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1. 发明授权

US08431614B2 Loxoprofen derivative and pharmaceutical preparation containing the same 有权
标题翻译：洛索丙芬衍生物和含有它的药物制剂
公开(公告)号：US08431614B2
公开(公告)日：2013-04-30
申请号：US13148566
申请日：2010-02-18
申请人： Toru Mizushima , Masami Ohtsuka , Yoshinari Okamoto , Naoki Yamakawa
发明人： Toru Mizushima , Masami Ohtsuka , Yoshinari Okamoto , Naoki Yamakawa
IPC分类号： A61K31/192 , C07C59/48 , C07C59/86
CPC分类号： C07C205/56 , C07B2200/07 , C07C59/54 , C07C59/56 , C07C59/88 , C07C59/90 , C07C65/36 , C07C69/757 , C07C69/76 , C07C229/42 , C07C323/62 , C07C2601/08
摘要： There is provided a novel loxoprofen derivative that has no side effect such as a gastrointestinal disorder and also has excellent anti-inflammatory and analgesic effects and is represented by the following formula (I) or (II): (wherein R1 and R2 each represent a halogen atom or a substituted or unsubstituted phenyl group) or a pharmacologically acceptable salt thereof. In the derivative, the halogen atom is selected from a chlorine atom, a bromine atom, a fluorine atom, and an iodine atom, and a substituent of the substituted phenyl group is a halogen atom, a hydroxyl group, a substituted or unsubstituted lower alkyl group, a lower alkylthio group, a lower alkoxy group, a nitro group, an amino group, or a carboxyl group.
摘要翻译：本发明提供一种新颖的洛索洛芬衍生物，其不具有胃肠功能紊乱等副作用，具有优异的抗炎镇痛效果，并且由下式（I）或（II）表示：（其中R1和R2各自表示卤素原子或取代或未取代的苯基）或其药理学上可接受的盐。在衍生物中，卤素原子选自氯原子，溴原子，氟原子和碘原子，取代苯基的取代基为卤素原子，羟基，取代或未取代的低级烷基低级烷硫基，低级烷氧基，硝基，氨基或羧基。

2. 发明申请

US20120016158A1 LOXOPROFEN DERIVATIVE AND PHARMACEUTICAL PREPARATION CONTAINING THE SAME 有权
标题翻译：含有其衍生物和药物制剂的LOXOPROFEN
公开(公告)号：US20120016158A1
公开(公告)日：2012-01-19
申请号：US13148566
申请日：2010-02-18
申请人： Toru Mizushima , Masami Ohtsuka , Yoshinari Okamoto , Naoki Yamakawa
发明人： Toru Mizushima , Masami Ohtsuka , Yoshinari Okamoto , Naoki Yamakawa
IPC分类号： C07C205/56 , C07C59/54 , C07C229/44 , C07C59/56 , C07C59/88 , C07C59/90
CPC分类号： C07C205/56 , C07B2200/07 , C07C59/54 , C07C59/56 , C07C59/88 , C07C59/90 , C07C65/36 , C07C69/757 , C07C69/76 , C07C229/42 , C07C323/62 , C07C2601/08
摘要： There is provided a novel loxoprofen derivative that has no side effect such as a gastrointestinal disorder and also has excellent anti-inflammatory and analgesic effects and is represented by the following formula (I) or (II): (wherein R1 and R2 each represent a halogen atom or a substituted or unsubstituted phenyl group) or a pharmacologically acceptable salt thereof. In the derivative, the halogen atom is selected from a chlorine atom, a bromine atom, a fluorine atom, and an iodine atom, and a substituent of the substituted phenyl group is a halogen atom, a hydroxyl group, a substituted or unsubstituted lower alkyl group, a lower alkylthio group, a lower alkoxy group, a nitro group, an amino group, or a carboxyl group.
摘要翻译：本发明提供一种新颖的洛索洛芬衍生物，其不具有胃肠功能紊乱等副作用，具有优异的抗炎镇痛效果，并且由下式（I）或（II）表示：（其中R1和R2各自表示卤素原子或取代或未取代的苯基）或其药理学上可接受的盐。在衍生物中，卤素原子选自氯原子，溴原子，氟原子和碘原子，取代苯基的取代基为卤素原子，羟基，取代或未取代的低级烷基低级烷硫基，低级烷氧基，硝基，氨基或羧基。

3. 发明申请

US20070197742A1 Heat curable silicone composition 审中-公开
标题翻译：热固性硅酮组合物
公开(公告)号：US20070197742A1
公开(公告)日：2007-08-23
申请号：US11706258
申请日：2007-02-15
申请人： Naoki Yamakawa
发明人： Naoki Yamakawa
IPC分类号： C08L83/05
CPC分类号： G02B1/041 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , C08L83/06 , C08L83/00 , C08L2666/44
摘要： Heat curable silicone compositions comprising (A) an alkenyl-containing organopolysiloxane with 0.5-10 wt % of hydroxyl groups, (B) an organohydrogenpolysiloxane, (C) an addition reaction catalyst, and (D) an epoxy and/or alkoxy group-containing organohydrogenpolysiloxane, epoxy and/or alkoxy group-containing organosilane, or non-siliceous epoxy compound cure into products which have a high hardness, transparency, heat resistance and light resistance, and do not turn white turbid even when held in a hot humid atmosphere.
摘要翻译：包含（A）含有0.5-10重量％羟基的含烯基的有机聚硅氧烷，（B）有机氢聚硅氧烷，（C）加成反应催化剂和（D）含有环氧基和/或烷氧基的有机氢聚硅氧烷，环氧和/或烷氧基的有机硅烷或非硅质环氧化合物固化成具有高硬度，透明性，耐热性和耐光性的产品，即使在热湿气氛中保持时也不会变白。

4. 发明授权

US06780518B2 Silicone rubber adhesive composition and integrally molded article of silicone rubber and thermoplastic resin 有权
标题翻译：硅橡胶胶粘剂组合物和硅橡胶和热塑性树脂的整体模塑制品
公开(公告)号：US06780518B2
公开(公告)日：2004-08-24
申请号：US10035213
申请日：2002-01-04
申请人： Syuuichi Azechi , Naoki Yamakawa
发明人： Syuuichi Azechi , Naoki Yamakawa
IPC分类号： B32B710
CPC分类号： C09J183/04 , C08L83/00 , Y10T428/31 , Y10T428/31511 , Y10T428/31667
摘要： A silicone rubber adhesive composition comprising (A) a heat curable organopolysiloxane composition of the addition curing type or peroxide curing type, (B) reinforcing silica fines, and (C) an organic compound or organosilicon compound having an epoxy equivalent of 100-5,000 g/mol and containing at least one aromatic ring in a molecule is easily moldable within a short time by injection molding, suitable in primerless molding, and bondable with various thermoplastic resins. Integrally molded articles in which the silicone rubber adhesive composition is firmly bonded to the thermoplastic resin are obtainable without a need for modification of the resin.
摘要翻译：一种硅橡胶粘合剂组合物，其包含（A）加成固化型或过氧化物固化型的可热固化的有机聚硅氧烷组合物，（B）增强二氧化硅细粒，和（C）环氧当量为100-5,000g的有机化合物或有机硅化合物 / mol，并且在分子中含有至少一个芳香环通过注射成型容易地在短时间内模塑，适用于无底料成型，并可与各种热塑性树脂粘合。无需修改树脂即可获得其中硅橡胶粘合剂组合物牢固地结合到热塑性树脂上的整体模塑制品。

5. 发明授权

US07737212B2 Heat conductive silicone composition 有权
标题翻译：导热硅胶组合物
公开(公告)号：US07737212B2
公开(公告)日：2010-06-15
申请号：US11439277
申请日：2006-05-24
申请人： Toshiyuki Ozai , Naoki Yamakawa
发明人： Toshiyuki Ozai , Naoki Yamakawa
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08L83/00
摘要： A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.
摘要翻译：提供了一种导热硅氧烷组合物，其包括（A）具有式（1）的有机聚硅氧烷：{（CH 2 = CH）R 12 SiO 1/2/2）L（R 1 SiO 3/2）m（R 12 SiO）n {O 1 / 2SiR 12 -R 2 - SiR1（3-a）（OR3）a} o（1）其中R1表示一价烃基，R2表示氧原子或二价烃基，R3表示烷基，烷氧基烷基，烯基或酰基，L o表示1〜10的数，m表示0〜10的数，n表示5〜100的数，a表示1〜3的整数，m = 0时，L + o = 2，R2表示二价烃基，（B）导热性填料，（C）除（A）成分以外的有机聚硅氧烷。即使使用导热填料进行高级包装以获得高导热性，组合物仍然表现出良好的处理和成型性能。

6. 发明授权

US07705104B2 Addition curable silicon resin composition for light emitting diode 有权
标题翻译：用于发光二极管的加成可固化硅树脂组合物
公开(公告)号：US07705104B2
公开(公告)日：2010-04-27
申请号：US11461895
申请日：2006-08-02
申请人： Naoki Yamakawa , Kei Miyoshi
发明人： Naoki Yamakawa , Kei Miyoshi
IPC分类号： C08G77/12
CPC分类号： C08G77/44 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , C08L2205/02 , C08L2205/035 , C08L83/00
摘要： An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: —(R12SiO)n— wherein, R1 is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R23SiO1/2 units wherein, R2 is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO2 units, and/or R2SiO3/2 units wherein, R2 is as defined above, in which at least two of all the R2 groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.
摘要翻译：提供了一种用于发光二极管的可加成固化的有机硅树脂组合物。该组合物包括有机聚硅氧烷，其包括由下式表示的直链链段： - （R 12 SiO）n - ，其中，R 1是不饱和的无脂族键结的一价烃基，和n为1以上的整数，以及由R 23 SiO 1/2单元构成的树脂状链段，其中，R 2为一价烃基，烷氧基或羟基，SiO 2单元和/或R 2 SiO 3/2单元其中R2如上所定义，其中所有R2基团中的至少两个是烯基。该组合物显示出对热冲击的强耐受性，并且即使在剧烈的温度循环下也能耐裂纹。

7. 发明授权

US07425373B2 Primer composition 有权
标题翻译：底漆组成
公开(公告)号：US07425373B2
公开(公告)日：2008-09-16
申请号：US11120985
申请日：2005-05-04
申请人： Naoki Yamakawa , Noriyuki Meguriya
发明人： Naoki Yamakawa , Noriyuki Meguriya
IPC分类号： B32B9/04
CPC分类号： C09D4/00 , Y10T428/31663
摘要： A primer composition comprising a compound containing an epoxy group, a Si—H group, and an aromatic ring per molecule, and a solvent is effective for assisting in integral molding or bonding a silicone rubber to an adherend of gold, silver or platinum.
摘要翻译：包含每分子含有环氧基，Si-H基和芳环的化合物和溶剂的底漆组合物有助于将硅橡胶整体成型或粘合到金，银或铂的被粘物上。

8. 发明授权

US07271215B2 Addition reaction-curable liquid silicone rubber compositions and process of preparing same 有权
标题翻译：加成反应可固化液体硅橡胶组合物及其制备方法
公开(公告)号：US07271215B2
公开(公告)日：2007-09-18
申请号：US11151255
申请日：2005-06-14
申请人： Masayuki Ikeno , Shigeki Shudo , Naoki Yamakawa , Yujiro Taira
发明人： Masayuki Ikeno , Shigeki Shudo , Naoki Yamakawa , Yujiro Taira
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , Y10T428/2995 , C08L83/00
摘要： An addition reaction-curable liquid silicone rubber composition includes an organopolysiloxane containing at least one Si-bonded vinyl group only at each end of its backbone and having a viscosity of from 1 to 1,000 Pa·s at 25° C., an organopolysiloxane containing at least two Si-bonded vinyl groups only in side chains on its backbone and having a viscosity of from 0.1 to 100 Pa·s at 25° C., the amount of siloxane units bonded to the vinyl groups being from 2 to 20 mole % of its total siloxane units, finely divided silica having a specific surface area of at least 50 m2/g, hexamethyldisilazane, water, an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms per molecule, and a hydrosilation catalyst. Another addition reaction-curable liquid silicone rubber composition additionally includes a specific non-functional dimethylpolysiloxane. The silicone rubber compositions are cured into products having a hardness of at least 75 as measured by a type-A durometer and an elongation at break of at least 200%.
摘要翻译：加成的可反应固化的液体硅橡胶组合物包括仅在其主链的每个末端含有至少一个与Si键合的乙烯基的有机聚硅氧烷，并且其在25℃下的粘度为1至1,000Pa.s，至少两个Si键合的乙烯基仅在其主链的侧链上，并且在25℃下的粘度为0.1至100Pa.s，与乙烯基键合的硅氧烷单元的量为2-20摩尔％其总硅氧烷单元，具有至少50m 2 / g比表面积的细分二氧化硅，六甲基二硅氮烷，水，每分子含有至少两个与Si键合的氢原子的有机氢聚硅氧烷和氢硅化物催化剂。另一种另外的反应可固化的液体硅橡胶组合物另外包括特定的非官能的二甲基聚硅氧烷。将硅橡胶组合物固化成硬度至少为75的产品，通过A型硬度计测定，断裂伸长率至少为200％。

9. 发明申请

US20050250902A1 Primer composition 有权
标题翻译：底漆组成
公开(公告)号：US20050250902A1
公开(公告)日：2005-11-10
申请号：US11120985
申请日：2005-05-04
申请人： Naoki Yamakawa , Noriyuki Meguriya
发明人： Naoki Yamakawa , Noriyuki Meguriya
IPC分类号： C08L83/04 , C09D4/00
CPC分类号： C09D4/00 , Y10T428/31663
摘要： A primer composition comprising a compound containing an epoxy group, a Si—H group, and an aromatic ring per molecule, and a solvent is effective for assisting in integral molding or bonding a silicone rubber to an adherend of gold, silver or platinum.
摘要翻译：包含每分子含有环氧基，Si-H基和芳环的化合物和溶剂的底漆组合物有助于将硅橡胶整体成型或粘合到金，银或铂的被粘物上。

10. 发明申请

US20060270788A1 Heat conductive silicone composition 有权
标题翻译：导热硅胶组合物
公开(公告)号：US20060270788A1
公开(公告)日：2006-11-30
申请号：US11439277
申请日：2006-05-24
申请人： Toshiyuki Ozai , Naoki Yamakawa
发明人： Toshiyuki Ozai , Naoki Yamakawa
IPC分类号： C08G59/40
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08L83/00
摘要： A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties
摘要翻译：提供了一种导热硅氧烷组合物，其包括（A）具有式（1）的有机聚硅氧烷：<？in-line-formula description =“In-line formula”end =“lead”？> {（CH < 2 - - - - - - - - - - - - - - - - - - - - - - - - （1） 1 SiO 2/2/2）SiO 2（R 1）2 SiO 2）n < / O 2 1/2 SiR 1 - 2 - - - - - - - - - - - - - - - - - - - - - （3-a）（或<3>）（1）<？ -formulae description =“In-line Formulas”end =“tail”？>其中R 1表示一价烃基，R 2表示氧原子或二价烃基 R 3表示烷基，烷氧基烷基，烯基或酰基，L和o表示1〜10的数，m表示0〜10的数，n表示5以上的数至100时，a表示1〜3的整数，当m = 0时，L + o = 2，R 2为二价烃基，（B）导电填料，（C）除（A）成分以外的有机聚硅氧烷。即使使用导热填料进行高级包装以获得高导热性，组合物仍然表现出良好的处理和成型性能

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