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1. 发明授权

US08203157B2 Light emitting device having heat generating color conversion members 有权
标题翻译：具有发热颜色转换构件的发光装置
公开(公告)号：US08203157B2
公开(公告)日：2012-06-19
申请号：US12736240
申请日：2009-03-26
申请人： Tomonori Suzuki , Kenichiro Tanaka , Youji Urano
发明人： Tomonori Suzuki , Kenichiro Tanaka , Youji Urano
IPC分类号： H01L29/20 , H01L33/00 , H01L29/201 , H01L29/22 , H01L29/227 , H01L31/00
CPC分类号： H01L33/504 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： A lighting device including an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member including a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member including a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.
摘要翻译：一种照明装置，包括具有发光表面的LED芯片，并且被配置为从所述发光表面发射光;安装基板，其被配置为安装所述LED芯片;第一颜色转换构件，包括第一透光材料和第一荧光体，第一荧光体被从LED芯片发射的光激励，从而发出比从LED芯片发射的光的波长长的波长的第一光，第一颜色转换部件直接配置在所述LED芯片的发光面上的第二颜色转换构件，包括第二透光性材料和第二荧光体的第二颜色转换构件，所述第二荧光体被从所述LED芯片发射的光激励，从而发出具有比从LED芯片发射的光的波长长的波长，第二颜色转换部件成形为具有圆顶状 pe，其中所述LED芯片和所述第一颜色转换构件设置在所述安装基板和所述第二颜色转换构件之间。

2. 发明申请

US20110006323A1 LIGHTING DEVICE 有权
标题翻译：照明设备
公开(公告)号：US20110006323A1
公开(公告)日：2011-01-13
申请号：US12736240
申请日：2009-03-26
申请人： Tomonori Suzuki , Kenichiro Tanaka , Youji Urano
发明人： Tomonori Suzuki , Kenichiro Tanaka , Youji Urano
IPC分类号： H01L33/48
CPC分类号： H01L33/504 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： A lighting device comprising an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member comprising a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member comprising a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.
摘要翻译：一种照明装置，包括具有发光表面的LED芯片，并且被配置为从所述发光表面发射光，安装基板被配置为安装所述LED芯片，第一颜色转换部件包括第一透光材料和第一荧光体，第一荧光体被从LED芯片发射的光激励，从而发出比从LED芯片发射的光的波长长的波长的第一光，第一颜色转换部件直接配置在所述LED芯片的发光面上的第二颜色转换构件，包括第二透光材料和第二荧光体，所述第二荧光体被从所述LED芯片发射的光激励，从而发出第二光，所述第二光具有所述波长比从所述LED芯片发射的光的波长长，所述第二颜色转换构件被成形为具有圆顶形状，形状，其中所述LED芯片和所述第一颜色转换构件设置在所述安装基板和所述第二颜色转换构件之间。

3. 发明申请

US20100200887A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20100200887A1
公开(公告)日：2010-08-12
申请号：US12733399
申请日：2008-08-28
申请人： Youji Urano , Kenichiro Tanaka
发明人： Youji Urano , Kenichiro Tanaka
IPC分类号： H01L33/50
CPC分类号： H01L33/508 , H01L33/38 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting device including a thinned color conversion layer which emits a light with a minimized color ununiformity. The light emitting element includes an LED chip, a color conversion layer. The color conversion layer is made of a light-transmissive material containing a phosphor. The phosphor is excited by a light emitted from the LED chip to emit a light of a color having a wavelength longer than that of a luminescent color of the LED chip. The LED chip is provided at its top surface with a frame-shaped electrode which extends along its edge. The color conversion layer is formed on the top surface of the LED chip at an area surrounded by the frame-shaped electrode.
摘要翻译：一种发光装置，其包括以最小的颜色不均匀性发出光的变薄的颜色转换层。发光元件包括LED芯片，颜色转换层。颜色转换层由含有荧光体的透光材料制成。荧光体被从LED芯片发出的光激发，发出比LED芯片的发光颜色波长长的颜色的光。 LED芯片在其顶表面处设置有沿其边缘延伸的框状电极。在由框状电极包围的区域的LED芯片的顶面上形成有颜色转换层。

4. 发明申请

US20100207135A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20100207135A1
公开(公告)日：2010-08-19
申请号：US12733402
申请日：2008-08-28
申请人： Takanori Aketa , Youji Urano , Tomonori Suzuki
发明人： Takanori Aketa , Youji Urano , Tomonori Suzuki
IPC分类号： H01L33/48
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device free from void-generation at a bonding between an LED chip and a metal layer provided on a dielectric substrate. This light emitting device is also free from short-circuit between the closely arranged LED chips. This light emitting device includes a plurality of the LED chips, one dielectric substrate (sub-mount member) which is made of a dielectric substrate for holding the LED chips. The dielectric substrate is formed with a plurality of supporting platforms which respectively holds the LED chips. Each supporting platform is provided with a metal layer which is soldered to the LED chip. The supporting platforms are configured to leave a groove between the adjacent ones of the supporting platforms. Each supporting platform is provided at its side surface with a solder-leading portion made of a material having a solder-wettablity higher than that of the supporting platform.
摘要翻译：在LED芯片和设置在电介质基板上的金属层之间的接合处不发生空隙的发光器件。该发光器件在紧密排列的LED芯片之间也没有短路。该发光装置包括多个LED芯片，由用于保持LED芯片的电介质基板制成的一个电介质基板（副安装构件）。电介质基板形成有分别保持LED芯片的多个支撑平台。每个支撑平台设有焊接到LED芯片的金属层。支撑平台被配置为在相邻的支撑平台之间留下凹槽。每个支撑平台在其侧表面上设置有由焊料可润湿性高于支撑平台的材料制成的焊料引导部分。

5. 发明授权

US08664674B2 Light emitting diode device preventing short circuiting between adjacent light emitting diode chips 有权
标题翻译：发光二极管器件防止相邻发光二极管芯片之间的短路
公开(公告)号：US08664674B2
公开(公告)日：2014-03-04
申请号：US12733402
申请日：2008-08-28
申请人： Takanori Aketa , Youji Urano , Tomonori Suzuki
发明人： Takanori Aketa , Youji Urano , Tomonori Suzuki
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device free from void-generation at a bonding between an LED chip and a metal layer provided on a dielectric substrate. This light emitting device is also free from short-circuit between the closely arranged LED chips. This light emitting device includes a plurality of the LED chips, one dielectric substrate (sub-mount member) which is made of a dielectric substrate for holding the LED chips. The dielectric substrate is formed with a plurality of supporting platforms which respectively holds the LED chips. Each supporting platform is provided with a metal layer which is soldered to the LED chip. The supporting platforms are configured to leave a groove between the adjacent ones of the supporting platforms. Each supporting platform is provided at its side surface with a solder-leading portion made of a material having a solder-wettablity higher than that of the supporting platform.
摘要翻译：在LED芯片和设置在电介质基板上的金属层之间的接合处不发生空隙的发光器件。该发光器件在紧密排列的LED芯片之间也没有短路。该发光装置包括多个LED芯片，由用于保持LED芯片的电介质基板制成的一个电介质基板（副安装构件）。电介质基板形成有分别保持LED芯片的多个支撑平台。每个支撑平台设有焊接到LED芯片的金属层。支撑平台被配置为在相邻的支撑平台之间留下凹槽。每个支撑平台在其侧表面上设置有由焊料可润湿性高于支撑平台的材料制成的焊料引导部分。

6. 发明申请

US20120032203A1 LED UNIT 有权
标题翻译： LED单元
公开(公告)号：US20120032203A1
公开(公告)日：2012-02-09
申请号：US13264188
申请日：2010-04-13
申请人： Youji Urano
发明人： Youji Urano
IPC分类号： H01L33/62
CPC分类号： F21V29/70 , F21K9/00 , F21V19/0015 , F21V19/045 , F21V29/58 , F21V29/83 , H01L33/486 , H01L33/62 , H01L33/642 , H01L33/648 , H01L2924/0002 , H05K1/0203 , H05K1/117 , H05K3/0061 , H05K2201/09745 , H05K2201/10106 , H05K2201/10446 , H01L2924/00
摘要： The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.
摘要翻译： LED单元100包括多个LED模块1和散热板。每个LED模块1包括LED芯片和用于将LED芯片并入其中的封装; 该封装具有电绝缘性能。每个包装件包括位于LED芯片和散热板之间并具有导热性的子安装构件; 这些是整体形成的。 LED模块布置在散热板的第一表面上。该结构使得LED单元有可能将LED芯片10中的热量有效地分散到散热板。

7. 发明授权

US07956372B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07956372B2
公开(公告)日：2011-06-07
申请号：US12067194
申请日：2005-12-28
申请人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
发明人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.
摘要翻译：发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。

8. 发明申请

US20080258164A1 Light Emitting Device 有权
标题翻译：发光装置
公开(公告)号：US20080258164A1
公开(公告)日：2008-10-23
申请号：US12094143
申请日：2005-12-28
申请人： Mikio Masui , Youji Urano
发明人： Mikio Masui , Youji Urano
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/507 , H01L33/52 , H01L33/64 , H01L2224/73265 , H01L2924/19107 , H01L2933/005
摘要： Light emitting device 1 includes an LED chip 10, a mounting substrate 20 carrying the LED chip, a dome-shaped color conversion member 70, and encapsulation member 50. Color conversion member 70 is molded from a transparent resin material and a fluorescent material which is excited by a light emitted from the LED chip to emit a light of a color different from a luminescent color of the LED chip, and is bonded to the mounting substrate to surround LED chip 10. Encapsulation member 50 is made of an encapsulation resin material to encapsulate LED chip 10 and bonding wires 14 within a space confined between mounting board 20 and color conversion member 70. Encapsulation member 50 is of a convex-shape to have its light output surface 50b kept in an intimate contact with an internal surface of color conversion member 70. Since the intimate contact between the convex-lens shaped encapsulation member 50 and the color conversion member is made without the use of a conventional frame, the light emitting device can restrain the generation of voids in the encapsulation member, and therefore give improved reliability. Moreover, the light output efficiency is also improved.
摘要翻译：发光装置1包括LED芯片10，承载LED芯片的安装基板20，圆顶状颜色转换部件70和封装部件50。颜色转换构件70由透明树脂材料和由LED芯片发出的光激发以发射与LED芯片的发光颜色不同的颜色的荧光材料，并且被结合到安装基板以围绕LED芯片10。封装构件50由封装树脂材料制成，以将LED芯片10和接合线14封装在限制在安装板20和颜色转换构件70之间的空间内。封装构件50具有使其光输出表面50b保持与颜色转换构件70的内表面紧密接触的凸形。由于在不使用传统的框架的情况下制造凸透镜形密封构件50和颜色转换构件之间的紧密接触，所以发光装置可以抑制密封构件中的空隙的产生，从而提高可靠性。此外，光输出效率也得到提高。

9. 发明申请

US20090267093A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20090267093A1
公开(公告)日：2009-10-29
申请号：US12067194
申请日：2005-12-28
申请人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
发明人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.
摘要翻译：发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。

10. 发明申请

US20090026485A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20090026485A1
公开(公告)日：2009-01-29
申请号：US11993956
申请日：2006-06-30
申请人： Youji Urano , Takuya Nakatani , Yasuhiro Hidaka
发明人： Youji Urano , Takuya Nakatani , Yasuhiro Hidaka
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , F21K9/00 , F21V21/30 , F21Y2105/00 , F21Y2115/10 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.
摘要翻译：本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

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