Wada
IPC分类号： F16B17/00
CPC分类号： F16B19/02 , F16C17/107 , F16C33/107 , H02K5/1675 , Y10T29/49696 , Y10T403/70
摘要： The invention relates to a bearing sleeve fixing mechanism adapted for a fan device to cool a heat generating component like MPU incorporated into a personal computer or a heat sink thermally connected to the heat generating component, a method of manufacturing the bearing sleeve fixing mechanism, and a fan device having the bearing sleeve fixing mechanism. The bearing sleeve fixing mechanism comprises: a shaft; a bearing sleeve, into which one end portion of the shaft is inserted, for pivotally supporting the shaft; a housing for accommodating the bearing sleeve; and a fixing ring press-fitted into the housing so that the bearing sleeve can be interposed between the fixing ring and a receiving mount provided in the housing, wherein the fixing ring fixes the bearing sleeve by giving a plastic deformation to the housing so that a recess portion can be formed in the housing.
摘要翻译：本发明涉及一种适用于风扇装置的轴承套固定机构，用于冷却结合到个人计算机中的发热部件，或者热连接到发热部件的散热器，制造轴承套筒固定机构的方法，以及具有轴承套固定机构的风扇装置。轴承套固定机构包括：轴; 一个轴承套筒，轴的一个端部插入其中，用于枢转地支撑轴; 用于容纳轴承套的壳体; 以及固定环压配合到所述壳体中，使得所述轴承套筒可以插入在所述固定环和设置在所述壳体中的接收座之间，其中所述固定环通过给所述壳体施加塑性变形来固定所述轴承套筒，凹部可以形成在壳体中。

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