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1. 发明申请

US20090190319A1 THREE-DIMENSIONAL MODULE 审中-公开
标题翻译：三维模块
公开(公告)号：US20090190319A1
公开(公告)日：2009-07-30
申请号：US12357809
申请日：2009-01-22
申请人： Tomoyuki HATAKEYAMA
发明人： Tomoyuki HATAKEYAMA
IPC分类号： H05K1/14
CPC分类号： H05K3/368 , B81B7/0048 , B81B7/007 , B81B2201/042 , B81B2207/012 , B81B2207/098 , B81C1/0023 , B81C2201/019 , G02B26/0841 , H01L23/055 , H01L23/16 , H01L25/0657 , H01L25/16 , H01L2224/16225 , H01L2225/06517 , H01L2924/1461 , H05K1/144 , H05K2201/0311 , H05K2201/042 , H05K2201/1031 , Y02P70/611 , H01L2924/00
摘要： A three-dimensional module having a first substrate holding a function element, and a second substrate holding other components. The first and second substrates are laid one above the other in a three-dimensional fashion, and are electrically and mechanically connected. The module has inter-substrate joining members interposed between the first and second substrates and joining the first and second substrates. Each inter-substrate joining member has a stress-absorption member and an electrically conductive stress-absorption member. The stress-absorption member has elasticity and mechanically joining the first and second substrates. The electrically conductive stress-absorption member connects the first and second substrates and can deform in a desirable direction.
摘要翻译：具有保持功能元件的第一基板和保持其他部件的第二基板的三维模块。第一和第二基板以三维方式彼此叠置地放置，并且被电气和机械连接。该模块具有介于第一和第二基板之间并且连接第一和第二基板的基板间连接构件。每个衬底间接合构件具有应力吸收构件和导电应力吸收构件。应力吸收构件具有弹性并机械地接合第一和第二基板。导电应力吸收构件连接第一和第二基板，并且可以沿期望的方向变形。

2. 发明申请

US20090002795A1 MICROMIRROR DEVICE 审中-公开
标题翻译： MICROMIRROR设备
公开(公告)号：US20090002795A1
公开(公告)日：2009-01-01
申请号：US12145575
申请日：2008-06-25
申请人： Tomoyuki HATAKEYAMA
发明人： Tomoyuki HATAKEYAMA
IPC分类号： G02B26/08
CPC分类号： G02B26/0841
摘要： A micromirror device includes a micromirror chip, an electrode substrate, and an intermediate spacer sandwiched between the micromirror chip and the electrode substrate and having substantially the same shape as that of the micromirror chip, the intermediate spacer inhibiting the mirror support portion from being deformed by the moving movable mirror portion. The micromirror chip, the electrode substrate, and the intermediate spacer are arranged and stacked in a thickness direction. The intermediate spacer has an opening located substantially in the center of the intermediate spacer and a plate-like fixed member having a plurality of through-holes disposed around the periphery of the opening. A junction member is melted by desired heating and weighting and inserted and placed in each of the through-holes. When melted, the junction member joins the micromirror chip to the electrode substrate.
摘要翻译：微反射镜装置包括微反射镜芯片，电极基板和夹在微镜芯片和电极基板之间的中间间隔物，并且具有与微反射镜芯片基本相同的形状，中间隔片阻止反射镜支撑部分被变形移动可动镜部分。微反射片芯片，电极基板和中间间隔物在厚度方向上排列并堆叠。中间间隔件具有基本上位于中间间隔件的中心的开口和具有围绕开口的周边设置的多个通孔的板状固定构件。接合构件通过所需的加热和加重而熔化并插入并放置在每个通孔中。当熔融时，接合构件将微镜芯片连接到电极基板。

3. 发明申请

US20080179080A1 JUNCTION STRUCTURE OF FLEXIBLE SUBSTRATE 审中-公开
标题翻译：柔性基板的结构结构
公开(公告)号：US20080179080A1
公开(公告)日：2008-07-31
申请号：US12020036
申请日：2008-01-25
申请人： Yoshinori TANAKA , Tomoyuki HATAKEYAMA
发明人： Yoshinori TANAKA , Tomoyuki HATAKEYAMA
IPC分类号： H05K1/14
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/09781
摘要： A junction structure of a flexible substrate includes a flexible substrate provided with junction terminals. An opposing substrate is placed opposite to the flexible substrate, and provided with junction terminals corresponding to the junction terminals. A thermosetting resin adhesive is interposed between the flexible substrate and opposing substrate, and used to join the flexible substrate and opposing substrate. A thermal conduction equalizing member is formed in at least one of the flexible substrate and opposing substrate, independently of the junction terminals formed in the flexible substrate and the junction terminals formed in the opposing substrate, not to make an electrical connection between the flexible substrate and opposing substrate.
摘要翻译：柔性基板的接合结构包括设置有接线端子的柔性基板。相对的基板与柔性基板相对设置，并且设置有与接线端子对应的接线端子。热固性树脂粘合剂插入柔性基板和相对基板之间，并用于连接柔性基板和相对基板。在柔性基板和相对基板中的至少一个中形成导热均衡部件，而不管形成在柔性基板中的接合端子和形成在相对基板中的接合端子，不会使柔性基板和相对的基板。

4. 发明申请

US20110194859A1 OPTICAL TRANSMITTER 有权
标题翻译：光学发射器
公开(公告)号：US20110194859A1
公开(公告)日：2011-08-11
申请号：US13022878
申请日：2011-02-08
申请人： Tomoyuki HATAKEYAMA
发明人： Tomoyuki HATAKEYAMA
IPC分类号： H04B10/04 , H04B10/12
CPC分类号： G02B6/2804
摘要： An optical transmitter includes three or more emission optical fibers that are three-dimensionally arranged, a single reception optical fiber, and an optical path converting component to optically couple the emission optical fibers to the reception optical fiber. The optical path converting component includes optical transmission portions that are optically coupled to the three or more emission optical fibers one to one, respectively, and optically coupled commonly to the single reception optical fiber. Entry ends of the optical transmission portions are aligned with exit ends of the three or more emission optical fibers, respectively. Exit ends of the optical transmission portions are aligned, as a whole, with an entry end of the single reception optical fiber. The exit ends of the optical transmission portions are arranged substantially parallel to one another and in closer proximity to one another than the entry ends of the optical transmission portions.
摘要翻译：光发射机包括三维排列的三个或更多个发射光纤，单个接收光纤，以及将发射光纤光学耦合到接收光纤的光路转换部件。光路转换部件包括分别光纤耦合到三个或更多个发射光纤的光传输部分，并且光耦合到单个接收光纤。光传输部分的入射端分别与三个或更多个发射光纤的出射端对准。光传输部分的出口端整体上与单个接收光纤的进入端对齐。光传输部分的出口端彼此基本上平行并且彼此比光传输部分的入口端彼此更接近。

5. 发明申请

US20080211073A1 AIRTIGHT PACKAGE 有权
标题翻译： AIRTGHT包装
公开(公告)号：US20080211073A1
公开(公告)日：2008-09-04
申请号：US12018615
申请日：2008-01-23
申请人： Tomoyuki HATAKEYAMA
发明人： Tomoyuki HATAKEYAMA
IPC分类号： H01L23/02
CPC分类号： H01L23/26 , B81B7/0038 , B81C1/00285 , H01L23/04 , H01L2224/48091 , H01L2924/01079 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An airtight sealed package with a device sealed therein in an airtight manner under vacuum, the device being placed in a space defined in the airtight sealed package by a lid and a substrate, includes at least one pressure adjustment unit provided on at least one of the lid and the substrate, and configured to receive energy from an outside of the airtight sealed package, with the device sealed in the airtight manner in the airtight sealed package, to adjust pressure in the space. An energy transmission member transmits the energy to the pressure adjustment unit.
摘要翻译：一种气密密封的包装，其中在真空下以气密的方式密封其中的装置，该装置通过盖和基底放置在限定在气密密封包装中的空间中，包括至少一个压力调节单元，设置在至少一个并且构造成从气密密封包装的外部接收能量，其中该装置以气密密封的方式密封在气密密封包装中，以调节空间中的压力。能量传递构件将能量传递到压力调节单元。

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