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1. 发明授权

US6011307A Anisotropic conductive interconnect material for electronic devices, method of use and resulting product 失效
标题翻译：用于电子设备的各向异性导电互连材料，使用方法和所得产品
公开(公告)号：US6011307A
公开(公告)日：2000-01-04
申请号：US909683
申请日：1997-08-12
申请人： Tongbi Jiang , Zhiqiang Wu , David Kao , Rongsheng Yang
发明人： Tongbi Jiang , Zhiqiang Wu , David Kao , Rongsheng Yang
IPC分类号： H01L21/60 , H01L23/498 , H01L29/43
CPC分类号： H01L24/12 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29398 , H01L2224/29499 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/0105 , H01L2924/01056 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1579
摘要： Conductive interconnections are formed by depositing an adhesive material, made up of ferromagnetic particles dispersed within a matrix material, on a semiconductor substrate, such as an electronic component, and applying a magnetic field between an exposed surface of the adhesive material and an attached surface of the adhesive material (abutting the semiconductor substrate), such that a plurality of the ferromagnetic particles move and align within the matrix material under the influence of the magnetic field. One method of the present invention comprises depositing the adhesive material on a contact site of a first electronic component. A second electronic component having a contact site is aligned over the adhesive material and a magnetic field is applied between the first electronic component and the second electronic component. The first electronic component and the second electronic component are then pressed together such that a portion of the plurality of the ferromagnetic particles makes electrical contact with both the first electronic component bond pad and its corresponding second electronic component bond pad.
摘要翻译：导电互连通过将分散在基体材料中的铁磁粒子构成的粘合剂材料沉积在诸如电子部件的半导体衬底上并在粘合剂材料的暴露表面和附着表面之间施加磁场而形成粘合剂材料（邻接半导体衬底），使得多个铁磁性颗粒在磁场的影响下在基体材料内移动和对准。本发明的一种方法包括将粘合剂材料沉积在第一电子部件的接触部位上。具有接触位置的第二电子部件在粘合剂材料上对准，并且在第一电子部件和第二电子部件之间施加磁场。然后将第一电子部件和第二电子部件压在一起，使得多个铁磁性粒子的一部分与第一电子部件接合焊盘及其对应的第二电子部件接合焊盘进行电接触。

2. 发明授权

US06788552B1 Method and apparatus for reducing substrate bias voltage drop 有权
标题翻译：降低衬底偏置电压降的方法和装置
公开(公告)号：US06788552B1
公开(公告)日：2004-09-07
申请号：US09652216
申请日：2000-08-30
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： H05K900
CPC分类号： H01L24/06 , H01L23/4827 , H01L23/4828 , H01L23/585 , H01L24/48 , H01L27/08 , H01L27/10882 , H01L27/10897 , H01L2223/665 , H01L2224/04042 , H01L2224/05093 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/48091 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/8546 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor device is provided with a conductive layer provided on a backside of a semiconductor substrate. The conductive layer helps maintain a uniform bias voltage over the substrate. The conductive layer can also be used to apply a bias voltage to the substrate and reduce the number of bias voltage distribution regions required.
摘要翻译：半导体器件设置有设置在半导体衬底的背面上的导电层。导电层有助于在衬底上保持均匀的偏置电压。导电层也可用于向衬底施加偏置电压并减少所需的偏置电压分布区域的数量。

3. 发明授权

US06367685B1 Ultrasonic vibration mode for wire bonding 失效
标题翻译：超声波振动模式用于引线接合
公开(公告)号：US06367685B1
公开(公告)日：2002-04-09
申请号：US09819030
申请日：2000-11-15
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： B23K106
CPC分类号： H01L24/85 , B23K20/004 , B23K2101/38 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/78301 , H01L2224/78347 , H01L2224/78822 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/20303 , H01L2924/20305 , H01L2924/00 , H01L2224/45099 , H01L2924/00015
摘要： A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.
摘要翻译：一种用于产生二阶振动模式的方法和装置。该装置包括信号发生器，压电换能器，多个波传播光束和反射板。由信号发生器施加到压电换能器的电场引起换能器的单向振动。振动通过光束传播并被反射板以闭合的多边形回路反射。最终反射方向与原始振动垂直。该装置产生圆形或椭圆形的振动。可以将圆形或椭圆形振动能量赋予集成电路的引线键合，以增加连接的强度。

4. 发明授权

US06363796B1 High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles 失效
标题翻译：具有负载有填料颗粒的绝缘柔性基质的高分辨率压力传感装置
公开(公告)号：US06363796B1
公开(公告)日：2002-04-02
申请号：US09592737
申请日：2000-06-13
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： G01D700
CPC分类号： G01L1/205
摘要： A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.
摘要翻译：公开了一种高分辨率压力感测装置。该装置包括具有多个填料颗粒的绝缘柔性基质。对矩阵施加力会导致矩阵的压缩。这导致在没有施加力的情况下，填料颗粒在基质内占据更大量的空间。连接到基体的检测器检测或测量填料颗粒相对于基体体积的体积，因此确定施加到基质上的力。优选地，基质的电阻率与填料颗粒的体积百分比成反比，在这种情况下，检测器是电阻测量电路。

5. 发明授权

US06244498B1 Ultrasonic vibration mode for wire bonding 失效
标题翻译：超声波振动模式用于引线接合
公开(公告)号：US06244498B1
公开(公告)日：2001-06-12
申请号：US09293676
申请日：1999-04-16
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： B23K106
CPC分类号： H01L24/85 , B23K20/004 , B23K2101/38 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/78301 , H01L2224/78347 , H01L2224/78822 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/20303 , H01L2924/20305 , H01L2924/00 , H01L2224/45099 , H01L2924/00015
摘要： A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.
摘要翻译：一种用于创建二阶振动模式的方法和装置。该装置包括信号发生器，压电换能器，多个波传播光束和反射板。由信号发生器施加到压电换能器的电场引起换能器的单向振动。振动通过光束传播并被反射板以闭合的多边形回路反射。最终反射方向与原始振动垂直。该装置产生圆形或椭圆形的振动。可以将圆形或椭圆形振动能量赋予集成电路的引线键合，以增加连接的强度。

6. 发明授权

US06685083B2 Ultrasonic vibration mode for wire bonding 失效
标题翻译：超声波振动模式用于引线接合
公开(公告)号：US06685083B2
公开(公告)日：2004-02-03
申请号：US10020107
申请日：2001-12-07
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： B23K106
CPC分类号： H01L24/85 , B23K20/004 , B23K2101/38 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/78301 , H01L2224/78347 , H01L2224/78822 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/20303 , H01L2924/20305 , H01L2924/00 , H01L2224/45099 , H01L2924/00015
摘要： A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.
摘要翻译：一种用于产生二阶振动模式的方法和装置。该装置包括信号发生器，压电换能器，多个波传播光束和反射板。由信号发生器施加到压电换能器的电场引起换能器的单向振动。振动通过光束传播并被反射板以闭合的多边形回路反射。最终反射方向与原始振动垂直。该装置产生圆形或椭圆形的振动。可以将圆形或椭圆形振动能量赋予集成电路的引线键合，以增加连接的强度。

7. 发明授权

US06520030B1 High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles 有权
标题翻译：具有负载有填料颗粒的绝缘柔性基质的高分辨率压力感测装置
公开(公告)号：US06520030B1
公开(公告)日：2003-02-18
申请号：US09531166
申请日：2000-03-21
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： G01L516
CPC分类号： G01L1/205
摘要： A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.
摘要翻译：公开了一种高分辨率压力感测装置。该装置包括具有多个填料颗粒的绝缘柔性基质。对矩阵施加力会导致矩阵的压缩。这导致在没有施加力的情况下，填料颗粒在基质内占据更大量的空间。连接到基体的检测器检测或测量填料颗粒相对于基体体积的体积，因此确定施加到基质上的力。优选地，基质的电阻率与填料颗粒的体积百分比成反比，在这种情况下，检测器是电阻测量电路。

8. 发明授权

US06245594B1 Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly 失效
标题翻译：用于形成用于倒装芯片技术的导电微凸块和凹陷触点的方法以及倒装芯片组装方法
公开(公告)号：US06245594B1
公开(公告)日：2001-06-12
申请号：US08906297
申请日：1997-08-05
申请人： Zhiqiang Wu , Tongbi Jiang , Salman Akram
发明人： Zhiqiang Wu , Tongbi Jiang , Salman Akram
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L24/11 , H01L2224/05567 , H01L2224/05573 , H01L2224/13099 , H01L2224/13111 , H01L2224/81801 , H01L2924/01005 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/3011
摘要： A flip-chip semiconductor die assembly is provided with discrete projecting connective elements on the die and mating recessed contacts on the substrate, together forming a plurality of electrical, mechanical, and thermal connections between the die and substrate. The element and recess provide a self-aligning feature. Compared to the prior art, a less costly, simpler method for forming the element and recess is provided, which method requires fewer process steps, uses less raw materials, and generates less waste. The method allows for placement of fine-pitch connective elements and precise control of element size and height.
摘要翻译：倒装芯片半导体管芯组件在管芯上提供离散的突出的连接元件，并且在衬底上设置配合的凹入接触，一起在管芯和衬底之间形成多个电，机械和热连接。元件和凹槽提供自对准功能。与现有技术相比，提供了一种成本较低，更简单的用于形成元件和凹槽的方法，该方法需要较少的工艺步骤，使用较少的原材料，并且产生较少的废物。该方法允许放置细间距连接元件并精确控制元件尺寸和高度。

9. 发明授权

US07189602B2 Method and apparatus for reducing substrate bias voltage drop 有权
标题翻译：降低衬底偏置电压降的方法和装置
公开(公告)号：US07189602B2
公开(公告)日：2007-03-13
申请号：US09998165
申请日：2001-12-03
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： H01L21/00
CPC分类号： H01L24/06 , H01L23/4827 , H01L23/4828 , H01L23/585 , H01L24/48 , H01L27/08 , H01L27/10882 , H01L27/10897 , H01L2223/665 , H01L2224/04042 , H01L2224/05093 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/48091 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/8546 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor device is provided with a conductive layer provided on a backside of a semiconductor substrate. The conductive layer helps maintain a uniform bias voltage over the substrate. The conductive layer can also be used to apply a bias voltage to the substrate and reduce the number of bias voltage distribution regions required.
摘要翻译：半导体器件设置有设置在半导体衬底的背面上的导电层。导电层有助于在衬底上保持均匀的偏置电压。导电层也可用于向衬底施加偏置电压并减少所需的偏置电压分布区域的数量。

10. 发明授权

US06820502B2 High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles 失效
标题翻译：具有负载有填料颗粒的绝缘柔性基质的高分辨率压力传感装置
公开(公告)号：US06820502B2
公开(公告)日：2004-11-23
申请号：US10366822
申请日：2003-02-14
申请人： Tongbi Jiang , Zhiqiang Wu
发明人： Tongbi Jiang , Zhiqiang Wu
IPC分类号： G01L516
CPC分类号： G01L1/205
摘要： A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.
摘要翻译：公开了一种高分辨率压力感测装置。该装置包括具有多个填料颗粒的绝缘柔性基质。对矩阵施加力会导致矩阵的压缩。这导致在没有施加力的情况下，填料颗粒在基质内占据更大量的空间。连接到基体的检测器检测或测量填料颗粒相对于基体体积的体积，因此确定施加到基质上的力。优选地，基质的电阻率与填料颗粒的体积百分比成反比，在这种情况下，检测器是电阻测量电路。

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