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1. 发明申请

US20110046113A1 AMINE COMPOUND AND USE THEREOF 审中-公开
标题翻译：胺化合物及其用途
公开(公告)号：US20110046113A1
公开(公告)日：2011-02-24
申请号：US12902918
申请日：2010-10-12
申请人： Toru YAMAZAKI , Shigeyuki KIKUMOTO , Masahiro ONO , Atsushi SAITOU , Haruka TAKAHASHI , Sei KUMAKURA , Kunitaka HIROSE , Mikiro YANAKA , Yoshiyuki TAKEMURA , Shigeru SUZUKI , Ryo MATSUI
发明人： Toru YAMAZAKI , Shigeyuki KIKUMOTO , Masahiro ONO , Atsushi SAITOU , Haruka TAKAHASHI , Sei KUMAKURA , Kunitaka HIROSE , Mikiro YANAKA , Yoshiyuki TAKEMURA , Shigeru SUZUKI , Ryo MATSUI
IPC分类号： A61K31/55 , C07D403/12 , C07D401/14 , C07D401/12 , C07D417/12 , C07D403/14 , A61K31/4178 , A61K31/4439 , A61K31/427 , A61K31/454 , A61K31/496 , A61K31/498 , A61K31/5415 , A61K31/5513 , A61P31/18 , A61P31/12 , A61P35/04 , A61P29/00
CPC分类号： C07D233/64 , C07D401/12 , C07D401/14 , C07D403/12 , C07D403/14 , C07D405/14 , C07D417/12 , C07D417/14
摘要： It is intended to provide novel amine compounds which are efficacious against diseases such as infection with HIV virus, rheumatism and cancer metastasis. Namely, amine compounds represented by the following general formula (1): In a typical case, A1 and A2 represent each an optionally substituted monocyclic or polycyclic aromatic heterocycle; W represents cyclic C3-10 alkylene, an optionally substituted monocyclic or polycyclic aromatic heterocycle, a monocyclic or polycyclic aromatic ring or a partly saturated polycyclic aromatic ring; X represents O, CH2, C(═O) or NR11; and D is a group represented by the following general formula (4) or (6). In the formula (6), Q represents a single bond, S, O or NR12; and Y is a group represented by the following general formula (7). —(CR18R19)m3— Or —(CR20R21)m4-z-(CR22R23)m5 (7) z represents an optionally substituted monocyclic or polycyclic aromatic ring. In the formula (6), B represents NR25R26. In the above formulae, R1 to R26 each represents hydrogen, alkyl, alkenyl or alkynyl.
摘要翻译：旨在提供对HIV病毒感染，风湿病和癌症转移等疾病有效的新型胺化合物。即，由以下通式（1）表示的胺化合物：在典型情况下，A1和A2各自表示任选取代的单环或多环芳族杂环; W表示环状C 3-10亚烷基，任选取代的单环或多环芳族杂环，单环或多环芳环或部分饱和多环芳环; X表示O，CH 2，C（= O）或NR 11; D为由以下通式（4）或（6）表示的基团。在式（6）中，Q表示单键，S，O或NR 12; Y为由以下通式（7）表示的基团。 - （CR18R19）m3-或 - （CR20R21）m4-z-（CR22R23）m5（7）z表示任选取代的单环或多环芳环。式（6）中，B表示NR25R26。在上式中，R 1至R 26各自表示氢，烷基，烯基或炔基。

2. 发明申请

US20100008056A1 STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN 审中-公开
标题翻译：立体电子电路设备及其继电器和继电器框架
公开(公告)号：US20100008056A1
公开(公告)日：2010-01-14
申请号：US12562444
申请日：2009-09-18
申请人： Masahiro ONO , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
发明人： Masahiro ONO , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译：立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

3. 发明申请

US20100167597A1 ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电极结结构及其制造方法
公开(公告)号：US20100167597A1
公开(公告)日：2010-07-01
申请号：US12644571
申请日：2009-12-22
申请人： Kentaro KUMAZAWA , Masahiro ONO , Yoshihiro TOMURA
发明人： Kentaro KUMAZAWA , Masahiro ONO , Yoshihiro TOMURA
IPC分类号： H01R9/22 , B32B38/16
CPC分类号： H01R13/52 , H05K1/142 , H05K3/284 , H05K3/361 , H05K2201/10977
摘要： The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.
摘要翻译：电极结结构包括：玻璃基板; 多个柔性基板在平面图中布置成跨过玻璃基板的边缘并且被布置成沿着边缘彼此具有空间; 用于接合玻璃基板和每个柔性基板的粘合剂; 以及密封树脂，用于覆盖玻璃基板和每个柔性基板之间的接合部分，其中形成密封树脂的边缘，使得密封树脂的边缘在平面图中具有连续的波形部分，其中凸部并且与假想线交替的凹部作为中心轴，所述假想线平行于所述玻璃基板的边缘并且位于所述玻璃基板的边缘的外侧，并且其中所述凸部形成为位于所述柔性底物。

4. 发明申请

US20100155111A1 MOUNTING STRUCTURE 审中-公开
标题翻译：安装结构
公开(公告)号：US20100155111A1
公开(公告)日：2010-06-24
申请号：US12639474
申请日：2009-12-16
申请人： Masahiro ONO
发明人： Masahiro ONO
IPC分类号： H05K1/16 , H05K1/03
CPC分类号： H05K1/0271 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/19105 , H05K1/141 , H05K1/181 , H05K3/0064 , H05K3/284 , H05K3/3436 , H05K2201/09909 , H05K2201/2009 , H05K2201/2018 , H05K2203/1316 , H05K2203/1572 , H01L2224/0401
摘要： A mounting structure of the present invention includes: electronic components, a first substrate on which the electronic components are mounted, a first resin for molding at least a part of a surface of the first substrate with the electronic components mounted on the surface, a second substrate on which the first substrate is mounted, connecting members for connecting the first substrate and the second substrate, and a flat reinforcing member disposed on the opposite surface of the second substrate from a surface on which the first substrate is mounted. The reinforcing member is disposed such that the longitudinal direction of the reinforcing member is arranged along the longitudinal direction of the first substrate.
摘要翻译：本发明的安装结构包括：电子部件，其上安装有电子部件的第一基板，用于将电子部件安装在表面上的第一基板的表面的至少一部分成型的第一树脂，第二基板其上安装有第一基板的基板，用于连接第一基板和第二基板的连接构件，以及从安装有第一基板的表面设置在第二基板的相对表面上的平坦加强构件。加强构件被设置成使得加强构件的纵向方向沿着第一基板的纵向方向布置。

5. 发明申请

US20100207264A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MOUNTED STRUCTURE 有权
标题翻译：半导体器件和半导体器件安装结构
公开(公告)号：US20100207264A1
公开(公告)日：2010-08-19
申请号：US12702804
申请日：2010-02-09
申请人： Masahiro ONO
发明人： Masahiro ONO
IPC分类号： H01L23/488
CPC分类号： H01L23/3128 , H01L21/561 , H01L23/3135 , H01L23/3737 , H01L23/49816 , H01L23/5383 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/16227 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/19105 , H05K1/0218 , H05K1/095 , H05K3/284 , H05K2201/0919 , H05K2203/1316 , H01L2224/81
摘要： A module substrate has an interconnection electrode that is exposed at a side end face thereof. A semiconductor component including an IC chip is mounted on the module substrate. A molded part comprising a resin is formed so as to cover at least a part of the semiconductor component. A coating with higher heat conductivity than the molded part is formed on the surface of the molded part by applying a paste made of material with higher heat conductivity than the molded part. This improves heat dissipation. The coating can be formed such that it extends to the surface of the main substrate on which the module substrate with the semiconductor component is mounted and comes into contact with the interconnection electrode on the surface of the main substrate. This further improves heat dissipation.
摘要翻译：模块基板具有在其侧端面露出的互连电极。包括IC芯片的半导体部件安装在模块基板上。形成包含树脂的成型部，以覆盖半导体部件的至少一部分。通过施加由比模制部件更高的导热性的材料制成的糊料，在模制部件的表面上形成具有比模制部件更高导热性的涂层。这改善了散热。涂层可以形成为使得其延伸到其上安装有半导体部件的模块基板的主基板的表面，并且与主基板的表面上的互连电极接触。这进一步改善了散热。

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