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    • 1. 发明申请
    • HEAT TREATMENT METHOD OF ZNTE SINGLE CRYSTAL SUBSTRATE AND ZNTE SINGLE CRYSTAL SUBSTRATE
    • ZNTE单晶基板和ZNTE单晶基板的热处理方法
    • US20110236297A1
    • 2011-09-29
    • US13158618
    • 2011-06-13
    • Toshiaki AsahiKenji SatoTakayuki Shimizu
    • Toshiaki AsahiKenji SatoTakayuki Shimizu
    • C01B19/04
    • C30B29/48C30B33/02H01L21/477
    • The present invention is to provide a heat treatment method for effectively eliminating Te deposits in a ZnTe single crystal substrate, and a ZnTe single crystal substrate having an optical characteristic suitable for use of a light modulation element and having a thickness of 1 mm or more. A heat treatment method of a ZnTe single crystal substrate, includes: a first step of increasing a temperature the ZnTe single crystal substrate to a first heat treatment temperature T1, and retaining the temperature of the substrate for a predetermined time; and a second step of gradually reducing the temperature of the substrate from the first heat treatment temperature T1 to a second heat treatment temperature T2 lower than the heat treatment temperature T1 with a predetermined rate, wherein the first heat treatment temperature T1 is set in a range of 700° C.≦T1≦1250° C. and the second heat treatment temperature T2 is set in a range of T2≦T1−50.
    • 本发明提供一种用于有效地消除ZnTe单晶衬底中的Te沉积物的热处理方法,以及具有适合于使用光调制元件并具有1mm以上厚度的光学特性的ZnTe单晶衬底。 ZnTe单晶衬底的热处理方法包括:将ZnTe单晶衬底的温度提高到第一热处理温度T1并将衬底的温度保持预定时间的第一步骤; 以及以预定的速率逐渐将基板的温度从第一热处理温度T1逐渐降低到低于热处理温度T1的第二热处理温度T2的第二步骤,其中第一热处理温度T1设定在一定范围内 的温度为700℃,N 2; T1≦̸ 1250℃,第二热处理温度T2设定在T2< 1N; T1-50的范围内。
    • 2. 发明申请
    • Heat Treatment Method of ZnTe Single Crystal Substrate and ZnTe Single Crystal Substrate
    • ZnTe单晶基板和ZnTe单晶基板的热处理方法
    • US20090042002A1
    • 2009-02-12
    • US11988755
    • 2006-07-18
    • Toshiaki AsahiKenji SatoTakayuki Shimizu
    • Toshiaki AsahiKenji SatoTakayuki Shimizu
    • B32B5/00H01L21/263
    • C30B29/48C30B33/02H01L21/477
    • The present invention is to provide a heat treatment method for effectively eliminating Te deposits in a ZnTe single crystal substrate, and a ZnTe single crystal substrate having an optical characteristic suitable for use of a light modulation element and having a thickness of 1 mm or more. A heat treatment method of a ZnTe single crystal substrate, includes: a first step of increasing a temperature the ZnTe single crystal substrate to a first heat treatment temperature T1, and retaining the temperature of the substrate for a predetermined time; and a second step of gradually reducing the temperature of the substrate from the first heat treatment temperature T1 to a second heat treatment temperature T2 lower than the heat treatment temperature T1 with a predetermined rate, wherein the first heat treatment temperature T1 is set in a range of 700° C.≦T1≦1250° C. and the second heat treatment temperature T2 is set in a range of T2≦T1−50.
    • 本发明提供一种用于有效地消除ZnTe单晶衬底中的Te沉积物的热处理方法,以及具有适合于使用光调制元件并具有1mm以上厚度的光学特性的ZnTe单晶衬底。 ZnTe单晶衬底的热处理方法包括:将ZnTe单晶衬底的温度提高到第一热处理温度T1并将衬底的温度保持预定时间的第一步骤; 以及以预定的速率逐渐将基板的温度从第一热处理温度T1逐渐降低到低于热处理温度T1的第二热处理温度T2的第二步骤,其中第一热处理温度T1设定在一定范围内 700℃,<= T1 <= 1250℃,第二热处理温度T2设定在T2 <= T1-50的范围内。
    • 3. 发明授权
    • Heat treatment method of ZnTe single crystal substrate and ZnTe single crystal substrate
    • ZnTe单晶衬底和ZnTe单晶衬底的热处理方法
    • US08476171B2
    • 2013-07-02
    • US11988755
    • 2006-07-18
    • Toshiaki AsahiKenji SatoTakayuki Shimizu
    • Toshiaki AsahiKenji SatoTakayuki Shimizu
    • H01L21/00
    • C30B29/48C30B33/02H01L21/477
    • The present invention is to provide a heat treatment method for effectively eliminating Te deposits in a ZnTe single crystal substrate, and a ZnTe single crystal substrate having an optical characteristic suitable for use of a light modulation element and having a thickness of 1 mm or more. A heat treatment method of a ZnTe single crystal substrate, includes: a first step of increasing a temperature the ZnTe single crystal substrate to a first heat treatment temperature T1, and retaining the temperature of the substrate for a predetermined time; and a second step of gradually reducing the temperature of the substrate from the first heat treatment temperature T1 to a second heat treatment temperature T2 lower than the heat treatment temperature T1 with a predetermined rate, wherein the first heat treatment temperature T1 is set in a range of 700° C.≦T1≦1250° C. and the second heat treatment temperature T2 is set in a range of T2≦T1−50.
    • 本发明提供一种用于有效地消除ZnTe单晶衬底中的Te沉积物的热处理方法,以及具有适合于使用光调制元件并具有1mm以上厚度的光学特性的ZnTe单晶衬底。 ZnTe单晶衬底的热处理方法包括:将ZnTe单晶衬底的温度提高到第一热处理温度T1并将衬底的温度保持预定时间的第一步骤; 以及以预定的速率逐渐将基板的温度从第一热处理温度T1逐渐降低到低于热处理温度T1的第二热处理温度T2的第二步骤,其中第一热处理温度T1设定在一定范围内 在T1 @ 1250℃下为700℃,第二热处理温度T2设定在T2 @ T1-50的范围内。
    • 9. 发明授权
    • Method of manufacturing compound semiconductor single crystal
    • 制造化合物半导体单晶的方法
    • US06334897B1
    • 2002-01-01
    • US09424794
    • 1999-11-30
    • Toshiaki AsahiKeiji KainoshoTatsuya NozakiKenji Sato
    • Toshiaki AsahiKeiji KainoshoTatsuya NozakiKenji Sato
    • C30B1314
    • C30B29/46C30B11/00C30B11/002C30B11/003C30B29/40C30B29/48
    • A method for producing a compound semiconductor single crystal, comprises the steps of: using a crucible having a bottom, a cylindrical shape, a diameter increasing portion having a reversed conical shape in a lower end side of the crucible, and a set portion for a seed crystal in a center of the bottom of the diameter increasing portion; setting a seed crystal in the seed crystal set portion of the crucible; putting a raw material of the compound semiconductor and an encapsulating material into the crucible; enclosing the crucible in an inner container; thereafter setting the inner container in a vertical type furnace; heating the raw material and the encapsulating material by a heating means to melt; and solidifying the obtained raw material melt from the seed crystal toward an upper side with annealing the raw material melt from a lower side to grow a single crystal of the compound semiconductor; wherein a rate of crystal growth at the diameter increasing portion of the crucible is made not less than 20 mm/hr during the crystal is grown.
    • 一种制备化合物半导体单晶的方法,包括以下步骤:使用具有底部,圆筒形状的坩埚,在坩埚的下端侧具有倒锥形的直径增加部分,以及用于 种子晶体在直径增加部分的底部的中心; 将晶种设置在坩埚的晶种组合部分中; 将化合物半导体的原料和封装材料放入坩埚中; 将坩埚封闭在内部容器中; 然后将内容器设置在立式炉中; 通过加热装置加热原料和包封材料以熔化; 并且通过从下侧退火原料熔体而将获得的原料熔体从晶种固化到上侧,以生长化合物半导体的单晶; 其中在晶体生长期间,在坩埚的直径增加部分处的晶体生长速率不小于20mm / hr。