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    • 5. 发明申请
    • MONOLITHIC ELECTRONIC COMPONENT
    • 单电子元件
    • US20080128860A1
    • 2008-06-05
    • US12029613
    • 2008-02-12
    • Takashi SAWADAKenjiro HADANO
    • Takashi SAWADAKenjiro HADANO
    • H01L29/00
    • H01G4/30H01G4/232H01G4/2325
    • In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having the resistor film via electroplating in an efficient manner and with a uniform film thickness. In order to form the terminal electrode, the resistor film is disposed directly on the surface of the component body, and a conductive resin film having a relatively low volume resistivity is disposed over the resistor film. The conductive resin film is preferably adapted to have a specific resistance of less than about 1×10−4 Ω·m, on which a plating film having a uniform film thickness can be formed efficiently via electroplating.
    • 在通过在端子电极上形成电阻膜而并入电阻元件的单片电子部件中,可以通过电镀以具有均匀膜厚度的电镀形成具有电阻膜的端子电极上的电镀膜。 为了形成端子电极,电阻膜直接配置在组件体的表面上,并且具有较低体积电阻率的导电树脂膜设置在电阻膜上。 导电树脂膜优选地具有小于约1×10 -4Ω的电阻率,其上可以通过电镀有效地形成具有均匀膜厚的镀膜。