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    • 2. 发明授权
    • Synchronized processing of ear shells for hearing aids
    • 助听器耳塞同步处理
    • US07308328B2
    • 2007-12-11
    • US10842882
    • 2004-05-11
    • Tong FangJason Jenn-Kwei TyanMing Fang
    • Tong FangJason Jenn-Kwei TyanMing Fang
    • G06F19/00
    • H04R25/658B33Y50/00B33Y80/00H04R25/552H04R25/652H04R2225/77
    • A system and method for synchronously processing ear shells for hearing aids comprising: loading data associated with a first and second ear shell; determining whether to perform a rigid or non-rigid registration of the data associated with the first and second ear shells, wherein the rigid registration is performed when shapes of the first and second ear shells are within a predetermined threshold, and the non-rigid registration is performed when the shapes of the first and second ear shells are not within the predetermined threshold; registering the data associated with the first and second ear shells; processing the first and second ear shells, wherein the processing is synchronously performed; and outputting the processed first and second ear shells to a display device.
    • 一种用于同步处理用于助听器的耳壳的系统和方法,包括:加载与第一和第二耳壳相关联的数据; 确定是否执行与第一和第二耳壳相关联的数据的刚性或非刚性配准,其中当第一耳壳的形状和第二耳壳的形状在预定阈值内时执行刚性配准,并且非刚性配准 当所述第一和第二耳壳的形状不在所述预定阈值内时执行; 注册与第一和第二耳壳相关联的数据; 处理第一和第二耳壳,其中同步执行处理; 并将所处理的第一和第二耳罩输出到显示装置。
    • 5. 发明授权
    • Ball grid array modeling for inspecting surface mounted devices
    • 用于检查表面安装装置的球栅阵列建模
    • US07218770B2
    • 2007-05-15
    • US10379308
    • 2003-03-04
    • Tong FangMing Fang
    • Tong FangMing Fang
    • G06K9/00
    • G06T7/0006G01N21/95607G01N21/95684G01N2021/95646G06T2207/30148G06T2207/30152
    • A computer-implemented method for inspecting BGA components using a ball grid array model thereof in semiconductor surface mounted devices. The method comprises setting a plurality of regions of interest (ROIs) for all BGA balls to be modeled, building a first grid model that includes coordinates and a diameter of the BGA balls in the plurality of ROIs, setting a plurality of regions of interest (ROIs) containing a BGA body to be modeled, detecting four body boundaries to localize four corner coordinates, determining a body orientation from orientations of four boundaries, calculating an orientation of each boundary by the projection of the edge of boundary, and comparing the BGA components with an obtained BGA model to inspect the BGA components based on ball sizes and ball distributions.
    • 一种用于在半导体表面安装器件中使用其球栅阵列模型来检查BGA部件的计算机实现的方法。 该方法包括设置要建模的所有BGA球的多个感兴趣区域(ROI),构建包括多个ROI中的BGA球的坐标和直径的第一网格模型,设置多个感兴趣区域 ROI)包含要建模的BGA体,检测四个体边界以定位四角坐标,从四个边界的取向确定身体取向,通过边界边缘的投影计算每个边界的取向,以及比较BGA分量 使用获得的BGA模型根据球尺寸和球分布检查BGA部件。