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1. 发明申请

US20090050986A1 Method for Fabricating Sensor Chip, and Sensor Chip 审中-公开
标题翻译：制造传感器芯片和传感器芯片的方法
公开(公告)号：US20090050986A1
公开(公告)日：2009-02-26
申请号：US11795903
申请日：2006-01-23
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： H01L29/00 , H01L21/50
CPC分类号： B01J19/0046 , B01J2219/00518 , B01J2219/00527 , B01J2219/00533 , B01J2219/00621 , B01J2219/00657 , B01J2219/0072 , B01J2219/00725
摘要： A method for fabricating a sensor chip having a substrate, a cover layer, a spacer layer interposed between the substrate and the cover layer, and a hollow reaction section provided in the spacer layer, the method comprising the steps of: affixing two or more adhesive or bonding tapes onto a sheet where a plurality of substrates are to be formed or onto a plurality of substrates, to thus form a spacer layer; and forming a hollow reaction section from one or a plurality of gaps between the tapes, whereby volumetric variations or positional displacements of the hollow reaction section can be reduced. A sensor chip which can be fabricated by this method.
摘要翻译：一种用于制造具有衬底，覆盖层，插入在衬底和覆盖层之间的间隔层的传感器芯片的方法和设置在间隔层中的中空反应部分，该方法包括以下步骤：将两个或更多个粘合剂或将带粘合到要形成多个基底的片上或多个基底上，从而形成间隔层; 并且从带之间的一个或多个间隙形成中空反应部分，从而可以减小中空反应部分的体积变化或位置位移。可通过该方法制造的传感器芯片。

2. 发明申请

US20090053105A1 Sensor Chip 审中-公开
标题翻译：传感器芯片
公开(公告)号：US20090053105A1
公开(公告)日：2009-02-26
申请号：US11795893
申请日：2006-01-23
申请人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： B01J19/00
CPC分类号： G01N33/54373 , B01L3/502707 , B01L2300/0645 , B01L2300/0822 , B01L2300/168
摘要： There is provided a sensor chip including: a base plate; a cover layer; a hollow reaction portion provided between the base plate and the cover layer, in which a reaction is performed between a sample and a reagent applied thereinto; a sensing member constructed of an electrode which is exposed to the hollow reaction portion; and a sample inlet for conducting the sample to the hollow reaction portion, wherein entire portions of the base plate and the cover layer, which are located opposite to the sensing member provided with the hollow reaction portion, are made transparent. Otherwise, in the above-described sensor chip, a plate A having a groove A to which a reagent has been applied and a plate B having a groove B are stacked on each other in such a manner that the groove A is coupled with the groove B, so that the hollow reaction portion is formed; and an opening width of the groove B is larger than an opening width of the groove A at a portion of the groove B which is located opposite to a portion with the groove A, to which the reagent has been applied.
摘要翻译：提供了一种传感器芯片，包括：基板; 覆盖层; 设置在基板和覆盖层之间的中空反应部分，其中在样品和施加于其之间的试剂之间进行反应; 由暴露于中空反应部分的电极构成的传感部件; 以及用于将样品导引到中空反应部分的样品入口，其中与设置有中空反应部分的感测构件相对的基板和覆盖层的整个部分被制成透明的。另外，在上述传感器芯片中，将具有涂敷有试剂的槽A的板A和具有槽B的板B彼此堆叠，使得槽A与槽 B，形成中空反应部分; 并且槽B的开口宽度大于槽B的与已经施加有试剂的部分的与槽A相对的部分处的槽A的开口宽度。

3. 发明申请

US20080248457A1 Sensor Chip and Manufacturing Method Thereof 审中-公开
标题翻译：传感器芯片及其制造方法
公开(公告)号：US20080248457A1
公开(公告)日：2008-10-09
申请号：US11630475
申请日：2005-06-21
申请人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Isao Karube , Masao Gotoh , Hideaki Nakamura , Fumiyo Kurusu , Tomoko Ishikawa
发明人： Toshifumi Hosoya , Shingo Kaimori , Moriyasu Ichino , Isao Karube , Masao Gotoh , Hideaki Nakamura , Fumiyo Kurusu , Tomoko Ishikawa
IPC分类号： C12Q1/00
CPC分类号： G01N27/26
摘要： Provided are a sensor chip and a manufacturing method of this sensor chip, that includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, and a hollow reaction section between the substrate and the cover layer, wherein warping due to changes in the environmental temperature and humidity does not occur.A sensor chip is provided including: a substrate; a cover layer; a spacer layer sandwiched between the substrate and the cover layer; a hollow reaction section provided between the substrate and the cover layer; and a detection section provided in the hollow reaction section, wherein the substrate and the cover layer are made of the same material and have the same thickness, and a material and a shape of the spacer layer are symmetrical with respect to a plane which is parallel to the substrate and located at equal distances from the substrate and from the cover layer, and a manufacturing method of the sensor chip is provided.
摘要翻译：提供了一种传感器芯片和该传感器芯片的制造方法，其包括基板，覆盖层，夹在基板和覆盖层之间的间隔层，以及基板和覆盖层之间的中空反应部，其中翘曲由于环境温度和湿度的变化不会发生。提供一种传感器芯片，包括：基板; 覆盖层; 夹在基板和覆盖层之间的间隔层; 设置在所述基板和所述覆盖层之间的中空反应部; 以及设置在所述中空反应部中的检测部，其中所述基板和所述覆盖层由相同的材料制成并且具有相同的厚度，并且所述间隔层的材料和形状相对于平行的平面对称并且设置在距离基板和覆盖层相等的距离处，并且提供了传感器芯片的制造方法。

4. 发明申请

US20080129280A1 Coupled Member Made of a Plurality of Sensor Chips and Manufacturing Method Thereof 审中-公开
标题翻译：传感器芯片制造的耦合构件及其制造方法
公开(公告)号：US20080129280A1
公开(公告)日：2008-06-05
申请号：US11795902
申请日：2006-01-23
申请人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
发明人： Shingo Kaimori , Toshifumi Hosoya , Moriyasu Ichino , Hideaki Nakamura , Masao Gotoh , Fumiyo Kurusu , Tomoko Ishikawa , Isao Karube
IPC分类号： G01N27/327
CPC分类号： B82Y5/00 , G01N33/4875 , Y10T29/49002
摘要： A coupled member made of a plurality of sensor chips is featured by that adjacent sensor chips are coupled to each other under cuttable condition; the respective sensor chips can be cut and piece-separated from the coupled member in a higher efficiency; and even after the sensor chips are piece-separated, these sensor chips can be readily and quickly stored in containers thereof; and furthermore, the sensor chips can be easily checked and failure chips can be readily removed. More specifically, a method for manufacturing a coupled member made of the plurality of sensor chips is provided in which such sensor chips are coupled to each other under cuttable conditions, while each of these sensor chips includes: a base plate; a cover layer; a hollow reaction portion provided between the base plate and the cover layer; a sensing member provided in the hollow reaction portion; an output terminal for outputting a signal sensed by the sensing member to the outside; and a sample introducing port for introducing a sample to the hollow reaction portion.
摘要翻译：由多个传感器芯片制成的耦合构件的特征在于相邻的传感器芯片在可切割的状态下彼此耦合; 相应的传感器芯片可以以更高的效率从耦合部件切割和分离; 并且即使在传感器芯片被分离之后，这些传感器芯片也可以容易且快速地存储在容器中; 此外，可以容易地检测传感器芯片，并且可以容易地去除故障芯片。更具体地说，提供了一种用于制造由多个传感器芯片制成的耦合构件的方法，其中这些传感器芯片在可切割的条件下彼此耦合，而这些传感器芯片中的每一个包括：基板; 覆盖层; 设置在所述基板和所述覆盖层之间的中空反应部; 设置在所述中空反应部中的检测部件; 输出端子，用于将由感测构件感测的信号输出到外部; 以及用于将样品引入中空反应部的样品引入口。

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