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1. 发明授权

US07183497B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US07183497B2
公开(公告)日：2007-02-27
申请号：US11012326
申请日：2004-12-16
申请人： Toshifumi Kojima , Makoto Wakazono
发明人： Toshifumi Kojima , Makoto Wakazono
IPC分类号： H05K1/16 , H01R12/04
CPC分类号： H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096
摘要： A multilayer wiring board (11) is provided which includes a core substrate (12) including a plurality of through-holes (15). The through-holes (15) include through-hole conductors (17) on the inner walls of corresponding penetration holes (16) of a diameter of 200 μm or less. Interlayer insulating layers (31, 32) are disposed on opposite sides of the principal planes (13, 14) of the core substrate (12). Wiring layers (23, 24) are disposed on the surface of interlayer insulating layers (31, 32). The through-holes (15) are filled with a hardened filling material (18). Lid conductors (21, 22) close the openings of the through-holes (15). The value of linear expansion of the hardened filling material (18) is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.
摘要翻译：提供一种多层布线板（11），其包括具有多个通孔（15）的芯基板（12）。通孔（15）包括直径为200μm或更小的相应穿孔（16）的内壁上的通孔导体（17）。层间绝缘层（31,32）设置在芯基板（12）的主平面（13,14）的相对侧上。接线层（23,24）设置在层间绝缘层（31,32）的表面上。通孔（15）填充有硬化的填充材料（18）。盖导体（21,22）封闭通孔（15）的开口。在从室温到焊锡回流温度的温度区域中，硬化填充材料（18）的线膨胀值为1.2％以下。该板具有良好的连接可靠性，并且在封闭导通孔和周围导体区域的开口的盖导体中几乎没有或没有破裂或分层。

2. 发明授权

US07438969B2 Filling material, multilayer wiring board, and process of producing multilayer wiring board 有权
标题翻译：填充材料，多层布线板以及多层布线板的制造工序
公开(公告)号：US07438969B2
公开(公告)日：2008-10-21
申请号：US10615067
申请日：2003-07-09
申请人： Toshifumi Kojima , Makoto Wakazono , Toshikatu Takada
发明人： Toshifumi Kojima , Makoto Wakazono , Toshikatu Takada
IPC分类号： B32B3/00 , H05K1/03
CPC分类号： H05K3/0094 , H05K3/4602 , H05K2201/0347 , H05K2201/0959 , Y10S428/901 , Y10T156/10 , Y10T428/24893 , Y10T428/24917 , Y10T428/25
摘要： A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.
摘要翻译：一种无溶剂填充材料，包括填料，热固性树脂，固化剂和固化催化剂，其中热固性树脂是环氧树脂，固化剂是双氰胺固化剂; 包括基板，通孔，填充通孔的填充材料和形成在通孔中的填充材料的暴露表面上的导体层的多层印刷线路板; 以及多层印刷布线板的制造方法。

3. 发明申请

US20050126818A1 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US20050126818A1
公开(公告)日：2005-06-16
申请号：US11012326
申请日：2004-12-16
申请人： Toshifumi Kojima , Makoto Wakazono
发明人： Toshifumi Kojima , Makoto Wakazono
IPC分类号： H05K3/46 , H05K1/03 , H05K1/11
CPC分类号： H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096
摘要： A multilayer wiring board (11) is provided which includes a core substrate (12) including a plurality of through-holes (15). The through-holes (15) include through-hole conductors (17) on the inner walls of corresponding penetration holes (16) of a diameter of 200 μm or less. Interlayer insulating layers (31, 32) are disposed on opposite sides of the principal planes (13, 14) of the core substrate (12). Wiring layers (23, 24) are disposed on the surface of interlayer insulating layers (31, 32). The through-holes (15) are filled with a hardened filling material (18). Lid conductors (21, 22) close the openings of the through-holes (15). The value of linear expansion of the hardened filling material (18) is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.
摘要翻译：提供一种多层布线板（11），其包括具有多个通孔（15）的芯基板（12）。通孔（15）包括直径为200μm或更小的相应穿孔（16）内壁上的通孔导体（17）。层间绝缘层（31,32）设置在芯基板（12）的主平面（13,14）的相对侧上。接线层（23,24）设置在层间绝缘层（31,32）的表面上。通孔（15）填充有硬化的填充材料（18）。盖导体（21,22）封闭通孔（15）的开口。在从室温到焊锡回流温度的温度区域中，硬化填充材料（18）的线膨胀值为1.2％以下。该板具有良好的连接可靠性，并且在封闭导通孔和周围导体区域的开口的盖导体中几乎没有或没有破裂或分层。

4. 发明申请

US20050105860A1 Optical device mounted substrate assembly 有权
标题翻译：光学装置安装的基板组件
公开(公告)号：US20050105860A1
公开(公告)日：2005-05-19
申请号：US10782870
申请日：2004-02-23
申请人： Takeshi Oono , Toshikatsu Takada , Mitsugu Onoda , Toshifumi Kojima , Toshikazu Horio , Ayako Kawamura
发明人： Takeshi Oono , Toshikatsu Takada , Mitsugu Onoda , Toshifumi Kojima , Toshikazu Horio , Ayako Kawamura
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4231 , G02B6/4206 , G02B6/4214 , G02B6/4236 , H01L2224/16225 , H01L2924/15311
摘要： An optical device mounted substrate assembly includes a ceramic substrate having a first recess, an optical device mounted on the ceramic substrate and having one of a light emitting portion and a light receiving portion, the optical device being to be optically connected to one of an optical waveguide and an optical fiber connector in way as to align optical axes of the optical wave guide or the optical fiber connector with each other, a resin layer disposed in the first recess and having a second recess smaller in diameter than the first recess, and an alignment guide member fitted in the second recess and having a protruded portion protruding from a front surface of the ceramic substrate and fittingly engageable in an alignment hole of one of the optical waveguide and the optical fiber connector. A fabrication method of such a substrate assembly is also provided.
摘要翻译：安装有光学装置的基板组件包括具有第一凹部的陶瓷基板，安装在陶瓷基板上并具有发光部分和光接收部分之一的光学装置，该光学装置将被光学连接到光学波导和光纤连接器，以使光波导或光纤连接器的光轴彼此对准，树脂层设置在第一凹部中，并且具有比第一凹部更小的第二凹部，以及对准引导构件，其安装在第二凹部中，并且具有从陶瓷基板的前表面突出的突出部分，并且可配合地接合在光波导和光纤连接器之一的对准孔中。还提供了这种基板组件的制造方法。

5. 发明授权

US06770965B2 Wiring substrate using embedding resin 有权
标题翻译：使用嵌入树脂的布线基板
公开(公告)号：US06770965B2
公开(公告)日：2004-08-03
申请号：US10026454
申请日：2001-12-27
申请人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Ohbayashi , Hisahito Kashima
发明人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Ohbayashi , Hisahito Kashima
IPC分类号： H05K346
CPC分类号： H01L21/568 , H01L21/563 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/0231 , H05K1/185 , Y10T428/24917 , H01L2924/00
摘要： A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.
摘要翻译：布线基板包括（1）具有开口的绝缘基板或芯基板和堆积层，其中芯基板和堆积层中的至少一个具有开口，（2）至少一个电子部件（3）包含热塑性树脂，酸酐固化剂，固化促进剂和填料的嵌入树脂，其中嵌入树脂在剪切速率下显示不高于85Pa.s的粘度在25℃±1℃下静置24小时后为8.4s -1。

6. 发明授权

US4238659A Preventing magnetization of pipe blank in GMA welding 失效
标题翻译：防止GMA焊接中管坯的磁化
公开(公告)号：US4238659A
公开(公告)日：1980-12-09
申请号：US011412
申请日：1979-02-12
申请人： Fusao Koshiga , Jinkichi Tanaka , Itaru Watanabe , Motoaki Suzuki , Toshifumi Kojima , Hiroyoshi Matsubara , Tatsumi Osuka , Kenji Takeshige , Takashi Nagamine , Osamu Hirano
发明人： Fusao Koshiga , Jinkichi Tanaka , Itaru Watanabe , Motoaki Suzuki , Toshifumi Kojima , Hiroyoshi Matsubara , Tatsumi Osuka , Kenji Takeshige , Takashi Nagamine , Osamu Hirano
IPC分类号： B23K9/08 , B23K9/025 , B23K9/073 , B23K31/06
CPC分类号： B23K9/0737
摘要： In longitudinally seam-welding a pipe-blank for welded steel pipe from the inside along a groove by the GMA welding process which comprises using direct electric current supplied to a plurality of consumable electrodes in tandem through at least one cable as the welding current, at least two even-numbered consumable electrodes are used, half of said consumable electrodes being connected to said direct current so as to be positive in polarity and the remaining half of said consumable electrodes being connected to said direct current so as to be negative in polarity, to enable lines of magnetic force produced by said direct electric current for welding flowing through said at least one cable introduced into said pipe-blank to cancel each other, thereby preventing magnetization of said pipe-blank and the resulting magnetic arc blow of the welding arc.
摘要翻译：在通过GMA焊接工艺沿着沟槽从内侧纵向焊接焊接钢管的管坯，其包括通过至少一根电缆作为焊接电流串联地供给多个可消耗电极的直流电流，使用至少两个偶数的可消耗电极，所述可消耗电极的一半连接到所述直流电，以使其极性为正，并且所述可消耗电极的剩余一半连接到所述直流电流以使其极性为负，以使由所述直流电流产生的电磁线能够流过通过所述至少一根引入到所述管坯中的电缆而彼此抵消，从而防止所述管坯的磁化和焊接电弧产生的电弧冲击。

7. 发明授权

US06586827B2 Wiring board and method for fabricating the same 有权
公开(公告)号：US06586827B2
公开(公告)日：2003-07-01
申请号：US10026928
申请日：2001-12-27
申请人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Obayashi , Hisahito Kashima
发明人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Obayashi , Hisahito Kashima
IPC分类号： H01L2322
CPC分类号： H05K1/185 , B32B15/08 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/15312 , H05K1/0231 , Y10T428/24917 , H01L2924/00 , H01L2224/05599
摘要： A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

8. 发明授权

US4988035A Method of liquid phase diffusion bonding of metal bodies 失效
标题翻译：金属体液相扩散接合方法
公开(公告)号：US4988035A
公开(公告)日：1991-01-29
申请号：US403789
申请日：1989-09-05
申请人： Yasuhiro Ueno , Hiroshi Kagechika , Itaru Watanabe , Shigeyoshi Kosuge , Toshifumi Kojima
发明人： Yasuhiro Ueno , Hiroshi Kagechika , Itaru Watanabe , Shigeyoshi Kosuge , Toshifumi Kojima
IPC分类号： B23K35/02 , B23K35/30
CPC分类号： B23K35/3033 , B23K35/0238 , B23K35/302
摘要： Insert 1 comprises thin substrate made by cold-rolling, and two bonding alloy layers formed by plating on the upper and lower surfaces of substrate, respectively. Both layers is extremely thin, and is made of an alloy having a melting point lower than that of substrate. Insert 1 is used to achieve liquid phase diffusion bonding of first and second base metals. Insert 1 is interposed between first base metal and second base metal. Then, insert 1 and base metals are clamped together with a pressure of, for example, 0.5 kgf/mm.sup.2, and are placed in a atmosphere of a low pressure of about 10.sup.-4 Torr and heated to the melting point of alloy layers or to a temperature above this melting point but below the melting points of substrate and plates.

9. 发明授权

US4107503A Method for eliminating residual magnetism in pipe-blank for welded steel pipe longitudinally seam-welded from inside 失效
标题翻译：从内部纵向焊缝焊接钢管的管坯残留消除方法
公开(公告)号：US4107503A
公开(公告)日：1978-08-15
申请号：US776235
申请日：1977-03-10
申请人： Fusao Koshiga , Jinkichi Tanaka , Itaru Watanabe , Motoaki Suzuki , Toshifumi Kojima , Hiroyoshi Matsubara , Tatsumi Osuka , Kenji Takeshige , Takashi Nagamine , Osamu Hirano
发明人： Fusao Koshiga , Jinkichi Tanaka , Itaru Watanabe , Motoaki Suzuki , Toshifumi Kojima , Hiroyoshi Matsubara , Tatsumi Osuka , Kenji Takeshige , Takashi Nagamine , Osamu Hirano
IPC分类号： B23K9/08 , B23K9/025 , H01F13/00 , B23K31/06
CPC分类号： H01F13/006 , B23K9/0253
摘要： After longitudinally seam-welding a pipe-blank for welded steel pipe from the inside along a groove by the arc welding process which comprises using direct electric current supplied to a consumable electrode through a cable as the welding current, the polarity of said consumable electrode applied for said longitudinal seam-welding is switched over to the opposite polarity, an arc from said consumable electrode is ignited again on a tab plate attached to the end of said pipe-blank on the completion side of said longitudinal seam-welding to cause a direct electric current for eliminating magnetism to flow through said cable in the opposite direction to that of said direct electric current for welding, thereby eliminating residual magnetism in said pipe-blank produced by said direct electric current for welding flowing through said cable introduced into said pipe-blank during said longitudinal seam-welding.
摘要翻译：在通过电弧焊接方法从焊接钢管的内侧纵向地焊接用于焊接钢管的管坯，其包括使用通过电缆供给到可消耗电极的直流电流作为焊接电流，施加所述自耗电极的极性对于所述纵向焊缝切换到相反的极性，在所述纵向焊缝的完成侧上附接到所述管坯的端部的接片板上再次点燃来自所述可消耗电极的电弧，以引起直接用于消除磁通的方式与用于焊接的所述直流电流相反的方向流过所述电缆的电流，从而消除由所述直流电流产生的所述管坯中残留的磁性，在所述纵向焊缝期间坯料。

10. 发明授权

US06876091B2 Wiring board 有权
标题翻译：接线板
公开(公告)号：US06876091B2
公开(公告)日：2005-04-05
申请号：US10024581
申请日：2001-12-21
申请人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Obayashi , Hisahito Kashima
发明人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Obayashi , Hisahito Kashima
IPC分类号： H05K3/28 , H01L23/498 , H05K1/18 , H05K3/46 , H01L23/29
CPC分类号： H01L23/49822 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16235 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , Y10T428/24802 , Y10T428/24926 , H01L2224/05599
摘要： The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan δ of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.
摘要翻译：本发明提供了一种布线基板，其中电子部件通过嵌入树脂嵌入，该嵌入树脂在布线板中的电子部件的高安装密度，其表现出优异的电性能如绝缘性能，防止光的随机反射并且其在固化期间降低树脂的颜色不均匀。本发明包括一种布线板，其中使用具有小于或等于约5的介电常数和小于或等于约0.08的tanδ的嵌入树脂来嵌入电子部件。嵌入树脂优选含有小于或等于约1.4质量％的量的炭黑。此外，嵌入树脂优选至少含有热固性树脂和至少一种无机填料。

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