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1. 发明申请

US20150364651A1 Flip-Chip Light Emitting Diode Assembly With Relief Channel 审中-公开
标题翻译：倒装芯片发光二极管组件，带缓冲通道
公开(公告)号：US20150364651A1
公开(公告)日：2015-12-17
申请号：US14303201
申请日：2014-06-12
申请人： Toshiba Corporation
发明人： Wei Zhao , Chih-Wei Chuang , Chao-Kun Lin , Kai Liu
IPC分类号： H01L33/38 , H01L33/00
CPC分类号： H01L33/382 , H01L33/0095 , H01L2933/0016
摘要： A flip-chip LED assembly with relief channel and a method for making the flip-chip LED assembly is disclosed. In one embodiment, the flip-chip LED assembly includes a flip-chip LED with a via and a channel formed in the surface of the flip-chip LED. The channel extends from the via to a sidewall of the flip-chip LED. In another embodiment, a plurality of vias and a plurality of channels are formed in the surface of the flip-chip LED. Each of the plurality of channels extend from each of the vias to another via, or to a sidewall of the flip-chip LED.
摘要翻译：公开了一种具有释放沟道的倒装芯片LED组件和制造倒装芯片LED组件的方法。在一个实施例中，倒装芯片LED组件包括倒装芯片LED，其具有形成在倒装芯片LED的表面中的通孔和通道。通道从通孔延伸到倒装芯片LED的侧壁。在另一个实施例中，在倒装芯片LED的表面中形成多个通孔和多个通道。多个通道中的每个通道从每个通孔延伸到另一个通孔，或者延伸到倒装芯片LED的侧壁。

2. 发明申请

US20150303179A1 Light Emitting Diode Assembly With Integrated Circuit Element 审中-公开
标题翻译：具有集成电路元件的发光二极管组件
公开(公告)号：US20150303179A1
公开(公告)日：2015-10-22
申请号：US14256767
申请日：2014-04-18
申请人： Toshiba Corporation
发明人： Kai Liu , Chao-Kun Lin
IPC分类号： H01L25/16 , H01L33/62 , H01L33/48 , H01L33/36 , H01L23/528 , H01L21/768 , H01L29/866 , H01L29/66
CPC分类号： H01L25/167 , H01L21/768 , H01L27/0248 , H01L29/1608 , H01L29/20 , H01L29/66106 , H01L29/866 , H01L33/0079 , H01L33/36 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
摘要： An LED assembly with an ESD protection device integrated into the carrier substrate and a method for making the LED assembly is disclosed. In one embodiment, the LED assembly includes an LED in contact with a bonding layer in contact with a substrate. The substrate has a region containing a circuit element. The bonding layer forms an ohmic connection between the region containing the circuit element and the LED. In one embodiment, the region containing the circuit element is an ESD protection device, such as a Zener diode.
摘要翻译：公开了一种具有集成到载体基板中的ESD保护装置的LED组件和用于制造LED组件的方法。在一个实施例中，LED组件包括与与衬底接触的接合层接触的LED。衬底具有包含电路元件的区域。接合层在包含电路元件的区域和LED之间形成欧姆连接。在一个实施例中，包含电路元件的区域是诸如齐纳二极管之类的ESD保护器件。

3. 发明申请

US20160276559A1 Light-Emitting Diode Package With Substantially In-Plane Light Emitting Surface and Fabrication Method 审中-公开
标题翻译：具有基本面向发光表面的发光二极管封装和制造方法
公开(公告)号：US20160276559A1
公开(公告)日：2016-09-22
申请号：US14661379
申请日：2015-03-18
申请人： Toshiba Corporation
发明人： Chih-Wei Chuang , Chao-Kun Lin , Kai Liu
IPC分类号： H01L33/62 , H01L33/00 , H01L33/50
CPC分类号： H01L33/62 , H01L33/385 , H01L33/486 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2224/48464 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： The present specification discloses a novel light emitting diode package having a package substrate with a light emitting layer bonded to the package substrate. Unlike conventional LED packages (such as those shown in FIGS. 1 and 2), the chip handling substrate typically located between the package substrate and the light emitting layer is not present. In addition, the LED package of the present specification may comprise an insulating layer formed on the package substrate and the light emitting layer. The LED package of the present specification may further comprise an interconnect metal formed on the insulating layer and the light emitting layer, wherein the interconnect metal electrically connects the light emitting layer to the package substrate.
摘要翻译：本说明书公开了一种新颖的发光二极管封装，其具有封装衬底，发光层与封装衬底结合。与传统的LED封装（例如图1和图2所示）不同，通常位于封装基板和发光层之间的芯片处理基板不存在。此外，本说明书的LED封装可以包括形成在封装基板和发光层上的绝缘层。本说明书的LED封装还可以包括在绝缘层和发光层上形成的互连金属，其中互连金属将发光层电连接到封装基板。

4. 发明申请

US20150303359A1 High Efficiency Light Emitting Diode Package Suitable for Wafer Level Packaging 有权
标题翻译：高效发光二极管封装适用于晶圆级封装
公开(公告)号：US20150303359A1
公开(公告)日：2015-10-22
申请号：US14256715
申请日：2014-04-18
申请人： Toshiba Corporation
发明人： Kai Liu , Chao-Kun Lin
IPC分类号： H01L33/58 , H01L33/54 , H01L33/56 , H01L33/50
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： An LED package and method for LED packaging is disclosed. In one embodiment, an LED package includes a carrier substrate having a predefined surface area, an LED device bonded to the carrier substrate, the LED device having a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and an encapsulant lens having a top surface inclined inwardly at an angle in the range of about 10° to about 140°. In one embodiment, the top surface of the encapsulant lens layer has a concave cone shape. In one embodiment, a wafer level packaging process includes forming an encapsulant lens layer portion having a top surface inclined inwardly at an angle in the range of about 10° to about 140° on each of a plurality of LED devices bonded to a carrier substrate wafer.
摘要翻译：公开了一种用于LED封装的LED封装和方法。在一个实施例中，LED封装包括具有预定表面积的载体衬底，结合到载体衬底的LED器件，LED器件具有占载体衬底的预定表面积的至少百分之五十的覆盖区域，以及密封透镜具有向上倾斜约10°至约140°范围内的顶部表面。在一个实施例中，密封透镜层的顶表面具有凹锥形。在一个实施例中，晶片级封装工艺包括形成密封透镜层部分，该封装透镜层部分具有在大约10°至大约140°范围内向内倾斜的顶表面，所述顶表面在结合到载体衬底晶片的多个LED器件中的每一个上。

5. 发明授权

US09318671B2 High efficiency light emitting diode package suitable for wafer level packaging 有权
标题翻译：高效率发光二极管封装适用于晶圆级封装
公开(公告)号：US09318671B2
公开(公告)日：2016-04-19
申请号：US14256715
申请日：2014-04-18
申请人： Toshiba Corporation
发明人： Kai Liu , Chao-Kun Lin
IPC分类号： H01L33/00 , H01L33/58 , H01L33/50 , H01L33/54 , H01L33/56
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： An LED package and method for LED packaging is disclosed. In one embodiment, an LED package includes a carrier substrate having a predefined surface area, an LED device bonded to the carrier substrate, the LED device having a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and an encapsulant lens having a top surface inclined inwardly at an angle in the range of about 10° to about 140°. In one embodiment, the top surface of the encapsulant lens layer has a concave cone shape. In one embodiment, a wafer level packaging process includes forming an encapsulant lens layer portion having a top surface inclined inwardly at an angle in the range of about 10° to about 140° on each of a plurality of LED devices bonded to a carrier substrate wafer.
摘要翻译：公开了一种用于LED封装的LED封装和方法。在一个实施例中，LED封装包括具有预定表面积的载体衬底，结合到载体衬底的LED器件，LED器件具有占载体衬底的预定表面积的至少百分之五十的覆盖区域，以及密封透镜的上表面以约10°至约140°的范围内的角度向内倾斜。在一个实施例中，密封透镜层的顶表面具有凹锥形状。在一个实施例中，晶片级封装工艺包括形成密封透镜层部分，该封装透镜层部分具有在约10°至约140°范围内向内倾斜的顶表面，该顶表面在结合到载体衬底晶片的多个LED器件中的每一个上。

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