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    • 2. 发明授权
    • Modified polyolefin resin compositions
    • 改性聚烯烃树脂组合物
    • US5349027A
    • 1994-09-20
    • US927530
    • 1992-09-16
    • Toru UekiMasaji YoshimuraKazuharu KanezakiSusumu KishiTakashi SatohMinoru Takiguchi
    • Toru UekiMasaji YoshimuraKazuharu KanezakiSusumu KishiTakashi SatohMinoru Takiguchi
    • C08F8/30C08F236/10
    • C08F8/30
    • A modified polyolefin resin obtained by reacting a polyolefin resin with an epoxy group-containing acrylamide monomer represented by the following general formula I:H.sub.2 C.dbd.CR--CO--NH--CH.sub.2 --Ar:wherein Ar represents an aromatic hydrocarbon group having 6 to 24 carbon atoms which is substituted with at least one glycidyloxy group and R represents a hydrogen atom or a methyl group) in the presence of a free-radical initiator is herein provided.A thermoplastic resin composition comprising 5 to 95% by weight of the foregoing modified polyolefin resin and 95 to 5% by weight of another thermoplastic resin is herein provided.Further, a filler-reinforced polyolefin resin composition comprising 100 parts by weight of the foregoing modified polyolefin resin and 3 to 300 parts by weight of an inorganic or organic filler is herein provided.
    • PCT No.PCT / JP91 / 00393 Sec。 371日期:1992年9月16日 102(e)日期1992年9月16日PCT 1991年3月27日PCT公布。 第WO91 / 14717号公报 日本特开1991年10月3日,日本特开平9-2131号公报。一种改性聚烯烃树脂,其通过使聚烯烃树脂与下述通式I所示的含环氧基的丙烯酰胺单体反应得到:H2C = CR-CO-NH-CH2-Ar:其中Ar表示芳香族 本文提供了在自由基引发剂的存在下,由至少一个缩水甘油氧基取代的具有6至24个碳原子的烃基,R表示氢原子或甲基。 本发明提供一种热塑性树脂组合物,其含有5〜95重量%的上述改性聚烯烃树脂和95〜5重量%的其他热塑性树脂。 此外,提供了包含100重量份前述改性聚烯烃树脂和3至300重量份无机或有机填料的填料增强聚烯烃树脂组合物。
    • 4. 发明授权
    • Polyphenylene ether resin composition
    • 聚苯醚树脂组合物
    • US5382627A
    • 1995-01-17
    • US100218
    • 1993-08-02
    • Masaji YoshimuraKazuharu KanezakiTakashi SatohTomoyuki NakataMinoru Takiguchi
    • Masaji YoshimuraKazuharu KanezakiTakashi SatohTomoyuki NakataMinoru Takiguchi
    • C08L71/12C08L25/14
    • C08L71/123Y10S525/905
    • A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B" type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.
    • 一种聚苯醚树脂组合物,其含有(A)100重量份由100-60重量份的聚苯醚基树脂组成的聚苯醚树脂, %的聚苯醚树脂和0-40wt。 %的聚苯乙烯树脂和(B)1-40重量份由乙烯基单体和不饱和二羧酸酯获得的二羧酸酯共聚物作为可共聚组分。 二羧酸酯共聚物的重均分子量不大于60,000。 如果需要,聚苯醚树脂组合物还可以包含(C)1-40重量份的导电性碳或A-B-A'型或A-B'-B“型嵌段共聚物弹性体。 由于其优异的机械性能,耐热性和成型性,所以树脂组合物可用于汽车,家用电子或电器以及工业部件或组件领域。
    • 6. 发明授权
    • Polyimide resin composition
    • 聚酰亚胺树脂组合物
    • US6103806A
    • 2000-08-15
    • US216867
    • 1998-12-21
    • Hiroyasu KidoMasaji YoshimuraYasunori YoshidaKayako YanagiharaHideaki OikawaShoji TamaiTomohito Koba
    • Hiroyasu KidoMasaji YoshimuraYasunori YoshidaKayako YanagiharaHideaki OikawaShoji TamaiTomohito Koba
    • C08L79/08
    • C08L79/08
    • A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (1)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2. According to the present invention, there are provided a polymer alloy in which the advantages of the polyimide (1) and the polyimide (2) are utilized and the disadvantages of the polyimide (1) and the polyimide (2) are reduced; a polyimide resin composition from which crystalline molded articles can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds; and a polyimide resin composition from which molded articles having an excellent dimensional accuracy and flexural modulus can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds, for example, in the case that the molded articles are intended to be used at a high temperature of 230.degree. C. or more, for example, a temperature of 230 to 300.degree. C., or 230 to 250.degree. C.
    • 本文公开了一种聚酰亚胺树脂组合物,其包含5至60重量%的具有由化学式1表示的重复单元的聚酰亚胺[聚酰亚胺(1)]和40至95重量%的聚酰亚胺[聚酰亚胺(2)] 具有由化学式2表示的重复单元。根据本发明,提供了使用聚酰亚胺(1)和聚酰亚胺(2)的优点的聚合物合金,并且聚酰亚胺(1) 并且聚酰亚胺(2)被还原; 聚酰亚胺树脂组合物,甚至可以通过通常的成型周期获得结晶模制品,例如约30至60秒的注塑周期; 以及聚酰亚胺树脂组合物,即使在通常的成型周期(例如,注射成型周期为约30〜60秒)下,也可以获得具有优异的尺寸精度和挠曲模量的成型制品,例如在成型 制品应在230℃或更高的高温下使用,例如温度为230-300℃,或230-250℃。